STG3699A

STG3699A_06 STMICROELECTRONICS | Alldatasheet

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Technical content

■ HIGH SPEED: tPD = 1.5ns (TYP.) at VCC = 3.0V tPD = 1.5ns (TYP.) at VCC = 2.3V ■ ULTRA LOW POWER DISSIPATION: ICC = 0.2µA (MAX.) at TA = 85°C ■ LOW "ON" RESISTANCE VIN=0V: RON = 0.5Ω (MAX. TA = 25°C) at VCC = 2.7V RON = 0.7Ω (MAX. TA = 25°C) at VCC = 2.3V RON = 1.5Ω (MAX. TA = 25°C) at VCC = 1.8V ■ WIDE OPERATING VOLTAGE RANGE: VCC (OPR) = 1.65V to 4.3V SINGLE SUPPLY ■ 4.3V TOLERANT AND 1.8V COMPATIBLE THRESHOLD ON DIGITAL CONTROL INPUT at V CC = 2.3 to 3.0V ■ LATCH-UP PERFORMANCE EXCEEDS 300mA (JESD 17)

DESCRIPTION

The STG3699A is a high-speed CMOS low voltage quad analog S.P.D.T. (Single Pole\\Dual Throw) switch or 2:1 Multiplexer/Demultiplexer Switch fabricated in silicon gate C 2MOS technology. It is designed to operate from 1.65V to 4.3V, making this device ideal for portable applications. It offers very low ON-Resistance (R ON<0.5Ω) at VCC=3.0V. The nIN inputs are provided to control the switches. The switches nS1 are ON (they are connected to common Ports Dn) when the nIN input is held high and OFF (high impedance state exists between the two ports) when nIN is held low; the switches nS2 are ON (they are connected to common Ports Dn) when the nIN input is held low and OFF (high impedance state exists between the two ports) when IN is held high. Additional key features are fast switching speed, Break-Before-Make delay time and ultra low power consumption. All inputs and outputs are equipped with protection circuits against static discharge, giving them ESD immunity and transient excess voltage. It is available in the commercial temperature range (-40 to 125 °C)in QFN16 3x3mm, 2.5x2.5mm. STG3699A LOW VOLTAGE 0.5Ω MAX QUAD SPDT SWITCH WITH BREAK-BEFORE-MAKE FEATURE QFN16 (2.5x2.5/3x3) Table 1: Pin Connection (top through view) Order Codes PACKAGE T & R QFN16 (2.5x2.5) STG3699AUTR QFN16 (3x3) STG3699AQTR QFN16 (3x3)QFN16 (2.5x2.5) Rev. 10

Figure 2: Input Equivalent Circuit Table 2: Pin Description Table 3: Truth Table Table 4: Absolute Maximum Ratings Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditi ons not implied. (1) Derate above 70°C: by 18.5mW/°C. Table 5: Recommended Operating Conditions 1) Truth Table guaranteed: 1.2V to 4.3V. PIN(1) N° 1. Exposed pad must be soldered to a floating plane. Do NOT con- nect to power or ground. SYMBOL NAME AND FUNCTION 15, 3, 7, 11, 1, 5, 9, 13 1S1 to 4S1, 1S2 to 4S2 Independent Channels 16, 4, 8, 12 D1 to D4 Common Channels 2, 10 1-2IN, 3-4IN Controls

14 VCC Positive Supply Voltage

6 GND Ground (0V)

L - 1S2-D1, 2S2-D2 H - 1S1-D1, 2S1-D2 - L 3S2-D3, 4S2-D4 - H 3S1-D3, 4S1-D4 Symbol Parameter Value Unit VCC Supply Voltage -0.5 to 5.5 V VI DC Input Voltage -0.5 to VCC + 0.5 V VIC DC Control Input Voltage -0.5 to 5.5 V VO DC Output Voltage -0.5 to VCC + 0.5 V IIKC DC Input Diode Current on control pin (V IN< 0V) − 50 mA IIK DC Input Diode Current (VIN< 0V) ± 50 mA IOK DC Output Diode Current ± 20 mA IO DC Output Current ± 300 mA IOP DC Output Current Peak (pulse at 1ms, 10% duty cycle) ± 500 mA ICC or IGND DC VCC or Ground Current ± 100 mA PD Power Dissipation at Ta = 70°C (1) 1120 mW Tstg Storage Temperature -65 to 150 °C TL Lead Temperature (10 sec) 300 °C Symbol Parameter Value Unit VCC Supply Voltage (note 1) 1.65 to 4.3 V VI Input Voltage 0 to VCC V VIC Control Input Voltage 0 to 4.3 V VO Output Voltage 0 to VCC V Top Operating Temperature -55 to 125 °C dt/dv Input Rise and Fall Time Control Input VCC= 1.65V to 2.7V 0 to 20 ns/VVCC= 3.0V to 4.3V 0 to 10

Table 6: DC Specifications Note 1: ∆RON = RON(MAX) - RON(MIN). Note 2: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the speci fied analog signal ranges. Symbol Parameter Test Conditions Value UnitVCC (V) TA = 25°C -40 to 85°C -55 to 125°C VIH High Level Input Voltage V 3.3 1.4 1.4 1.4 3.6 1.5 1.5 1.5 4.3 1.6 1.6 1.6 VIL Low Level Input Voltage V 3.3 0.30 0.30 0.30 3.6 0.30 0.30 0.30 4.3 0.40 0.40 0.40 RON Switch ON Resistance 4.3 VS=0V to VCC IS=100mA 0.35 0.45 0.50 Ω 3.0 0.40 0.50 0.60 2.7 0.40 0.50 0.60 2.3 0.45 0.70 0.80 1.8 0.55 1.5 2.0 1.65 0.65 1.5 2.0 ∆RON ON Resistance Match between channels (1)

