T30LMPSR165 ONSEMI | Alldatasheet
Document overview
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Technical content
Figure 3. Simplified Schematic Block Diagram A2 OUT Regulated output voltage. The output should be bypassed with small 1 /C0109F ceramic capacitor. B1 EN Chip enable: Applying VEN < 0.3 V disables the regulator, Pulling VEN > 0.825 V enables the LDO. should not be assumed, damage may occur and reliability may be affected.
- Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
- This device series incorporates ESD protection and is tested by the following methods:
- The common grey zones (Device working in grey zone is functional but parameters from ELECTRICAL CHARACTERISTICS table are not
The range between max operating supply and abs_max.
- Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51 −7
T30LMPSR165, T30LAPSR165 www.onsemi.com
ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.1 V or 1.4 V, whichever is greater; IOUT = 1 mA; CIN = COUT = 1 /C0109F eff., unless otherwise noted. VEN = 1 V. Typical values are at TJ = +25°C (Note 5)) Parameter Test Conditions Symbol Min Typ Max Unit Operating Input Voltage VIN 1.4 − 3.3 V Output Voltage Accuracy IOUT = 1 mA to 300 mA VOUT(NOM) ≤ 1.4 V VOUT −15 − +15 mV VOUT(NOM) > 1.4 V −1 − +1 % Line Regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.3 V, (VIN ≥ 1.4 V) LineReg − 0.02 − %/V Load Regulation IOUT = 1 mA to 300 mA LoadReg − 0.001 − %/mA Dropout Voltage (Note 6) VOUT(NOM) = 2.85 V IOUT = 300 mA VDO − 26 70 mV Current Limit VOUT = 90% x VOUT(NOM) ICL 325 570 − mA Quiescent Current IOUT = 0 mA IQ − 240 300 /C0109A Shutdown Current VEN ≤ 0.285 V TJ ≤ 85°C ISHUT − 0.01 1 /C0109A TJ ≤ 125°C − − 3.5 EN Pin Threshold Voltage EN Input Voltage “H” VENH 0.77 − − V EN Input Voltage “L” TJ ≤ 85°C VENL − − 0.325 TJ ≤ 125°C − − 0.285 EN Pull Down Current VEN = 3.3 V IEN − 0.1 0.5 /C0109A Power Supply Rejection Ratio IOUT = 20 mA f = 100 Hz PSRR − 70 − dB f = 1 kHz − 70 − f = 10 kHz − 65 − f = 100 kHz − 50 − Output Voltage Noise f = 10 Hz to 100 kHz VN − 16 − /C0109VRMS Thermal Shutdown Threshold Temperature rising TSDH − 160 − °C Temperature falling TSDL − 140 − °C Active Output Discharge Resistance VEN < 0.285 V RDIS − 280 − /C0087
T30LMPSR165, T30LAPSR165 www.onsemi.com T30LxPSR165CFCT120T2G CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = 1.4 V, VOUT(NOM) = 1.2 V, whichever is greater; IOUT = 1 mA; CIN = COUT = 1 /C0109F eff., unless otherwise noted. VEN = 1 V. Typical values are at TJ = +25°C (Note 5) Parameter Test Conditions Symbol Min Typ Max Unit Delay Time From assertion of VEN to output voltage increase tDELAY − 120 − /C0109s Rise Time VOUT rise from 5% to 95% VOUT(NOM) tRISE − 340 − Turn−on Time From assertion of VEN to VOUT = 95% VOUT(NOM) tON − 500 − T30LxPSR165CFCT200T2G CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = 2.1 V, VOUT(NOM) = 2.0 V, whichever is greater; IOUT = 1 mA; CIN = COUT = 1 /C0109F eff., unless otherwise noted. VEN = 1 V. Typical values are at TJ = +25°C (Note 5) Parameter Test Conditions Symbol Min Typ Max Unit Delay Time From assertion of VEN to output voltage increase tDELAY − 120 − /C0109s Rise Time VOUT rise from 5% to 95% VOUT(NOM) tRISE − 610 − Turn−on Time From assertion of VEN to VOUT = 95% VOUT(NOM) tON − 790 − T30LxPSR165CFCT285T2G CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = 2.95 V, VOUT(NOM) = 2.85 V, whichever is greater; IOUT = 1 mA; CIN = COUT = 1 /C0109F eff., unless otherwise noted. VEN = 1 V. Typical values are at TJ = +25°C (Note 5) Parameter Test Conditions Symbol Min Typ Max Unit Delay Time From assertion of VEN to output voltage increase tDELAY − 120 − /C0109s Rise Time VOUT rise from 5% to 95% VOUT(NOM) tRISE − 820 − Turn−on Time From assertion of VEN to VOUT = 95% VOUT(NOM) tON − 1000 − Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at T A = 25°C. Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible. 6. Dropout voltage is characterized when V OUT falls about 3% below VOUT(NOM).
ORDERING INFORMATION
Output Voltage Marking Rotation Description Package Shipping† T30LMPSR165CFCT110T2G (Consult onsemi sales)
1.10 V TBD TBD
300 mA LDO, with Active Discharge Feature WLCSP4 CASE 567VS (Pb-Free) UBM: 200 /C0109m Bump type: Sn Plate 10000 / Tape & Reel T30LMPSR165CFCT120T2G (Consult onsemi sales)
1.20 V U 0°
(Consult onsemi sales)
1.80 V TBD TBD
(Consult onsemi sales)
2.00 V L 0°
(Consult onsemi sales)
2.80 V TBD TBD
(Consult onsemi sales)
2.85 V Y 0°
È È WLCSP4, 0.64x0.64x0.33 CASE 567VS ISSUE O DATE 25 JAN 2018 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN NOM −−− MILLIMETERS D E b 0.180 0.200 e 0.35 BSC −−− E D A B PIN A1 REFERENCE e A0.03 BC 0.05 C 4X b B A 0.05 C A C 0.04 0.06 SCALE 4:1 TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 e A2 0.23 REF PITCH 0.20 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.35 0.35 RECOMMENDED A1 PACKAGE OUTLINE PITCH MAX 0.610 0.640 0.610 0.640 0.220 0.33 0.08 0.670 0.670 X = Specific Device Code M = Month *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ /C0071”, may or may not be present. Some products may not follow the Generic Marking. GENERIC MARKING DIAGRAM* XM MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON82946GDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1WLCSP4, 0.64X0.64X0.33 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com
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