STELPD01 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 27
Technical content
Datasheet sections
- 1 Diagram
- 2 Pin configuration
- 3 Application circuits
- 4 Maximum ratings
- 5 Electrical characteristics
- 6 Functional description
- 6.1 Turn-on and soft start-up feature
- 6.2 Maximum load at startup
- 6.3 Normal operating condition
- 6.4 Output voltage clamp
- 6.5 Current limiting
- 6.6 Thermal shutdown function
- 6.7 EN/Fault pin
- 6.8 External gate driver function for reverse blocking
- 6.9 External capacitors and application guidelines
- 7 Typical characteristics
- 8 Package information
- 8.1 DFN10L (3x3 mm) package information
- 8.2 DFN10 (3 x 3 mm) packing information
- 9 Ordering information
Features
- Wide input voltage range: 4 V to 18 V
- 17.5 V typical output overvoltage clamp
- Absolute maximum voltage of 23.5 V
- 5 A maximum continuous current
- Adjustable current limit with circuit breaker functionality
- Thermal protection
- Input undervoltage lockout
- Low inrush current during startup
- Integrated 40 mΩ Power FET
- EN/Fault pin
- Adjustable slew rate for output voltage
- Gate control pin for reverse current blocking FET
- Latch or auto-retry
- Available in DFN10L (3x3 mm) package
Applications
- Hot-Swap, Hot-Plug protection
- Industrial Systems
- VBUS management for Type-C and USB PD applications
Description
The STELPD01 is an integrated electronic power switch for power rail protection applications. It is able to precisely detect and react to overcurrent and overvoltage conditions. When an overload condition occurs, the device goes into an open state, disconnecting the load from the power supply. An external power MOSFET can be driven to manage the power loss protection in case of fault condition. In case of overvoltage on the input, the device regulates the output to a preset 17.5 V value. Undervoltage lockout prevents the load from malfunction, keeping the device off if the rail voltage is too low. The STELPD01 features an adjustable turn-on slew-rate, which is useful to keep the in-rush current under control during startup and hot-swap operations. DFN10L (3x3 mm) Maturity status link STELPD01 Electronic load switch for power line STELPD01 Datasheet DS13254 - Rev 1 - January 2022 For further information contact your local STMicroelectronics sales office.
1 Diagram
Figure 1. Block diagram
2 Pin configuration
Figure 2. Pin connection (top view) Table 1. Pin description 1-2 VIN Positive input voltage. 3-4 VOUT Connected to the source of the internal power MOSFET. not required, this pin should be left open.
8 EN/Fault
The EN/Fault pin is a tri-state, bi-directional interface. functions of this pin according to the device versions.
9 ILIM (1) An RLIM resistor between this pin and the VOUT pin sets the overload current limit
connected to an adequate spread of copper. GND connection is suggested.
- Important: missing or shorted R LIM causes current limit circuit malfunction and may lead to device damage.
3 Application circuits
Figure 3. Typical application circuit Figure 4. Typical application circuit with reverse current protection Table 2. Typical application components input inductance and load current.
4 Maximum ratings
Table 3. Absolute maximum ratings
- The thermal limit is set above the maximum thermal rating. It is not recommended to operate the device at temperatures
greater than the maximum ratings for extended periods. operation under these conditions is not implied. All values are referred to GND. Table 4. Thermal data
- Based on JESD51-7, 4-layer PCB.
Table 5. ESD performance Table 6. Recommended operating condition
- The maximum allowable power dissipation is a function of the maximum junction temperature T J(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature TA and can be estimated by: PD(MAX) = (TJ(MAX)-TA) / θJA. Exceeding the maximum allowable power dissipation produces overheating that may cause thermal shutdown.
