STPAC01F1 STMICROELECTRONICS | Alldatasheet

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STPAC01F1® January 2003 - Ed: 1 Flip-Chip package Gnd1 RFin Gnd1 Gnd1 Gnd2 Bias DCout VTemp 321 A B C PIN CONFIGURATION (ball side) n The use of IPAD technology allows the RF front-end designer to save PCB area and to drastically suppress parasitic inductances. BENEFITS RF DETECTOR FOR POWER AMPLIFIER CONTROLIPADTM The STPAC01F1 has two outputs, one for the signal detection and another one for the temperature compensation: n VDCout = 0.88 V at 0.85 GHz at 10 dBm n VDCout = 1.07 V at 1.85 GHz at 10 dBm n Vsupply=5V max. MAIN PRODUCT CHARACTERISTICS The STPAC01 is an integrated RF detector for the power control stage. It converts RF signal coming from the coupler into a DC signal usable by the digital stage. It is based on the use of two similar diodes, one providing the signal detection while the second one is used to provide a temperature information to thermal compensation stage. A biasing stage suppresses the detection diode drop voltage effect. Target applications are cellular phones and PDA using GSM, DCS, PCS, AMPS, TDMA , CDMA and 800MHz to 1900MHz frequency ranges

DESCRIPTION

TM : IPAD is a trademark of STMicroelectronics. Coupler GND2GND1 VDCOut STPAC01F1 RF input VBIAS Vtemp Thermal compensation Low pass filterRF detector FUNCTIONAL DIAGRAM

Symbol Parameter and test conditions Value Unit VBIAS Bias voltage 5V PRF RF power at the RF input 20 dBm FOP Operating frequency range 0.8 to 2 GHz VPP ESD level as per MIL-STD 883E method 3015.7 notice 8 (HBM)100 V TOP Operating temperature range -30 to +85 °C TSTG Storage temperature range -55 to 150 °C ABSOLUTE RATINGS (Tamb = 25°C) Symbol Parameter Test conditions Min. Typ. Max. Unit VBIAS Operating bias voltage 2.2 3.2 V IBIAS Bias current V BIAS = 3.2 V 0.5 mA ELECTRICAL CHARACTERISTICS (Tamb = 25°C) PARAMETERS RELATED TO BIAS VOLTAGE Symbol Parameter Test conditions Min. Typ. Max. Unit VTemp Temperature output voltage (see fig. 6) IDC = 50µA 1.83 1.93 2.03 V ΔVTemp Temperature output voltage variation (see fig. 6) I DC = 50µA,0<T amb <7 0° C 0.09 V IDC = 50µA, 2.2 < VBIAS < 3.2 V 0.44 PARAMETERS RELATED TO TEMPERATURE FUNCTION Symbol Parameter Test conditions Min. Typ. Max. Unit VDCout DC output voltage (see fig. 1, IDC = 50µA) F = 1.85 GHz, PRF =1 0d B m 0.97 1.07 1.17 V F = 1.85 GHz, PRF = -20 dBm 1.83 1.93 2.03 F = 0.85 GHz, PRF =1 0d B m 0.78 0.88 0.98 F = 0.85 GHz, PRF = -20 dBm 1.83 1.93 2.03 ΔVDCout DC output voltage variation (see fig. 5, IDC = 50µA) 0<T amb < 70°C, F = 1.85 GHz, PRF =1 0d B m 0.09 V 2 . 2<VBIAS < 3.2 V, F = 1.85 GHz, PRF =1 0d B m 0.44 PARAMETERS RELATED TO DETECTION FUNCTION ( VBIAS = 2.7 V, DC output load = 100 kΩ )

IDC = 50µA IDC = 50µA STPAC01F1 RF input VBIAS Vtemp Thermal compensation Low pass filterRF detector APPLICATION DIAGRAM The STPAC01 is the first part of the power amplifier stage and provides both RF power and die temperature measurements. The above figure gives the basic circuit of RF detector. A coupler located on the line between RF amplifier output and the antenna takes a part of the available power and applies it to STPAC01 RF input. The RF detector and the low pass filter provide a DC voltage depending on the input power. Thermal compensation provides a DC voltage depending on the ambient temperature. As the detection system and the thermal compensation are based on the same topology, VDCout will have the same temperature variation as Vtemp. Connected to a differential amplifier, the output will be a voltage directly linked to the RF input power. VDCout and Vtemp must be bias with 50µA DC current. This topology offers the most accurate output value as it is 100% compensated. VDCOut IDC RF in VBIAS DC output voltage RF generator Power supply Current generator STPAC test board Multimeter Fig. 1:VDCout measurement circuit. 0.8 1.2 1.4 1.6 1.8 -20 -15 -10 -5 0 5 10 Pin (dBm) VDCout 850MHz 1850MHzTamb = 25°C Ibias = 50µA Vbias = 2.7V Fig. 2:VDCout versus RF input power.

0.9 0.95 1.05 800 825 850 875 900 Frequency in MHz VDCout (Freq.) / VDCOut (850MHz) Fig. 3: Relative variation of VDCout versus frequency (from 800 to 900 MHz). VDCout (Freq.) / VDCOut (850MHz) 0.9 0.95 1.05 1800 1825 1850 1875 1900 Frequency in MHz Fig. 4: Relative variation of VDCout versus frequency (from 1800 to 1900 MHz). VDCOut IDC RF in VBIAS DC output voltage RF generator Power supply Current generator STPAC test board Multimeter Climatic chamber Fig. 5:Temperature effect measurement circuit on VDCout. Vtemp IDC VBIAS Temp. voltage Power supply Current generator STPAC test board Multimeter Climatic chamber Fig. 6:Vtemp measurement circuit. 1.88 1.9 1.92 1.94 1.96 1.98 0 1 02 03 04 05 06 07 0 Tamb (°C) Vtemp Ibias = 50µA Fig. 7: Vtemp output voltage versus ambient temperature.

1.57mm ± 50µm 1.57mm ± 50µm 315µm ± 50 500µm ± 50 500µm ± 50 650µm ± 65 PACKAGE MECHANICAL DATA 365 365 240 220 x y x w x w Dot, ST logo xxx = marking yww = datecode (y = year ww = week) All dimensions in µm MARKING Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter FOOT PRINT RECOMMENDATIONS

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com Note: More packing informations are available in the application note AN1235: ''Flip-Chip: Package description and recommandations for use'' Dot identifying Pin A1 location User direction of unreelingAll dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 0.73 +/- 0.05 ST xxx yww ST xxx yww ST xxx yww FLIP-CHIP TAPE AND REEL SPECIFICATION Ordering code Marking Package Weight Base qty Delivery mode STPAC01F1 RAT Flip-Chip 3.3 mg 5000 Tape & reel OTHER INFORMATION