T1670P VISHAY | Alldatasheet

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Technical content

Document Number: 81999 For tec hnical questions, contact: optochipsupport@vishay.com www.vishay.com Rev. 1.4, 23-Mar-11 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Silicon PIN Photodiode T1670P Vishay Semiconductors

DESCRIPTION

T1670P ambient light sensor chip is a PIN photodiode with 0.27 mm 2 sensitive area, high speed and high photo sensitivity. It is sensitive to visible light much like the human eye and has peak sensitivity at 560 nm. Anode is the bond pad on top, cathode is the backside contact.

FEATURES

  • Package type: chip
  • Package form: single chip
  • Dimensions (L x W x H in mm): 0.72 x 0.72 x 0.28
  • Wafer diameter (in mm): 100
  • Radiant sensitive area (in mm 2): 0.27
  • Peak wavelength 560 nm
  • High photo sensitivity
  • High radiant sensitivity
  • Suitable for visible light
  • Fast response times
  • Angle of half sensitivity:  = ± 60°
  • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC

APPLICATIONS

  • Ambient light sensor
  • Backlight dimmer GENERAL INFORMATION The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is provided for illustration purpose only. Customers are encouraged to perform testing in actu al proposed packaged and used conditions. Vishay optoelectronics die products are tested us ing Vishay optoelectronics based quality assurance procedures and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore sold die may not perform on an equivalent basis to standard package products. Note
  • Test conditions see table “Basic Characteristics” Note
  • MOQ: minimum order quantity 21667 A PRODUCT SUMMARY COMPONENT Ira (nA)  (deg) 0.5 (nm) T1670P 138 ± 60 390 to 800

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM T1670P-SD-F Wafer sawn on foil with disco frame MOQ: 55 000 pcs Chip ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 16 V Junction temperature T j 100 °C Operating temperature range T amb - 40 to + 100 °C Storage temperature range T stg1 - 40 to + 100 °C Storage temperature range on foil T stg2 - 40 to + 50 °C

www.vishay.com For technica l questions, contact: optochipsupport@vishay.com Document Number: 81999 2 Rev. 1.4, 23-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1670P Vishay Semiconductors Silicon PIN Photodiode Notes

  • The measurements are based on samples of die which are mounted on a TO-header without resin coating BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 1 - Diode Capacitance vs. Reverse Voltage Fig. 2 - Relative Spectral Sensitivity vs. Wavelength BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Breakdown voltage I R = 100 μA, E = 0 V (BR) 16 V Reverse dark current V R = 10 V, E = 0 I ro 0.1 2 nA Diode capacitance V R = 3 V, f = 1 MHz, E = 0 C D 28 pF Reverse light current EV = 100 lx, CIE illuminant A, VR = 5 V Ira 138 nA Angle of half sensitivity  ± 60 deg Wavelength of peak sensitivity p 560 nm Range of spectral bandwidth 0.5 390 to 800 nm Rise time VR = 5 V, RL = 50 ,  = 515 nm tr 100 ns Fall time VR = 5 V, RL = 50 ,  = 515 nm tf 100 ns 20094 01 0 2 0 3 0 V R - Reverse Voltage (V) CD - Diode Capacitance (pF) E0 = 0 f = 1 MHz 21741 λ - Wavelength (nm) S(λ)rel - Relative Spectral Sensitivity 0.0 0.2 0.4 0.6 0.8 1.0 400 500 600 700 800 900 1000 1100 MECHANICAL DIMENSIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Length of chip edge (x-direction) L x 0.72 mm Length of chip edge (y-direction) L y 0.72 mm Sensitive area A S 0.27 mm 2 Wafer diameter D 100 mm Die height H 0.265 0.28 0.295 mm Bond pad anode x * y 0.125 x 0.11 mm

Document Number: 81999 For tec hnical questions, contact: optochipsupport@vishay.com www.vishay.com Rev. 1.4, 23-Mar-11 3 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 T1670P Silicon PIN Photodiode Vishay Semiconductors Note (1) All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870. The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip backside is performed with stereo microscope with incident light and 40x to 80x magnification. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM is not installed. HANDLING AND STORAGE CONDITIONS

  • The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
  • Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263.
  • Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used. PACKING Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers are arranged to stacks and hermeti cally sealed in plastic bags to ensure protection against environmental influence (humidity and contamination). Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for packing material that is returned unsorted or which we are not obliged to accept. ADDITIONAL INFORMATION (1) Frontside metallization, anode AlSi Backside metallization, cathode NiV-Ag Dicing Sawing Die bonding technology Epoxy bonding

Document Number: 91000 www.vishay.com Revision: 11-Mar-11 1 Disclaimer Legal Disclaimer Notice Vishay ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA AR E SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectivel y, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, incl uding without limitation specia l, consequential or incidental dama ges, and (iii) any and all impl ied warranties, including warran ties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of pro ducts for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in gene ric applications. Such statements are not binding statements about the suitability of products for a partic ular application. It is the customer’s responsibility to validate that a particu lar product with the properties described in th e product specification is su itable for use in a particul ar application. Parameters provided in datasheets an d/or specifications may vary in different applications and perfo rmance may vary over time. All operating parameters, including typical pa rameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s term s and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product co uld result in person al injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and it s distributors harmless from and against an y and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.