STB8NM60D STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

■ High dv/dt and avalanche capabilities ■ 100% avalanche rated ■ Low input capacitance and gate charge ■ Low gate input resistance ■ Fast internal recovery diode

Description

The FDmesh™ associates all advantages of reduced on-resistance and fast switching with an intrinsic fast-recovery body diode. It is therefore strongly recommended for bridge topologies, in particular ZVS phase-shift converters

Applications

The MDmesh™ family is very suitable for increasing power density of high voltage converters allowing syst em miniaturization and higher efficiencies. Internal schematic diagram General features Type V DSS RDS(on) ID PTOT STB8NM60D STP8NM60D 600V 600V < 1.0Ω < 1.0Ω 100W 100W TO-220 D²PAK STB8NM60D STP8NM60D N-CHANNEL 600V - 0.9Ω - 8A - TO-220/D2PAK Fast Diode MDmesh™ Power MOSFET Order codes Sales Type Marking Package Packaging STB8NM60D B8NM60D D²PAK TAPE & REEL STP8NM60D P8NM60D TO-220 TUBE

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Pulse width limited by safe operating area

Table 2. Thermal data Table 3. Avalanche data

2 Electrical characteristics

Table 4. On/off states Table 5. Dynamic

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%
  2. C oss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when VDS

Table 6. Switching times Table 7. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance

3 Test circuit

Figure 12. Switching times test circuit for Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

DIM. mm. inch A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R0 . 4 0 . 0 1 5 V2 0º 4º D2PAK MECHANICAL DATA

STB8NM60D - STP8NM60D Packaging mechanical data Rev2 11/13

5 Packaging mechanical data

  • on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA

6 Revision history

Table 8. Document revision history 13-Jan-2006 1 Initial release.

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