STC62WV2568 ETC1 | Alldatasheet

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Technical content

Jan. 20041 A17 Very Low Power/Voltage CMOS SRAM 256K X 8 bit

  • Wide Vcc operation voltage : 2.4V~5.5V
  • Very low power consumption : Vcc = 3.0V C-grade : 22mA (@55ns) operating current I- grade : 23mA (@55ns) operating current C-grade : 17mA (@70ns) operating current I- grade : 18mA (@70ns) operating current 0.3uA (Typ.) CMOS standby current Vcc = 5.0V C-grade : 53mA (@55ns) operating current I- grade : 55mA (@55ns) operating current C-grade : 43mA (@70ns) operating current I- grade : 45mA (@70ns) operating current 1.0uA (Typ.) CMOS standby current
  • High speed access time : -55 55ns -70 70ns
  • Automatic power down when chip is deselected
  • Three state outputs and TTL compatible The STC62WV2568 is a high performance, ve ry low power CMOS Static Random Access Memory organized as 262,144 words by 8 bits and operates from a wide range of 2.4V to 5.5V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.3uA at 3.0V/25 oC and maximum access time of 55ns at 3.0V/85 oC. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state output drivers. The STC62WV2568 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The STC62WV2568 is available in DICE form, JEDEC standard 32 pin 450mil Plastic SOP, 8mmx13.4mm STSOP and 8mmx20mm TSOP. „ DESCRIPTION „ FEATURES „ BLOCK DIAGRAM „ PRODUCT FAMILY „ PIN CONFIGURATIONS STC International Limited. reserves the right to modify document contents without notice. Address Input Buffer Row Decoder Memory Array 1024 x 2048 Column I/O Write Driver Sense Amp Column Decoder Data Buffer Output Address Input Buffer A8 A3 A2 A1 A10 Data Buffer Input Control Gnd Vdd OE DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 A16 A15 A13 256 2048 102420 A14 A12 STC62WV2568 A11 A0 OE A10 CE1 DQ7 DQ6 DQ5 DQ4 DQ3 GND DQ2 DQ1 DQ0 A11 A13 WE CE2 A15 VCC A17 A16 A14 A12 STC62WV2568TC STC62WV2568STC STC62WV2568TI STC62WV2568STI OE WE CE1CE2 STC A17 A16 A14 A12 DQ0 DQ1 DQ2 GND VCC A15 CE2 WE A13 A11 OE A10 CE1 DQ7 DQ6 DQ5 DQ4 DQ3 STC62WV2568S STC62WV2568SI POWER DISSIPATIONSPEED ( ns ) STANDBY ( ICCSB1, Max ) Operating ( ICC, Max )PRODUCT FAMILY OPERATING TEMPERATURE Vcc RANGE 55ns :3.0~5.5V Vcc=3.0V Vcc=3.0V PKG TYPE STC62WV2568DC DICE STC62WV2568TC TSOP-32 STC62WV2568STC STSOP-32 STC62WV2568SC +0 O C to +70 O C 2.4V ~5.5V 55/70 3.0uA 17mA SOP-32 STC62WV2568DI DICE STC62WV2568TI TSOP-32 STC62WV2568STI STSOP-32 STC62WV2568SI -40 O C to +85 O C 2.4V ~ 5.5V 55/70 5.0uA 18mA SOP-32 Vcc=5.0V Vcc=5.0V 10uA 30uA 43mA 45mA 70ns :2.7~5.5V
  • Fully static operation
  • Data retention supply voltage as low as 1.5V
  • Easy expansion with CE2, CE1, and OE options 70ns 70ns

Jan. 20042 Name Function A0-A17 Address Input These 18 address inputs select one of the 262,144 x 8-bit words in the RAM CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. DQ0-DQ7 Data Input/Output Ports These 8 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Gnd Ground „ TRUTH TABLE „ PIN DESCRIPTIONS STC CIN Input Capacitance VIN=0V 6 pF CDQ Input/Output Capacitance VI/O=0V 8 pF RANGE AMBIENT TEMPERATURE Vcc Commercial 0 O C to +70 O C 2.4V ~ 5.5V Industrial -40 O C to +85 O C 2.4V ~ 5.5V „ ABSOLUTE MAXIMUM RATINGS(1) „ OPERATING RANGE „ CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 1. This parameter is guaranteed and not 100% tested. SYMBOL PARAMETER RATING UNITS VTERM Terminal Voltage with Respect to GND -0.5 to Vcc+0.5 V TBIAS Temperature Under Bias -40 to +85 O C TSTG Storage Temperature -60 to +150 O C PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA MODE WE CE1 CE2 OE I/O OPERATION Vcc CURRENT XHXXNot selected (Power Down) XXLX High Z I CCSB, ICCSB1 Output Disabled H L H H High Z I CC Read H L H L D OUT ICC Write L L H X D IN ICC STC62WV2568 SYMBOL PARAMETER CONDITIONS UNIT MAX.

