T4FC1210DF TRANSKO | Alldatasheet
Document overview
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- PDF pages: 5
Technical content
Rev 2: 09 -04 -2019 Common Mode Choke SMD (1.2 X 1.0 X 0.9mm)
- High common mode impedance at high frequency
- Ideal for use as common -mode chokes for USB1.1/USB2.0/IEEE 1394 interface
- Halogen Free RoHS compliant
FEATURES
- excellent noise suppression performance SPECIFICATION T4FC1210DF -150 15 @ 100MHz 25 300 20 10 0.30 T4FC1210DF -250 25 @ 100MHz 25 300 20 10 0.30 T4FC1210DF -400 40 @ 100MHz 25 300 20 10 0.35 T4FC1210DF -500 50 @ 100MHz 25 300 20 10 0.40 T4FC1210DF -900 90 @ 100MHz 25 280 20 10 0.50 Common Mode Tolerance Rated Current Rated Voltage Insulation DC Resistance Part No. Impedance typ. (Ω) Max (%) (mA) ( Ω) Ω) SCHEMATIC
- Electrical measurements at ambient temperature of 20°C
- Test equipment: HP4291A DIMENSION SOLDER PATTERN
Rev 2: 09 -04 -2019 CHARACTERISTICS T4FC1210CF -150 T4FC1210CF -400 T4FC1210CF -250 T4FC1210CF -500 T4FC1210CF -900
Rev 2: 09 -04 -2019 Operating temperature : -40 to +85°C Storage temp and humidity : -40~85°C ,60% RH max ITEM SPECIFICATIONS TEST CONDITIONS Solderability The metalized area must have 90% minimum solder coverage. Dip pads in flux and dip in solder pot (99 Sn or 96.5 Sn/3.5 Ag solder) at 232°C ±5°C. Resistance to soldering heat There must be no case deformation or change in dimensions. Inductance must not change more than the stated tolerance. Inductors shall be reflowed onto a PC board using 96.5 Sn/3.5 Ag or 99 Sn solder paste. Solder process shall be at a maximum temperature of 260°C. For 99 Sn solder paste: >183°C for 120 sec. For 96.5 Sn/3.5 Ag solder paste: >217°C for 90 sec Vibration There must be no case deformation or change in dimensions. Inductance must not change more than the stated tolerance. Solder specimen inductor on the test printed circuit board. Apply vibrations in each of the x,y and z directions for 2 house for a total of 6 hours. Frequency : 10~50 Hz ; Amplitude : 1.5mm High temperature resistance There must be no case deformation or change in dimensions. Inductance must not change more than the stated tolerance. Inductors shall be subjected to temperature 125±2°C for 500±12 hours. Measure the test items after leaving the inductors at room temperature and humidity for 2 hours. Static Humidity Inductors must not have a shorted or open winding. Inductors shall be subjected to temperature 85±2°C and 90 to 95%RH. for ten 24 -hours. Measure the test items after leaving the inductors at room temperature and humidity for 2 hours. Component adhesion (push test) Inductors shall be subjected to 1.8Kg Inductors shall be reflow soldered (232°C ±5°C for 10 seconds) to a tinned copper substrate. A force gauge shall be applied to the side of the component. The device must withstand the stated force without a failure of the termination. Low temperature storage There must be no case deformation or change in dimensions. Inductance must not change more than the stated tolerance. Inductors shall be subjected to temperature -40±2°C for 48±12 hours. Measure the test items after leaving the inductors at room temperature and humidity for 1 to 2hours. Resistance to solvent There must be no case deformation or change in dimensions, or obliteration of marking Inductors must withstand 6 minutes of alcohol or water. Thermal shock There must be no case deformation or change in dimensions. Inductance must not change more than the stated tolerance. Inductors shall be subjected to 10 cycles to the following temperature cycle: Measure the test items after leaving the inductors at room temperature and humidity for 2 hours. RELIABILITY TEST
Rev 2: 09 -04 -2019 Transko Electronics, Inc reserves the right to make changes to the product (s), service (s), and specification (s) described herein without notice. See “Terms of Sale” for details on our website. LEAD -FREE HEAT ENDURANCE TEST LEAD -FREE RECOMMENDED REFLOW
Rev 2: 09 -04 -2019 REEL DIMENSIONS (3000 pcs per reel) mm A 180 B 60 C 13 +0.5 / -0.2 D 14.4 E 8.4