2.7 VS @ RON Max

IS=100mA 0.06 Ω RFLAT ON Resistance FLATNESS (2) 4.3 VS=0V to VCC IS=100mA 0.15 0.20 0.20 Ω 3.0 0.15 0.20 0.20 2.7 0.15 0.20 0.20 2.3 0.20 0.25 0.25 1.65 0.30 0.35 0.35 IOFF OFF State Leakage Current (nSn), (Dn) 4.3 VS=0.3 or 4V ±20 ± 100 nA IIN Input Leakage Current 0 - 4.3 VIN= 0 to 4.3V ±0.1 ± 1 µA ICC Quiescent Supply Current 1.65-4.3 VIN=VCC or GND ±0.05 ±0.2 ±1 µA ICCLV Quiescent Supply Current Low Voltage Driving

4.3 V1-2IN,

V3-4IN = 1.65V ±37 ±50 ±100 µA V1-2IN, V3-4IN = 1.80V ±33 ±40 ±50 V1-2IN, V3-4IN = 2.60V ±12 ±20 ±30

Table 7: AC Electrical Characteristics (CL = 35pF, RL = 50Ω, tr = tf ≤ 5ns) Table 8: Analog Switch Characteristics (CL = 5pF, RL = 50Ω, TA = 25°C) Note 1: Off Isolation = 20Log10 (VD/VS), VD = output. VS = input to off switch Symbol Parameter Test Condition Value UnitVCC (V) TA = 25°C -40 to 85°C -55 to 125°C tPLH, tPHL Propagation Delay 1.65-1.95 VI=OPEN 0.45 ns2.3-2.7 0.40 3.0-3.3 0.30 3.6-4.3 0.30 tON TURN-ON time 1.65-1.95 VS=0.8V 120 ns2.3-2.7 VS=1.5V 45 55 65 3.0-3.3 42 55 65 3.6-4.3 40 55 65 tOFF TURN-OFF time 1.65-1.95 VS=0.8V 22 ns2.3-2.7 VS=1.5V 18 30 40 3.0-3.3 16 30 40 3.6-4.3 15 30 40 tD Break Before Make Time Delay 1.65-1.95 CL=35pF RL= 50Ω VS=1.5V 10 80 ns2.3-2.7 10 60 3.0-3.3 10 55 3.6-4.3 10 50 Q Charge injection 1.65-1.95 CL= 100pF RL= 1MΩ VGEN= 0V RGEN= 0Ω pC2.3-2.7 40 3.0-3.3 35 3.6-4.3 35 Symbol Parameter Test Condition Value UnitVCC (V) TA = 25°C -40 to 85°C -55 to 125°C OIRR Off Isolation (1) 1.65-4.3 VS= 1VRMS f= 100KHz -64 dB Xtalk Crosstalk 1.65-4.3 VS= 1VRMS f= 100KHz -54 dB THD Total Harmonic Distortion 2.3-4.3 RL= 600Ω VIN= 2VPP f= 20Hz to 20kHz 0.03 % BW -3dB Bandwidth 1.65-4.3 RL= 50Ω 50 MHz CIN Control Pin Input Capacitance 5 pFCSn Sn Port Capaci- tance 3.3 f= 1MHz 30 CD D Port Capaci- tance when Switch is Enabled 3.3 f= 1MHz 84

Table 9: Turn On, Turn Off Delay Time

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

DIM. mm. inch A1 0.02 0.05 0.001 0.002 e 0.40 0.016 QFN16 (2.5x2.5) MECHANICAL DATA 7815712A

QFN16 (2.5 x 2.5) Tape and Reel

DIM. mm. inch A1 0.02 0.05 0.001 0.002 A3 0.20 0.008 D 3.00 0.118 E 3.00 0.118 e 0.50 0.020 K 0.20 0.008 r 0.09 0.006 QFN16 (3x3) MECHANICAL DATA E A e K b r K LA3 D

DIM. mm. inch A 330 12.992 C 12.8 13.2 0.504 0.519 D2 0 . 2 0 . 7 9 5 N6 0 2 . 3 6 2 T 18.4 0.724 Ao 3.3 0.130 Bo 3.3 0.130 Ko 1.1 0.043 Po 4 0.157 P 8 0.315 Tape & Reel QFNxx/DFNxx (3x3) MECHANICAL DATA

Table 10: Revision History Date Revision Description of Changes 24-Nov-2004 1 First Release. 13-Jan-2005 2 ICCLV is changed on Ta ble 6 23-Mar-2005 3 Table 3 has been updated and VCC is changed on Table 4 31-May-2005 4 Add New Package QFN16 (2.5x2.5). 04-Jul-2005 5 The Q Values on Table 7 has been updated. 19-Jul-2005 6 Add New Package QFN16 (2.6x1.8). 03-Aug-2005 7 The VCC and VIC values on Ta ble 4 has been updated. 10-Oct-2005 8 Removed all the information about the QFN16L 2.6X1.8 package 21-Nov-2005 9 Modified the label in Table 1 21-Dec-2005 10 Few Updates, added tape and reel QFN16 (2.5 x 2.5)

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