STD5100C SMCDIODE | Alldatasheet
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Circuit Diagram Applications Maximum Ratings: Characteristics Symbol Condition Max. Units PeakRepetitiveReverseVoltage WorkingPeakReverseVoltage DCBlockingVoltage VRRM VRWM VR 100 V AverageRectifiedForwardCurrent IF(AV) 50%dutycycle@Tc=95°C, rectangularwaveform 2.5(PerLeg) A5(PerDevice) PeakOneCycleNon-RepetitiveSurge Current(PerLeg) IFSM 8.3ms,HalfSinepulse 100 A Electrical Characteristics: Characteristics Symbol Condition Typ. Max. Units ForwardVoltageDrop (PerLeg)* VF1 @1A,Pulse,TJ =25C @2.5A,Pulse,TJ =25C 0.47 0.60 0.75 V VF2 @1A,Pulse,TJ =125C @2.5A,Pulse,TJ =125C 0.41 0.52 0.65 V ReverseCurrent(PerLeg)* IR1 @VR =ratedVR TJ =25C 3.6 100 uA IR2 @VR =ratedVR TJ =125C 1.35 15 mA JunctionCapacitance(PerLeg) CT @VR =5V,TC =25C fSIG =1MHz 167 - pF 150C TJ operation Ultralow forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring for enhanced ruggedness and long term reliability Trench MOS Schottky technology This is a Pb − Free Device All SMC parts are traceable to the wafer lot Additional testing can be offered upon request Switching power supply Converters Free-Wheeling diodes Reverse battery protection DPAK
Data Sheet N1470, Rev. A China - Germany - Korea - Singapore - UnitedStates http://www.smc-diodes.com - sales@smc-diodes.com STD5100C Characteristics Symbol Condition Specification Units JunctionTemperature TJ - -55to+150 C StorageTemperature Tstg - -55to+150 C TypicalThermalResistanceJunctionto Case(PerLeg) RJC DCoperation 2 C/W ApproximateWeight wt - 0.39 g CaseStyle DPAK Thermal-Mechanical Specifications: Ratings and Characteristics Curves Fig.2-Typical Reverse Characteristics Fig.3-Typical Instantaneous Forward Voltage Characteristics Fig.1-Typical Junction Capacitance TJ=125℃ TJ=25℃ TJ=25℃ TJ=25℃ TJ=125℃
Data Sheet N1470, Rev. A China - Germany - Korea - Singapore - UnitedStates http://www.smc-diodes.com - sales@smc-diodes.com STD5100C Forinformationontapeandreelspecifications,includingpart orientationandtapesizes,pleaserefertoourtapeandreel packagingspecification. Mechanical Dimensions DPAK SYMBOL Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.087 0.094 A1 0.00 0.127 0.000 0.005 b 0.66 0.86 0.026 0.034 c 0.46 0.60 0.018 0.024 D 6.50 6.70 0.256 0.264 D1 5.13 5.46 0.202 0.215 D2 4.83REF. 0.190REF. E 6.00 6.20 0.236 0.244 e 2.186 2.386 0.086 0.094 L 9.70 10.40 0.381 0.409 L1 2.90REF. 0.144REF. L2 1.40 1.70 0.055 0.067 L3 1.60REF. 0.063REF. L4 0.60 1.00 0.024 0.039 Φ 1.10 1.30 0.043 0.051 Θ 0° 8° 0° 8° h 0.00 0.30 0.000 0.012 V 5.35REF. 0.211REF. Ordering Information Marking Diagram Device Package Shipping STD5100C DPAK 2500pcs/reel Carrier Tape Specification DPAK SYMBOL Millimeters Min. Max. A 6.80 7.00 B 10.40 10.60 C 2.60 2.80 d Φ1.45 Φ1.65 E 1.65 1.85 F 7.40 7.60 P0 3.90 4.10 P 7.90 8.10 P1 1.90 2.10 W 15.90 16.30 WhereXXXXX is YYWWL ST =DeviceType D =Packagetype 5 =ForwardCurrent (5A) 100 =Reverse Voltage(100V) C =Configuration SSG =SSG YY =Year WW =Week L =Lot Number Cautions:Molding resin Epoxy resinUL:94V-0
Data Sheet N1470, Rev. A China - Germany - Korea - Singapore - UnitedStates http://www.smc-diodes.com - sales@smc-diodes.com STD5100C DISCLAIMER: 1-Theinformationgivenherein,includingthespecificationsanddimensions,issubjecttochangewithoutpriornoticetoimproveproduct characteristics.Beforeordering,purchasersareadvisedtocontacttheSMC-SangdestMicroelectronics(Nanjing)Co.,Ltdsales departmentforthelatestversionofthedatasheet(s). 2-Incaseswhereextremelyhighreliabilityisrequired(suchasuseinnuclearpowercontrol,aerospaceandaviation,trafficequipment, medicalequipment,andsafetyequipment),safetyshouldbeensuredbyusingsemiconductordevicesthatfeatureassuredsafetyorby meansofusers’fail-safeprecautionsorotherarrangement. 3-InnoeventshallSMC-SangdestMicroelectronics(Nanjing)Co.,Ltdbeliableforanydamagesthatmayresultfromanaccidentorany othercauseduringoperationoftheuser’sunitsaccordingtothedatasheet(s).SMC-SangdestMicroelectronics(Nanjing)Co.,Ltd assumesnoresponsibilityforanyintellectualpropertyclaimsoranyotherproblemsthatmayresultfromapplicationsofinformation, productsorcircuitsdescribedinthedatasheets. 4-InnoeventshallSMC-SangdestMicroelectronics(Nanjing)Co.,Ltdbeliableforanyfailureinasemiconductordeviceorany secondarydamageresultingfromuseatavalueexceedingtheabsolutemaximumrating. 5-Nolicenseisgrantedbythedatasheet(s)underanypatentsorotherrightsofanythirdpartyorSMC-SangdestMicroelectronics (Nanjing)Co.,Ltd. 6-Thedatasheet(s)maynotbereproducedorduplicated,inanyform,inwholeorpart,withouttheexpressedwrittenpermissionofSMC- SangdestMicroelectronics(Nanjing)Co.,Ltd. 7-Theproducts(technologies)describedinthedatasheet(s)arenottobeprovidedtoanypartywhosepurposeintheirapplicationwill hindermaintenanceofinternationalpeaceandsafetynoraretheytobeappliedtothatpurposebytheirdirectpurchasersoranythird party.Whenexportingtheseproducts(technologies),thenecessaryproceduresaretobetakeninaccordancewithrelatedlawsand regulations..