STP95N04 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

N-CHANNEL 40V - 5.4mΩ - 80A - DPAK - TO-220 STripFET™ Power MOSFET General features ■ STANDARD THRESHOLD DRIVE ■ 100% AVALANCHE TESTED

Description

This N-Channel enhancement mode MOSFET is the latest refinement of STMicroelectronic unique “Single Feature Size™“ strip-based process with less critical aligment steps and therefore a remarkable manufacturing reproducibility. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and low gate charge

Applications

■ HIGH CURRENT,SWITCHING APPLICATION ■ AUTOMOTIVE Order codes Internal schematic diagram Type VDSS R DS(on) ID Pw STD95N04 STP95N04 40V 40V <6.5mΩ <6.5mΩ 80A 80A 110W 110W DPAK TO-220 Sales Type Marking Package Packaging STD95N04 D95N04 DPAK TAPE & REEL STP95N04 P95N04 TO-220 TUBE

1 Electrical ratings STD95N04 - STP95N04

1 Electrical ratings

Table 1. Absolute maximum ratings Table 2. Thermal data

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

2 Electrical characteristics STD95N04 - STP95N04

Table 5. Switching times Table 6. Source drain diode

2.1 Electrical characteristics (curves)

Figure 1. Safe Operating Area Figure 2. Thermal Impedance Figure 3. Output Characteristics Figure 4. Transfer Characteristics Figure 5. Static Drain-source on Resistance Figure 6. Normalized BVDSS vs Temperature

Figure 7. Gate Charge vs Gate-source Voltage Figure 8. Capacitance Variations Figure 9. Normalized Gate Threshold Voltage Figure 10. Normalized on Resistance vs Figure 11. Source-drain Diode Forward

3 Test circuits

Figure 12. Switching Times Test Circuit for Figure 13. Gate Charge Test Circuit Figure 14. Test Circuit for Inductive Load Figure 15. Unclamped Inductive Load Test Figure 16. Unclamped Inductive Waveform Figure 17. Switching Time Waveform

3 T est circuits STD95N04 - STP95N04

Figure 18. Diode Reverse Recovery Waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

4 Package mechanical data STD95N04 - STP95N04

DIM. mm inch A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0 o 8o 0o 0o P032P_B TO-252 (DPAK) MECHANICAL DATA

DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

5 Packing mechanical data STD95N04 - STP95N04

5 Packing mechanical data

DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 BASE QTY BULK QTY 2500 2500 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 TAPE MECHANICAL DATA All dimensions are in millimeters

6 Revision History

24-Oct-2005 2 Inserted ecopack indication 07-Dec-2005 3 Complete version

6 Revision History STD95N04 - STP95N04

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America