STPS1045DEE_V01 STM | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 9

Technical content

Features

  • Very low conduction losses
  • Negligible switching losses
  • Extremely fast switching
  • Low thermal resistance
  • Avalanche capacity specified
  • High junction temperature capability
  • ECOPACK2 compliant Application
  • Cordless appliance
  • SSD
  • Battery charger
  • Telecom power
  • DC / DC converter
  • Polarity protection
  • Freewheeling

Description

This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.Its low profile was especially designed to be used in applications with space-saving constraints. Product status link STPS1045DEE Product summary Symbol Value IF(AV) 10 A VRRM 45 V Tj (max.) 175 °C VF (typ.) 0.45 V

45 V, 10 A power Schottky rectifier

For further information contact your local STMicroelectronics sales office.

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Table 2. Thermal resistance parameters

  • AN5088: Rectifiers thermal management, handling and mounting recommendations

Table 3. Static electrical characteristics

  • AN604: Calculation of conduction losses in a power rectifier
  • AN4021: Calculation of reverse losses in a power diode STPS1045DEE Characteristics DS9067 - Rev 2 page 2/9

1.1 Characteristics (curves)

Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient Figure 3. Normalized avalanche power derating versus Figure 4. Relative variation of thermal impedance junction Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PowerFLAT 3.3x3.3 mm package information Figure 9. PowerFLAT 3.3x3.3 mm package outline Table 4. PowerFLAT 3.3x3.3 mm mechanical data

Package information

Figure 10. Recommended footprint (dimensions are in mm)

3 Ordering information

Table 5. Ordering information

Ordering information

Revision history

Table 6. Document revision history 18-May-2022 2 Updated package outline PowerFLAT 3.3 x 3.3.

IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved STPS1045DEE DS9067 - Rev 2 page 9/9