T1610T-8G STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

  • 150 °C maximum junction temperature
  • Three quadrants
  • High commutation on resistive loads
  • Surge capability V DSM, VRSM = 900 V
  • Benefits: – Easy direct control by MCU thanks to low 10 mA I GT – Increase of thermal margin due to extended working T j up to 150 °C

Applications

  • General purpose AC line load switching
  • Small home appliances with resistive loads
  • Hybrid relays
  • Inrush current limiting circuits
  • Overvoltage crowbar protection

Description

The SMD T1610T-8G Triac can be used for the on/off or phase angle control function in general purpose AC switching with resistive loads. A Logic level T-series Triac, the T1610T-8G can be controlled directly from an MCU with a simplified circuit. T-series triacs are optimized for high EMI constraints. The surface mount D2PAK package enables compact SMT designs for automated manufacturing. D2PAK package's molding compound resin is halogen-free and meets UL94 flammability standard level V0. Package environmentally friendly Ecopack2 graded (RoHS and Halogen Free compliance). Product status link T1610T-8G Product summary IT(RMS) 16 A VDRM/VRRM 800 V VDSM/VRSM 900 V IGT 10 mA

16 A - 800 V logic level T-series Triac in D²PAK

DS12532 - Rev 3 - October 2020 For further information contact your local STMicroelectronics sales office.

1 Characteristics

Table 1. Absolute maximum ratings (limiting values), Tj = 25 °C unless otherwise specified Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)

  1. Minimum I GT is guaranteed at 5% of IGT max
  2. For both polarities of A2 referenced to A1.

Table 3. Static characteristics

  1. For both polarities of A2 referenced to A1.

Table 4. Thermal resistance

  1. Scu : copper pad surface under tab, 35 μm copper thickness on FR4 PCB.

1.1 Characteristics (curves)

Figure 1. Maximum power dissipation versus on-state Figure 2. On-state RMS current versus case temperature Figure 3. On-state RMS current versus ambient Figure 4. Relative variation of thermal impedance versus Figure 5. Relative variation of gate trigger voltage and Figure 6. Relative variation of holding current and

Figure 13. Thermal resistance junction to ambient versus copper surface under tab

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 D²PAK package information

  • ECOPACK2 compliant
  • Lead-free package leads finishing
  • Molding compound resin is halogen-free and meets UL standard level V0

Figure 14. D²PAK package outline (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.

Package information

Table 5. D²PAK package mechanical data

  1. Dimensions in inches are given for reference only

3 Ordering information

Figure 17. Ordering information scheme Table 6. Ordering information

1000 Tape and reel

Ordering information

DS12532 - Rev 3 page 10/12

Revision history

Table 7. Document revision history 03-Apr-2018 1 Initial release. versus copper surface under tab.