T5838 TDK | Alldatasheet

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Bottom Port PDM Digital Output Multi-Mode Microphone TDK, Inc. reserves the right to change specifications and information herein without notice unless the product is in mass production and the datasheet has been designated by TDK in writing as subject to a specified Product / Process Change Notification Method regulation. TDK Corporation 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.tdk.com Document Number: DS-000383 Revision: 1.1 Release Date: 4/21/2023 GENERAL DESCRIPTION The T5838 is a multi-mode, low noise digital MEMS microphone in a small package. The T5838 consists of a MEMS microphone element and an impedance converter amplifier followed by a fifth order Σ-Δ modulator. The digital interface allows the pulse density modulated (PDM) output of two microphones to be time multiplexed on a single data line using a single clock. The T5838 has multiple modes of operation: High Quality, Low-Power (AlwaysOn), Ultrasonic, and Sleep along with new AlwaysOn modes: Acoustic Activity Detect (AAD) Analog and Digital. The T5838 has high SNR in all operational modes. It has 133 dB SPL AOP in High Quality Mode and 119 dB SPL AOP in Low-Power mode. The T5838 is available in a standard 3.5 × 2.65 × 0.98 mm surface-mount package. It is reflow solder compatible.

APPLICATIONS

  • Smartphones
  • IP Cameras
  • Voice Activated TV Remote Controls
  • Microphone Arrays
  • Home Security Glass Break Detect
  • Voice Activated Wearables
  • Voice Activated Home Automation

FEATURES

Sensitivity −41 dB FS ±1 dB −26 dB FS ±1 dB −41 dB FS ±1 dB SNR 68 dBA 65 dBA 68dBA Current 310 µA 120 µA 500 µA AOP 133 dB SPL 119 dB SPL 133 dB SPL Clock 2.0 MHz to 3.7 MHz 400 kHz to 800 kHz 4.2 MHz to 4.8 MHz

  • 3.5 × 2.65 × 0.98 mm surface-mount package
  • Extended frequency response from 27 Hz to >20 kHz
  • Sleep Mode: 9 µA SCK< 200 kHz, 0.8 uA SCK = Off
  • Acoustic Activity Detect Modes including AAD Analog: 20 uA
  • Fifth order Σ-Δ modulator
  • Digital pulse density modulation (PDM) output
  • Compatible with Sn/Pb and Pb-free solder processes
  • RoHS/WEEE compliant FUNCTIONAL BLOCK DIAGRAM

ORDERING INFORMATION

MMICT5838-00-012 −40°C to +85°C 13” Tape and Reel EV_T5838-FX2 Flex Evaluation Board

Document Number: DS-000383 Revision: 1.1 TABLE OF CONTENTS

Document Number: DS-000383 Revision: 1.1

Document Number: DS-000383 Revision: 1.1

Table 1. Acoustic/Electrical Characteristics – General Table 2. Acoustic/Electrical Characteristics – High Quality Mode

Table 3. Acoustic/Electrical Characteristics – Low Power Mode Table 4. Acoustic/Electrical Characteristics – Ultrasonic Mode TA = 25°C, VDD = 1.8 V, SCK = OFF, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. Table 5. Acoustic/Electrical Characteristics – AAD Modes

TA = 25°C, VDD = 1.8 V unless otherwise noted. Typical specifications are not guaranteed. Table 6. Digital Input/Output Characteristics TA = 25°C, VDD = 1.8 V, unless otherwise noted. Typical specifications are not guaranteed. Table 7. PDM Digital Input/Output

Figure 1. Pulse Density Modulated Output Timing

absolute maximum ratings conditions for extended periods may affect device reliability. Table 8. Absolute Maximum Ratings ESD (electrostatic discharge) sensitive device. devices subjected to high energy ESD.

Figure 2. Recommended Soldering Profile Limits Note: After 3 reflows, microphone sensitivity may deviate by up to 2 dB. Table 9. Recommended Soldering Profile

  1. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 3. Pin Configuration (Top View, Terminal Side Down)

1 DATA Digital Output Signal (DATA1 or DATA2)

2 SELECT

3 GND Ground

4 WAKE

For operation without AAD modes, this pin can be tied to Gnd or left as No Connect. 5 THSEL Threshold Select Input Pin. Used to both enable and configure AAD Modes. For operation without AAD modes, this pin can be tied to Gnd or left as No Connect.

