STFW4N150_09 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 15
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuits
- 4 Package mechanical data
- 5 Revision history
Features
■ 100% avalanche tested ■ Intrinsic capacitances and Qg minimized ■ High speed switching ■ Fully isolated TO-3PF plastic packages ■ Creepage distance path is 5.4 mm (typ.) for TO-3PF Application ■ Switching applications
Description
Using the well consolidated high voltage MESH OVERLAY™ process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances. The strengthened layout coupled with the company’s proprietary edge termination structure, gives the lowest R DS(on) per area, unrivalled gate charge and switching characteristics. Figure 1. Internal schematic diagram. Table 1. Device summary
1 Electrical ratings
Table 2. Absolute maximum ratings
- Pulse width limited by safe operating area
Table 3. Thermal data Table 4. Avalanche characteristics
2 Electrical characteristics
Table 5. On/off states Table 6. Dynamic
- Pulsed: pulse duration=300 µs, duty cycle 1.5%
2.1 Electrical characteristi cs (curves)
Figure 2. Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220 Figure 4. Safe operating area for TO-3PF Figure 5. Thermal impedance for TO-3PF Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247
3 Test circuits
Figure 19. Switching times test circuit for Figure 20. Gate charge test circuit Figure 21. Test circuit for inductive load Figure 22. Unclamped inductive load test Figure 23. Unclamped inductive waveform Figure 24. Switching time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
A 4.40 4.60 0.17 3 0.181 b 0.61 0. 88 0.024 0.0 34 b1 1.14 1.70 0.044 0.066 c0 . 4 8 0.70 0.01 9 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0. 393 0.409 e 2.40 2.70 0.0 94 0.106 e1 4. 95 5.15 0.1 94 0.202 F1 . 2 3 1.32 0.04 8 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.0 94 0.107 L1 3 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L302 8.90 1.1 37 ∅P 3.75 3.85 0.147 0.151 Q2 . 6 5 2 . 95 0.104 0.116
Dim. mm. Min. Typ Max. A4 . 855 . 1 5 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c0 . 4 0 0 . 80 D1 9.85 20.15 E 15.45 15.75 e5 . 4 5 L 14.20 14. 80 L1 3.70 4. 30 L2 1 8.50 øP 3.55 3.65 øR 4.50 5.50 S 5.50 TO-247 Mechanical data
DIM. mm. min. typ max. A5 . 30 5.70 C2 . 80 3.20 D 3.10 3.50 D1 1. 80 2.20 E0 . 80 1.10 F 0.65 0.95 F2 1. 80 2.20 G 10. 30 11.50 G1 5.45 H 15. 30 15.70 L9 . 80 10 10.20 L2 22. 802 3.20 L3 26.30 26.70 L4 4 3.20 44.40 L5 4. 30 4.70 L6 24. 30 24.70 L7 14.60 15 N1 . 80 2.20 R 3.80 4.20 Dia3 .40 3.80 TO-3PF mechanical data 7627132_C
5 Revision history
Table 8. Document revision history