STP120NH03L STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 17

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Packing mechanical data
  • 6 Appendix A
  • 7 Revision history

N-channel 30V - 0.005Ω - 60A - TO-220 / D2PAK / I2PAK STripFET™ Power MOSFET for DC-DC conversion General features ■ RDS(on) *Qg industry’s benchmark Low ■ Conduction losses reduced ■ Switching losses reduced ■ Low Threshold device

Description

These devices utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. It is ideal in high performance DC-DC converter applications where efficiency is to be achieved at very high output currents.

Applications

■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STB120NH03L 30V <0.0055 Ω 60(1) 1. Value limited by wire bonding STP120NH03L 30V <0.0055 Ω 60(1) STI120NH03L 30V <0.0055 Ω 60(1) TO-220 D2PAK 3 1 1 2 3 I2PAK Order codes Part number Marking Package Packaging STB120NH03L B120NH03L D 2PAK Tape & reel STI120NH03L 120NH03L I²PAK Tube STP120NH03L P120NH03L TO-220 Tube

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Value limited by wire bonding
  2. Pulse width limited by safe operating area

Table 2. Thermal data

2 Electrical characteristics

Table 3. On/off states Table 4. Dynamic

  1. Qoss = Coss* ∆VIN, Coss = Cgd + Cds. See power losses calculation
  2. Gate charge for synchronous operation.

Table 5. Source drain diode

  1. Pulsed: pulse duration = 300µs, duty cycle 1.5%

2.1 Electrical characteri stics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Normalized B VDSS vs temperature Figure 6. Static drain-source on resistance

3 Test circuit

Figure 12. Switching times test circuit for Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test Figure 16. Unclamped inductive wavefo rm Figure 17. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm. inch A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 TO-220 MECHANICAL DATA

DIM. mm. inch A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 8 0.315 E 10 10.4 0.393 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R0 . 4 0 . 0 1 5 V2 0º 4º D2PAK MECHANICAL DATA

DIM. mm. inch A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 TO-262 (I2PAK) MECHANICAL DATA

STB120NH03L - STI120NH03L - STP120NH03L Packing mechanical data

5 Packing mechanical data

  • on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA

6 Appendix A

  • The low side (SW2) device requires: – Very low R DS(on) to reduce conduction losses – Small Qgls to reduce the gate charge losses – Small Coss to reduce losses due to output capacitance – Small Qrr to reduce losses on SW1 during its turn-on – The Cgd/Cgs ratio lower than Vth/Vgg ra tio especially with low drain to source – voltage to avoid the cross conduction phenomenon;
  • The high side (SW1) device requires: – Small Rg and Ls to allow higher gate current peak and to limit the voltage feedback on the gate – Small Qg to have a faster commutation and to reduce gate charge losses –L o w R DS(on) to reduce the conduction losses.

Figure 18. Buck converter: power losses estimation

Table 6. Power losses calculation

  1. Dissipated by SW1 during turn-on

Table 7. Parameters meaning

7 Revision history

Table 8. Revision history