6 CLK Clock Input to Microphone

7 VDD

Table 10. Pin Function Descriptions

  • Device Address + RW 7’b1010011 (Constant for this device) + 1’b0 (0 rite, constant for this device)
  • Register Address = 8-bit value, determined by AAD function lookup table
  • Data = 8-bit value, determined by AAD function lookup table Example of AAD total write sequence: Device Address+R/W Register Address Register Data Example Write: Device Addr+R/W = 10100110 (Constant for this device) Register Address = 00000001 (Example Reg Addr only, not an option) Register Data = 00000010 (Example data) CLK = 100kHz TCLK = 10us The write calculations based on 100kHz CLK, 10 CLK cycle PILOT are shown below: 5.11. EXAMPLE ONE WIRE WRITE SYMBOL NAME DESCRIPTION THSEL CONDITION CALCULATION WIDTH Start/Pilot Start/Pilot which indicates start of write and defines logic pulse widths HIGH 10 X TCLK 100us = TP Zero Single bit Zero HIGH 1 x TP 100us One Single bit One HIGH 3 x TP 300us Stop Stop Signal HIGH >128 x CLK period >1280us Space Separate individual symbols above LOW 1 x TP 100us

Table 13. Example One Wire Write Figure 21. Timing diagram for example above showing relationship between THSEL pilot and CLK

Figure 22. Expanded Timing diagram example showing start, 3 x 8 bit values and stop being written to the device, with the low level translation of each bit to their respective symbols. Table 14. AAD Enable Sequence Writes

Figure 23. AAD A Threshold level and WAKE pin activation from 60 dB SPL to 97.5 dB SPL. Table 15. AAD A Registers On AAD A enabling, the microphone will acknowledge by pulsing the WAKE pin HIGH for about 12 us. All levels, frequencies, and timing values in the AAD A and AAD D configuration sections are typical. Table 16. AAD A LPF Values

Table 17. AAD A TH Values

  1. Apply Vdd, apply CLK > 50 kHz
  2. Apply AAD Unlock write sequence:
  3. Configure AAD A settings, AAD A_LPF = 0x1 (4.4kHz), AAD A_TH = 0x4 (70 dB SPL)

The microphone will acknowledge the enable by pulsing the WAKE pin HIGH for about 12 us.

  1. Activate AAD A by setting CLK to a frequency between 50 kHz and 200 kHz for 2 ms followed by setting

Table 18. AAD A Register Map applied via one wire writes on the THSEL pin and the output is shown as activity on the WAKE pin. Digital Acoustic Activity Detect (AADD). 0x1 = AAD D1 Enable, 0x2 = AAD D2 Enable. Default = 0x0 (AAD D1, D2 both disabled). Table 19. AADD Registers

On AAD D enabling, the microphone will acknowledge by pulsing the WAKE pin HIGH for about 12 us. The functionality of the AADD mode registers is shown diagrammatically in Figure 24 below. Figure 24. AADD Parameter Visualization pulls WAKE low when the stimulus drops below the defined conditions. minimum pulse duration to help distinguish voice from background sound. addresses 0x32 and 0x31). The allowed range of values is 0x00F to 0x7BC. Note: Values below 0xF or above 0x7BC are not supported or recommended. Table 20. Absolute Threshold Values

  • If the incoming SPL is less than the Floor + Relative Threshold -> The Instantaneous Threshold is fixed and is calculated from Floor + Relative Threshold
  • If the incoming SPL is greater than the Floor + Relative Threshold -> The Instantaneous Threshold is dynamic and is calculated from Established SPL + Relative Threshold See Figure 25 for a graphical illustration.

Figure 25. Relative Threshold with floor indicated Table 21. Relative Threshold Values

AADD_REL_TH register is 0x24 to 0xFF. For example, with AADD_FLOOR[12:0] = 0xFF (255d) the threshold level will be 69dB SPL. Note: Values below 0xF or above 0x7BC are not supported or recommended. Table 22. Floor Values (AADD_ABS_PULSE_MIN[11:0] at Reg0x2F[7:4] and Reg0x30[7:0]). unresponsive behavior for the relative algorithm.

Table 23. Minimum Pulse Duration

  1. Apply Vdd, apply CLK > 50 kHz
  2. Apply AAD Unlock write sequence:
  3. Apply AAD D settings, ABS_TH = 0x113 (70dB SPL), FLOOR = 0x16 (45dB SPL), RE_TH = 0x24 (+3dB),

