STE180NE10_07 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: pROVIDED bY alldatasheet.com(free datasheet download site)
- PDF pages: 12
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuit
- 4 Package mechanical data
- 5 Revision history
N-channel 100V - 4.5mΩ - 180A - ISOTOP STripFET™ Power MOSFET General features ■ 100% avalanche tested ■ Low intrinsic capacitance ■ Gate charge minimized ■ Reduced voltage spread
Description
This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
Applications
■ Switching application Internal schematic diagram Type V DSS RDS(on) ID STE180NE10 100V <6m Ω 180A ISOTOP Order codes Part number Marking Package Packaging STE180NE10 E180NE10 ISOTOP Tube
1 Electrical ratings
Table 1. Absolute maximum ratings
- Pulse width limited by safe operating area
Table 2. Thermal data Table 3. Avalanche characteristics
2 Electrical characteristics
Table 4. On/off states Table 5. Dynamic
- Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
Table 6. Source drain diode
- Pulse width limited by safe operating area.
- Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
2.1 Electrical characteri stics (curves)
Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance
3 Test circuit
Figure 12. Switching times test circuit for Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test Figure 16. Unclamped inductive wavefo rm Figure 17. Switching time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
DIM. mm inch A 11.8 12.2 0.466 0.480 B 8.9 9.1 0.350 0.358 C 1.95 2.05 0.076 0.080 D 0.75 0.85 0.029 0.033 E 12.6 12.8 0.496 0.503 F 25.15 25.5 0.990 1.003 G 31.5 31.7 1.240 1.248 H4 0 . 1 5 7 J 4.1 4.3 0.161 0.169 K 14.9 15.1 0.586 0.594 L 30.1 30.3 1.185 1.193 M 37.8 38.2 1.488 1.503 N4 0 . 1 5 7 O 7.8 8.2 0.307 0.322 B E H O N J K L M F A C G D ISOTOP MECHANICAL DATA
5 Revision history
Table 7. Revision history