5 Electrical characteristics
VIN = 5 V, VEN/Fault = 5 V, CIN = 10 µF, COUT = 10 µF, CdV/dt = floating, RLIM = 22 Ω; TJ = 25 °C; unless otherwise specified. Table 7. Electrical characteristics
Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit Thermal protection TSHDN Thermal shutdown (3) 165 °C TSHDN_HYS Hysteresis 20 °C Current consumption IBIAS Bias current, device operational VIN = 5 V 300 µA VIN = 15 V 350 Bias current, fault mode VIN = 5 V 115 µA VIN = 15 V 135 Bias current, off mode VIN = 5 V, VEN/Fault = 0 V 200 µA VIN = 15 V, VEN/Fault = 0 V 225 1. Pulsed test. 2. Values across temperature range are guaranteed by design/correlation and tested in production only at ambient temperature. 3. Guaranteed by design, but not tested in production. STELPD01
6 Functional description
6.1 Turn-on and soft start-up feature
Figure 5. Typical startup sequence for STELPD01 and STELPD01A (VOUT from 10% to 90%) is around 500 µs with VIN = 5 V. can be calculated using the following theoretical formula.
Figure 6. Delay time and VOUT ramp-up time Table 8. Rise time vs. CdV/dt, VIN = 5 V guaranteed by design/correlation and not tested in production.
6.2 Maximum load at startup
soft-start time, the inrush current is reduced and overtemperature fault is avoided. start-up time and in-rush current to limit the dynamic power stresses and avoid thermal shutdown during startup.
6.3 Normal operating condition
its input, except for a small voltage fall due to the N-channel MOSFET RDSon.
6.4 Output voltage clamp
dissipation increases and according to load current, the thermal shutdown can occur.
6.5 Current limiting
During operation, if the load current reaches the ILIM overload threshold, an overload is detected. The current limiting circuit opens the power MOSFET disconnecting the load. voltage VI(INT), during Vout falling edge, in order to signal the overload event to the system controller. below the VIL threshold and then releasing it.
output channel with soft-start ramp after a delay time of 100 µs. together with the graph in Figure 9 and Figure 10. Table 9. ILIM vs. RLIM Note: Missing or shorted R LIM causes current limit circuit malfunction and may lead to device damage. Note: R LIM value higher than 300 Ω can be used but as shown in Figure 9 the ILIM vs. RLIM relationships is flat.
6.6 Thermal shutdown function
is turned off and the load is disconnected. voltage VI(INT), in order to signal the overtemperature event to the system controller. below the VIL threshold and then releasing it.
6.7 EN/Fault pin
device status to the application. When it is used as a standard Enable pin, it can be connected to an external open-drain or open-collector device. turns on the output, since it has internal pull-up circuitry. order to keep the device in off-state.
Figure 7. EN/Fault driver circuit
6.8 External gate driver function for reverse blocking
blocking MOSFET for reverse-current protection (RCP). See Figure 4. the activation of external FET. voltage falls below the low-level threshold, or a fault event occurs.
Figure 8. External gate driver circuit
6.9 External capacitors and application guidelines
For the same reason, a COUT capacitor of at least 1 μF must be connected at the output port. μH, the input capacitor should be increased.
- Minimizing inductance of the input and output tracks
- TVS diodes on the input to absorb inductive spikes
- Schottky diode on the output to absorb negative spikes
- Combination of ceramic and electrolytic capacitors on the input and output STELPD01 External capacitors and application guidelines DS13254 - Rev 1 page 12/27
7 Typical characteristics
Figure 9. ILIM vs. RLIM Figure 10. ILIM vs. RLIM (magnification) Figure 11. Bias current vs. temperature (ON Mode) Figure 12. Bias current vs. temperature (Fault Mode)
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
8.1 DFN10L (3x3 mm) package information
Figure 34. DFN10L (3x3 mm) package outline
Package information
DS13254 - Rev 1 page 18/27
Table 10. DFN10L (3x3 mm) mechanical data Figure 35. DFN10L (3x3 mm) recommended footprint
8.2 DFN10 (3 x 3 mm) packing information
Figure 36. DFN10 (3 x 3 mm) reel drawing outline
9 Ordering information
Table 11. Order codes
- Version under development. Contact ST sales offices.
Ordering information
DS13254 - Rev 1 page 22/27
Revision history
Table 12. Document revision history 17-Jan-2022 1 Initial release.