Jan. 20043 STC SYMBOL PARAMETER TEST CONDITIONS MIN. TYP . (1) M A X . UNITS VDR Vcc for Data Retention CE1 ≧ Vcc - 0.2V or CE2 ≦ 0.2V, VIN ≧ Vcc - 0.2V or V IN ≦ 0.2V 1.5 -- -- V ICCDR (3) Data Retention Current CE1 ≧ Vcc - 0.2V or CE2 ≦ 0.2V, VIN ≧ Vcc - 0.2V or V IN ≦ 0.2V -- 0.1 1.0 uA tCDR Chip Deselect to Data Retention Time 0 -- -- ns tR Operation Recovery Time See Retention Waveform TRC (2) -- -- ns 1. Typical characteristics are at TA = 25oC. 2. Fmax = 1/t RC . 3. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. „ DATA RETENTION CHARACTERISTICS ( TA = -40oC to + 85oC ) 1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time 3. IccDR_MAX. is 0.7uA at TA=70oC. „ DC ELECTRICAL CHARACTERISTICS ( TA = -40oC to + 85oC ) „ LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled ) CE1 Data Retention Mode Vcc t CDR Vcc t R VIHVIH Vcc VDR 1.5V≥ CE1 Vcc - 0.2V≥ „ LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled ) CE2 Data Retention Mode Vcc t CDR Vcc t R VILVIL Vcc VDR ≧ 1.5V CE2 ≦ 0.2V PARAMETER NAME PARAMETER TEST CONDITIONS MIN. TYP . (1) MAX. UNITS Vcc=3.0V VIL Guaranteed Input Low Voltage(3) Vcc=5.0V -0.5 -- 0.8 V Vcc=3.0V 2.0 -- VIH Guaranteed Input High Voltage(3) Vcc=5.0V 2.2 -- Vcc+0.3 V IIL Input Leakage Current Vcc = Max, VIN = 0V to Vcc -- -- 1 uA ILO Output Leakage Current Vcc = Max, CE1 = VIH or CE2=VIL or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA Vcc=3.0V VOL Output Low Voltage Vcc = Max, I OL = 2.0mA Vcc=5.0V -- -- 0.4 V Vcc=3.0V VOH Output High Voltage Vcc = Min, I OH = -1.0mA Vcc=5.0V 2.4 -- -- V 70ns Vcc=3.0V -- -- 18 ICC (5) Operating Power Supply Current Vcc=Max,CE1=V IL, CE2=VIH IDQ = 0mA, F = Fmax(2) 70ns Vcc=5.0V -- -- 45 mA Vcc=3.0V -- -- 0.5 ICCSB Standby Current-TTL Vcc = Max, CE1 = VIH or CE2=VIL IDQ = 0mA Vcc=5.0V -- -- 1.0 mA Vcc=3.0V -- 0.3 5 ICCSB1(4) Standby Current-CMOS Vcc = Max, CE1≧Vcc-0.2V or CE2≦0.2V ;VIN≧ Vcc - 0.2V or VIN≦0.2V Vcc=5.0V -- 1.0 30 uA STC62WV2568

