STP30NM30N STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: pROVIDED bY alldatasheet.com(free datasheet download site)
  • PDF pages: 12

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuits
  • 4 Package mechanical data
  • 5 Revision history

Features

■ Worldwide lowest gate charge ■ High dv/dt avalanche capabilities ■ Low input capacitance ■ Low gate resistance

Description

This 300V Power MOSFET with a new advanced layout brings all unique advantages of MDmesh™ technology to medium voltages. The device exhibits worldwide lowest gate charge for any given on-resistance. Its use is therefore ideal as primary side switch for DC-DC converters as well as for switch mode power supply allowing higher efficiencies and system miniaturization. Application ■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STP30NM30N 300V <0.090 Ω 30A TO-220 Order code Part number Marking Package Packaging STP30NM30N P30NM30N TO-220 Tube

1 Electrical ratings

Table 1. Absolute maximum ratings Table 2. Thermal data Table 3. Avalanche characteristics

2 Electrical characteristics

Table 4. On /off states Table 5. Dynamic

  1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%

Table 6. Switching times Table 7. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration = 300µs, duty cycle 1.5%

2.1 Electrical characteri stics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Normalized B VDSS vs temperature Figure 6. Static drain-source on resistance

3 Test circuits

Figure 12. Switching times test circuit for Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped inductive load test Figure 16. Unclamped inductive wavefo rm Figure 17. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

A 4.40 4.60 0.17 3 0.181 b 0.61 0. 88 0.024 0.0 34 b1 1.14 1.70 0.044 0.066 c0 . 4 9 0.70 0.01 9 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0. 393 0.409 e 2.40 2.70 0.0 94 0.106 e1 4. 95 5.15 0.1 94 0.202 F1 . 2 3 1.32 0.04 8 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.0 94 0.107 L1 3 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L302 8.90 1.1 37 ∅P 3.75 3.85 0.147 0.151 Q2 . 6 5 2 . 95 0.104 0.116

5 Revision history

Table 8. Revision history