STP200NF04

STP200NF04 STMICROELECTRONICS | Alldatasheet

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STP200NF04 - STB200NF04 - STB200NF04-1 Table 3: Absolute Maximum ratings (/circle6 ) Pulse width limited by safe operating area (1) ISD ≤120A, di/dt ≤500A/µs, VDD ≤ V(BR)DSS , Tj ≤ TJMAX. (2) Starting Tj = 25°C, Id = 60A, VDD =30 V (#) Current Limited by Package Table 4: Thermal Data ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) Table 5: On/Off Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 40 V VDGR Drain-gate Voltage (RGS = 20 kΩ ) 40 V VGS Gate- source Voltage ± 20 V ID (#) Drain Current (continuos) at TC = 25°C 120 A ID (#) Drain Current (continuos) at TC = 100°C 120 A IDM (/circle6 ) Drain Current (pulsed) 480 A PTOT Total Dissipation at TC = 25°C 310 W Derating Factor 2.07 W/ °C dv/dt (1) Peak Diode Recovery voltage slope 1.5 V/ns EAS (2) Single Pulse Avalanche Energy 1.3 J Tj Tstg Operating Junction Temperature Storage Temperature -55 to 175 °C TO-220 / I2PAK / D2PAK Rthj-case Thermal Resistance Junction-case Max 0.48 °C/W Rthj-pcb Thermal Resistance Junction-pcb Max (see Figure 17) °C/W Rthj-amb Thermal Resistance Junction-ambient (Free air) Max 62.5 °C/W Tl Maximum Lead Temperature For Soldering Purpose 300 °C Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 40 V IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating, TC = 125 °C µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 20V ±100 nA VGS(th) Gate Threshold Voltage VDS = VGS , ID = 250µA 24 V R DS(on) Static Drain-source On Resistance VGS = 10V, ID = 90 A 3.3 3.7 m Ω

STP200NF04 - STB200NF04 - STB200NF04-1 ELECTRICAL CHARACTERISTICS (CONTINUED) Table 6: Dynamic Table 7: Switching On/Off Table 8: Source Drain Diode (1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. (2) Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (1) Forward Transconductance V DS = 15 V, ID = 90 A 150 S C iss C oss C rss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V, f = 1 MHz, VGS = 0 5100 1600 600 pF pF pF Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) tr td(off) tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time V DD = 20 V, ID = 90 A R G =4 . 7Ω VGS = 10 V (see Figure 20) 320 140 120 ns ns ns ns Q g Q gs Q gd Total Gate Charge Gate-Source Charge Gate-Drain Charge V DD = 20V, ID = 120 A, VGS = 10V (see Figure 23) 170 210 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit I SD ISDM (2) Source-drain Current Source-drain Current (pulsed) 120 480 A A VSD (1) Forward On Voltage ISD = 120 A, VGS = 0 1.3 V trr Q rr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 120 A, di/dt = 100A/µs VDD = 30V, Tj = 150°C (see Figure 21) 190 4.5 ns nC A

STP200NF04 - STB200NF04 - STB200NF04-1 Figure 17: Allowable lav vs. Time in Avalanche The previous curve gives the safe operating area for unclamped inductive loads, single pulse or repetitive, under the following conditions: PD(AVE) = 0.5 * (1.3 * BVDSS * IAV ) EAS(AR) = PD(AVE) * tAV Where: I AV is the Allowable Current in Avalanche PD(AVE) is the Average Power Dissipation in Avalanche (Single Pulse) tAV is the Time in Avalanche To derate above 25 °C, at fixed IAV, the following equation must be applied: IAV = 2 * (Tjmax - TCASE ) / (1.3 * BVDSS * Zth) Where: Z th = K * Rth is the value coming from Normalized Thermal Response at fixed pulse width equal to TAV .

STP200NF04 - STB200NF04 - STB200NF04-1 Table 9: 6th Order RC Network Figure 18: Schematic of 6th Order RC Network Parameter Node Value CTHERM1 1 - 2 1.4958E-3 CTHERM2 2 - 3 3.5074E-2 CTHERM3 3 - 4 5.939E-2 CTHERM4 4 - 5 9.7411E-2 CTHERM5 5 - 6 8.8596E-2 CTHERM6 6 - 7 8.2755E-1 RTHERM1 1 - 2 0.0384 RTHERM2 2 - 3 0.0624 RTHERM3 3 - 4 0.072 RTHERM4 4 - 5 0.0912 RTHERM5 5 - 6 0.1008 RTHERM6 6 - 7 0.1152 SPICE THERMAL MODEL

STP200NF04 - STB200NF04 - STB200NF04-1 DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

STP200NF04 - STB200NF04 - STB200NF04-1 TO-247 MECHANICAL DATA DIM. mm. inch A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R0 . 4 0 . 0 1 5 V2 0 º 4º D 2PAK MECHANICAL DATA

STP200NF04 - STB200NF04 - STB200NF04-1 DIM. mm. inch A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 TO-262 (I2PAK) MECHANICAL DATA

STP200NF04 - STB200NF04 - STB200NF04-1 TAPE AND REEL SHIPMENT (suffix ”T4”)* TUBE SHIPMENT (no suffix)* D 2PAK FOOTPRINT * on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA

STP200NF04 - STB200NF04 - STB200NF04-1 Table 10: Revision History Date Revision Description of Changes 28-Sep-2004 2 New Stylesheet. No Content Change 11-Oct-2004 3 Final datasheet

STP200NF04 - STB200NF04 - STB200NF04-1 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners © 2004 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America