STP08CP05 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 25
Technical content
Datasheet sections
- 1 Summary description
- 1.1 Pin connection and description
- 2 Block diagram
- 3 Maximum rating
- 3.1 Absolute maximum ratings
- 3.2 Thermal data
- 3.3 Recommended operating conditions
- 4 Electrical characteristics
- 5 Switching characteristics
- 6 Equivalent circuit and outputs
- 7 Truth table and timing diagram
- 7.1 Truth table
- 7.2 Timing diagram
- 8 Typical characteristics
- 9 Test circuit
- 10 Package mechanical data
- 11 Revision history
Features
■ Low voltage power supply down to 3V ■ 8 constant current output channels ■ Adjustable output current through external resistor ■ Serial Data IN/Parallel data OUT ■ 3.3V micro driver-able ■ Output current: 5-100mA ■ 30MHz clock frequency ■ Available in high thermal efficiency TSSOP exposed pad ■ ESD protection 2.5kV HBM, 200V MM
Description
The STP08CP05 is a monolithic, low voltage, low current, power 8-bit shift register designed for LED panel displays. The STP08CP05 contains a 8-bit serial-in, parallel-out shift register that feeds a 8-bit D-type storage register. In the output stage, eight regulated current sources were designed to provide 5-100mA constant current to drive the LEDs, the output current setup time is 10ns (typ), thus improving the system performance. The STP08CP05 is backward compatible in functionality and footprint with STP8C/L596. Through an external resistor, users can adjust the STP08CP05 output current, controlling in this way the light intensity of LEDs, in addition, user can adjust LED’s brightness intensity from 0% to 100% via OE pin. The STP08CP05 guarantees a 20V output driving capability, allowing users to connect more LEDs in series. The high clock frequency, 30 MHz, also satisfies the system requirement of high volume data transmission. The 3.3V of voltage supply is useful for applications that interface with any micro from 3.3V. Compared with a standard TSSOP package, the TSSOP exposed pad increases heat dissipation capability by a 2.5 factor. Dip-16 TSSOP16 (Exposed pad) TSSOP16 SO-16 Table 1. Device summary
1 Summary description
1.1 Pin connection and description
Table 2. Typical current accuracy Figure 1. Connections diagram Table 3. Pin description
1 GND Ground terminal
2 SDI Serial data input terminal
3 CLK Clock input terminal
4 LE Latch input terminal
13 OE Output enable input terminal (active low)
14 SDO Serial data out terminal
15 R-EXT Constant current programming
2 Block diagram
Figure 2. Block diagram
3 Maximum rating
Program and other relevant quality documents.
3.1 Absolute maximum ratings
3.2 Thermal data
Table 4. Absolute maximum ratings Table 5. Thermal data
- The Exposed-Pad should be soldered to the PBC to realize the thermal benefits
3.3 Recommended operating conditions
Table 6. Recommended operating conditions
- In order to achieve high casc ade data transfer,please consider tr/tf timings carefully.
30 MHz
4 Electrical characteristics
Table 7. Electrical characteristics
- Guaranteed by desing (not tested)
5 Switching characteristics
Table 8. Switching characteristics (VDD = 5V, T = 25°C, unless otherwise specified.)
- In order to achieve high cascade data transfe r, please consider tr/tf timings carefully.
6 Equivalent circuit and outputs
Figure 3. OE terminal Figure 4. LE terminal Figure 5. CLK, SDI terminal
Figure 6. SDO terminal
7 Truth table and timing diagram
7.1 Truth table
Note: OUT0 to OUT7 = ON when Dn = H; OUT0 to OUT7 = OFF when Dn = L. Table 9. Truth table
7.2 Timing diagram
Figure 7. Timing diagram Figure 8. Clock, serial-in, serial-out
8 Typical characteristics
Figure 11. Output current-R EXT resistor Table 10. Output current-REXT resistor
Figure 12. Power dissipation vs temperature package Note: The Exposed-Pad should be soldered to the PBC to realize the thermal benefits.
9 Test circuit
Figure 13. DC characteristics Figure 14. AC characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
DIM. mm. inch a1 0.51 0.020 B 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 Plastic DIP-16 (0.25) MECHANICAL DATA P001C
DIM. mm. inch A 1.2 0.047 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0079 e 0.65 BSC 0.0256 BSC K0 ˚ 8 ˚0 ˚ 8 ˚ TSSOP16 MECHANICAL DATA c Eb A2A D PIN 1 IDENTIFICATION LKe 0080338D
DIM. mm. inch A 1.2 0.047 A1 0.15 0.004 0.006 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.0089 D1 1.7 0.067 E2 1.5 0.059 e 0.65 0.0256 K0 ° 8 °0 ° 8 ° TSSOP16 EXPOSED PAD MECHANICAL DATA 7419276A
DIM. mm. inch A 330 12.992 C 12.8 13.2 0.504 0.519 D 20.2 0.795 N 60 2.362 T 22.4 0.882 Ao 6.7 6.9 0.264 0.272 Bo 5.3 5.5 0.209 0.217 Ko 1.6 1.8 0.063 0.071 Po 3.9 4.1 0.153 0.161 P 7.9 8.1 0.311 0.319 Tape & Reel TSSOP16 MECHANICAL DATA
DIM. mm. inch A 1.75 0.068 a1 0.1 0.25 0.004 0.010 a2 1.64 0.063 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 9.8 10 0.385 0.393 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.62 0.024 S8 ° ( m a x . ) SO-16 MECHANICAL DATA 0016020D
DIM. mm. inch A 330 12.992 C 12.8 13.2 0.504 0.519 D 20.2 0.795 N 60 2.362 T 22.4 0.882 Ao 6.45 6.65 0.254 0.262 Bo 10.3 10.5 0.406 0.414 Ko 2.1 2.3 0.082 0.090 Po 3.9 4.1 0.153 0.161 P 7.9 8.1 0.311 0.319 Tape & Reel SO-16 MECHANICAL DATA
Table 11. Revision history