STL58N3LLH5 STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 16

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuits
  • 4 Package mechanical data
  • 5 Packaging mechanical data
  • 6 Revision history

Features

  • Designed for automotive applications and AEC-Q101 qualified
  • Low on-resistance
  • High avalanche ruggedness
  • Low gate drive power loss
  • Wettable flank package

Applications

  • Switching applications

Description

This device is an N-channel Power MOSFET developed using STMicroelectronics’ STripFET™ H5 technology. The device has been optimized to achieve very low on-state resistance, contributing to a FoM that is among the best in its class. PowerFLAT™ 5x6 $0Y Order code V DS RDS(on) max I D STL58N3LLH5 30 V 0.009 Ω 56 A Table 1. Device summary

1 Electrical ratings

Table 2. Absolute maximum ratings

  1. The value is rated according to R thj-c
  2. The value is rated according to R thj-pcb
  3. Pulse width limited by safe operating area

Table 3. Thermal resistance

  1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec

2 Electrical characteristics

Table 4. On/off states Table 5. Dynamic

Table 6. Switching times Table 7. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration= 300 µs, duty cycle 1.5%

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized V(BR)DSS vs temperature Figure 7. Static drain-source on-resistance

3 Test circuits

Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Figure 19. PowerFLAT™ 5x6 WF type S-R drawing

Table 8. PowerFLAT™ 5x6 WF type S-R mechanical data

Figure 20. PowerFLAT™ 5x6 WF type S-R drawing recommended footprint (a) a. All dimensions are in mm.

5 Packaging mechanical data

Figure 21. PowerFLAT™ 5x6 type R-WF tape (b) Figure 22. PowerFLAT™ 5x6 package orientation in carrier tape b. All dimensions are in millimeters. hole to centreline of pocket.

Figure 23. PowerFLAT™ 5x6 reel

6 Revision history

Table 9. Document revision history 04-Aug-2014 1 First release. Text edits throughout document.