Document Number: DS-000383 Revision: 1.1 The microphone will acknowledge the enable by pulsing the WAKE pin HIGH for about 12 us. 5. Activate AAD D1 by setting CLK = 768 kHz. The microphone will now set the WAKE pin HIGH in response to acoustic stimulus in the voice band above the acoustic threshold. 5.31. AAD D2 EXAMPLE CONFIRGURATION AND ACTIVATION SEQUENCE AAD Digital 2 can be activated with the following sequence of powerup conditions and register writes: 1. Apply Vdd, apply CLK > 50 kHz 2. Apply AAD Unlock write sequence: WRITE # REGISTER ADDRESS (HEX) REGISTER DATA (HEX) 1 0x5C 0x00 2 0x3E 0x00 3 0x6F 0x00 4 0x3B 0x00 5 0x4C 0x00 3. Apply AAD D settings, ABS_TH = 0x113 (70dB SPL), FLOOR = 0x16 (45dB SPL), RE_TH = 0x24 (+3dB), REL_PULSE_MIN = 0x0, ABS_PULSE_MIN = 0 (same as previous example configuration) WRITE # REGISTER ADDRESS (HEX) REGISTER DATA (HEX) 6 0x31 0x13 (ABS_TH LSBs) 7 0x32 0x01 (ABS_TH MSBs) 8 0x36 0x04 9 0x2B 0x24 10 0x2E 0x00 11 0x30 0x00 4. Enable AAD D2 WRITE # REGISTER ADDRESS (HEX) REGISTER DATA (HEX) 12 0x29 0x01 The microphone will acknowledge the enable by pulsing the WAKE pin HIGH for about 12 us. 5. Activate AAD D2 by setting CLK to a frequency between 50 kHz and 200 kHz for 2 ms followed by setting CLK = OFF. The microphone will now set the WAKE pin HIGH in response to acoustic stimulus in the voice band above the acoustic threshold.

pin is sampled at power-up and should not be changed during operation. (dc) audio signal shows an alternating pattern of high and low pulses. FS; however, this is not true because of the definition of the 0 dB FS sine wave. Figure 28. 1 kHz, 0 dB FS Sine Wave sine wave has peaks at 0.05 D. Table 25. T5838 Channel Setting

Figure 30. Stereo PDM Microphone Connection to Codec circuit board (PCB) layout allows. during the period that the signal line is tristated.

Figure 31. Buffered Connections Between Stereo T5838s and a Codec output, a buffer may still be needed. when the T5838 outputs data within 0.5 dB of its settled sensitivity. enabled until sensitivity of the output signal is within 0.5 dB of its settled sensitivity.

Document Number: DS-000383 Revision: 1.1 8. SUPPORTING DOCUMENTS For additional information, see the following documents. 8.1. APPLICATION NOTES – GENERAL AN-000277, T5838 Flex EVB User Guide AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming AN-000298, T583x MEMS Microphone Acoustic Activity Detect User Guide

Document Number: DS-000383 Revision: 1.1 9.1. PCB MATERIAL AND THICKNESS The performance of the T5838 is not affected by PCB thickness. The T5838 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing wit h an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. 10. HANDLING INSTRUCTIONS 10.1. PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows:

  • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid su rface.
  • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
  • Do not pull air out of or blow air into the microphone port.
  • Do not use excessive force to place the microphone on the PCB. 10.2. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 9. T5838 devices have MSL (Moisture Sensitivity Level) rating 1, appropriate JESD22-A113 guidelines should be followed to avoid damaging the part. 10.3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning.
  1. RELIABILITY SPECIFICATIONS

Early Life Failure Rate (ELFR) JEDEC JESD22-A108 Tj ≥ 125°C, VDD max, 48 hrs. JEDEC JESD22-A108 Tj ≥ 125°C, VDD max, 1000 hrs. JESD22-A113 MSL 1 preconditioning. 1.5 kV, 2.0 kV, All pins, 1 zap per polarity. ESD Charged Device Model (ESD-CDM) JESD22-C101 250 V, 500 V, Std. Sample, 1 zap per polarity. Latch-up (LU) JEDEC JESD-78 Iinj = ± 100 mA; Vos = 1.5*Vdd max at 85°C, Class II.

20 Hz-2 kH , ≥4 min/cycle, 4 cycles, 50 g peak

Random Drop (RD) AEC-Q100, Test G5 18 free-fall drops from 1.2 m on concrete surface. Note: Microphone sensitivity variations shall not exceed 3 dB over the lifetime of the device. Table 26. Reliability Specifications

Document Number: DS-000383 Revision: 1.1 13. ORDERING GUIDE PART TEMP RANGE PACKAGE QUANTITY PACKAGING MMICT5838-00-012 −40°C to +85°C 5-Terminal LGA_CAV 10,000 13” Tape and Reel EV_T5838-FX2 - Flex Evaluation Board -

Document Number: DS-000383 Revision: 1.1 14. REVISION HISTORY REVISION DATE REVISION DESCRIPTION 6/11/2022 1.0 Initial version 4/21/2023 1.1 Added Reliability Spec. Table; Updated AAD section.

Document Number: DS-000383 Revision: 1.1 15. COMPLIANCE DECLARATION DISCLAIMER TDK believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. TDK subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by TDK. This information furnished by TDK, Inc (“TDK”) is believed to be accurate and reliable. However, no responsibility is assumed by TDK for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. TDK reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/o r performance, without prior notice. TDK makes no warranties, neither expressed nor implied, regarding the information and specific ations contained in this document. TDK assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damag es based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by TDK and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of TDK. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. TDK sensors should not be used or sold in the deve lopment, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace a nd nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2022 TDK. All rights reserved. TDK, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the TDK logo are trademarks of TDK, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated. ©2022 TDK. All rights reserved.