Jan. 20044 „ AC ELECTRICAL CHARACTERISTICS ( TA = -40oC to + 85oC) READ CYCLE „ KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS MUST BE STEADY MAY CHANGE FROM H TO L DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY MUST BE STEADY WILL BE CHANGE FROM H TO L CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H STC STC62WV2568 „AC TEST CONDITIONS (Test Load and Input/Output Reference) Input Pulse Levels Vcc / 0V Input Rise and Fall Times 1V/ns Input and Output Timing Reference Level 0.5Vcc Output Load CL = 100pF+1TTL CL = 30pF+1TTL JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION (Vcc = 3.0~5.5V) (Vcc = 2.7~5.5V) UNIT tAVAX tRC Read Cycle Time 55 -- -- 70 -- -- ns tAVQV tAA Address Access Time -- -- 55 -- -- 70 ns tE1LQV tACS1 Chip Select Access Time -- -- 55 -- -- 70 ns tE2HOV tACS2 -- -- 55 -- -- 70 ns tGLQV tOE Output Enable to Output Valid -- -- 30 -- -- 35 ns t E1LQX tCLZ1 Chip Select to Output Low Z 10 -- -- 10 -- -- ns tE2HOX tCLZ2 10 -- -- 10 -- -- ns tGLQX tOLZ Output Enable to Output in Low Z 5- -- -5- -- - n s tE1HQZ tCHZ1 Chip Deselect to Output in High Z -- -- 30 -- -- 35 ns tE2HQZ tCHZ2 -- -- 30 -- -- 35 ns tGHQZ tOHZ Output Disable to Output in High Z -- -- 25 -- -- 30 ns tAXOX tOH Data Hold from Address Change 10 -- -- 10 -- -- ns Chip Select Access Time (CE2) (CE1) Chip Select to Output Low Z (CE1) (CE2) Chip Deselect to Output in High Z (CE1) (CE2) CYCLE TIME : 55ns CYCLE TIME : 70ns

Jan. 20045 STC READ CYCLE3 (1,4) READ CYCLE2 (1,3,4) NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = V IL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = V IL . 5. The parameter is guaranteed but not 100% tested. t CLZ (5) D OUT CE2 CE1 (5) t ACS2 t ACS1 t OH t RC t OE t CLZ2 t CHZ2 (2,5) D OUT CE2 CE1 OE ADDRESS (5) t CLZ1 (5) t ACS1 t ACS2 t CHZ1 (1,5) t OHZ (5) t OLZ t AA t CHZ1, t CHZ2 STC62WV2568 „ SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC t OHt AA D OUT ADDRESS t OH

Jan. 20046 STC STC62WV2568 „ SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WR1 t WC (3) t CW (11) (11) t CW (2) t WP t AW t OHZ (4,10) t AS t WR2 (3) t DH t DW D IN D OUT WE CE2 CE1 OE ADDRESS (5) (5) „ AC ELECTRICAL CHARACTERISTICS ( TA = -40oC to + 85oC ) WRITE CYCLE JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION (Vcc = 3.0~5.5V) (Vcc = 2.7~5.5V) UNIT tAVAX tWC Write Cycle Time 55 -- -- 70 -- -- ns tE1LWH tCW Chip Select to End of Write 55 -- -- 70 -- -- ns tAVWL tAS Address Setup Time 0 -- -- 0 -- -- ns tAVWH tAW Address Valid to End of Write 55 -- -- 70 -- -- ns tWLWH tWP Write Pulse Width 30 -- -- 35 -- -- ns tWHAX tWR1 Write recovery Time (CE1,WE) 0 -- -- 0 -- -- ns tE2LAX tWR2 (CE2) 0 -- -- 0 -- -- ns tWLQZ tWHZ Write to Output in High Z -- -- 25 -- -- 30 ns tDVWH tDW Data to Write Time Overlap 25 -- -- 30 -- -- ns tWHDX tDH Data Hold from Write Time 0 -- -- 0 -- -- ns tGHQZ tOHZ Output Disable to Output in High Z -- -- 25 -- -- 30 ns tWHOX tOW End of Write to Output Active 5 -- -- 5 -- -- ns Write recovery Time CYCLE TIME : 55ns CYCLE TIME : 70ns

Jan. 20047 STC NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. T WR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE1 going low or CE2 going high to the end of write. WRITE CYCLE2 (1,6) t WC t CW (11) (11) t CW (2) t WP t AW t WHZ (4,10) t AS t WR2 (3) t DH t DW D IN D OUT WE CE2 CE1 ADDRESS (5) (5) t OW (7) (8) (8,9) STC62WV2568

Jan. 20048 „ ORDERING INFORMATION STC „ PACKAGE DIMENSIONS STSOP - 32 STC62WV2568 Note: STC (STC International Limited.) assumes no responsibility for the application or use of any product or circuit described herein. STC does not authorize its products for use as critical components in any application in which the failure of the STC product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. PACKAGE S: SOP T: TSOP (8mm x 20mm) ST: Small TSOP (8mm x 13.4mm) D: DICE STC62WV2568X X Z Y Y GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC SPEED 55: 55ns 70: 70ns PKG MATERIAL -: Normal G: Green P: Pb free

Jan. 20049 STC „ PACKAGE DIMENSIONS (continued) TSOP - 32 STC62WV2568 BASE METAL WITH PLATING c c1 SECTION A-A b SOP -32