STP04CM596 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Internal schematic
  • 2 Pin settings
  • 2.1 Pin connection
  • 2.2 Pin description
  • 3 Maximum rating
  • 3.1 Thermal data
  • 3.2 Recommended operating conditions
  • 4 Electrical characteristics
  • 5 Equivalent circuit of inputs and outputs
  • 6 Timing diagrams
  • 7 Test circuit
  • 8 Typical characteristics
  • 9 Package mechanical data
  • 10 Revision history

4-Bit constant current for power-LED LED sink driver General features ■ 4 constant current output channels ■ Adjustable output current through one external resistor ■ Serial data IN/parallel data OUT ■ Serial OUT change state on the failing edges of clock ■ Four outputs current: 80-500mA ■ 25MHz clock frequency ■ Available in high thermal TSSOP exposed pad.

Description

The STP04CM596 is a high-power LED Driver and 4-bit shift register designed for PowerLED applications. The STP04CM596 contains a 4-bit serial IN, parallel OUT shift register that feeds a 4-bit D- type storage register. In the output stage, four regulated current sources were designed to provide 80-500mA constant current to drive the high powered LEDs. The STP04CM596 guarantees 16V output driving capability, allowing users to connect more LEDs in series. The high clock frequency, 25 MHz, also satisfies the system requirements which include high volume data transmission. The STP04CM596 is well suited for very high brightness displays and special lighting applications. The STP04CM596 is offered in DIP-14, SO-14 and TSSOP16 Exposed Pad packages. SO-14 Dip-14 TSSOP16 (Exposed pad) Order codes Part Number Package Packaging STP04CM596B1R DIP-14 25 parts per tube STP04CM596M SO-14 (Tube) 50 parts per tube STP04CM596MTR SO-14 (Tape & Reel) 2500 parts per reel STP04CM596XTTR TSSOP16 Exposed-pad (Tape & Reel) 2500 parts per reel

1 Internal schematic

Figure 1. Block diagram

2 Pin settings

2.1 Pin connection

Figure 2. Pin connection

2.2 Pin description

Table 1. Pin description

3 Maximum rating

Program and other relevant quality documents.

3.1 Thermal data

Table 2. Absolute maximum ratings Table 3. Thermal data

  1. 1W of dissipated power, mounted on the board
  2. 1W of dissipated power ,mounted on SM PCB1 SGS board
  3. Using the PCB Multi-Layer JEDEC Standard Test Boards

3.2 Recommended operating conditions

Table 4. Recommended operating conditions

  1. If multiple devices are cascaded, it may not be possible achieve the maximum data transfer. Please

consider the timing conditions carefully.

25 MHz

4 Electrical characteristics

Table 5. Current accuracy Table 6. Electrical characteristics (VDD = 5V, TA = 25°C, unless otherwise specified.)

Table 7. Switching characteristics (VDD=5V, T = 25°C, unless otherwise specified.)

  1. If multiple devices are cascaded, it may not be possible achieve the maximum data transfer. Please

consider the timing conditions carefully.

5 Equivalent circuit of inputs and outputs

Figure 3. OE terminal Figure 4. LE terminal Figure 5. CLK, SDI terminal

Figure 6. SDO terminal

6 Timing diagrams

Figure 7. Timing diagram Note: The latches circuit holds data when the LE terminal is Low.

1 When the LE terminal is at a High level, the latch circuit holds the data it passes from the

2 When the OE terminal is at a Low level, the output terminals OUT0 to OUT3 respond to the

3 When the OE terminal is at a High level, it switches off all the data on the output terminal.

Figure 8. Clock, serial-IN, serial-OUT

7 Test circuit

Figure 11. DC characteristic Figure 12. AC characteristic

8 Typical characteristics

Figure 13. Output current-R EXT resistor Figure 14. Output current vs dropout Figure 15. Output current vs ±∆IOL(%)

Figure 16. Blue powerLED typ. application circuit Table 8. Typ. output waveform with blue powerLEDs

9 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Figure 17. Package dimensions Table 9. DIP-14 mechanical data

Figure 18. Package dimensions Table 10. SO-14 mechanical data

Figure 19. Package dimensions Table 11. TSSOP16 (Exposed pad) mechanical data

Figure 20. Tape and reel dimensions Table 12. Tape and reel SO-14

Figure 21. Tape and reel dimensions Table 13. TSSOP16 tape and reel

Table 14. Revision history