STB300NH02L_0709 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuit
- 4 Package mechanical data
- 5 Packaging mechanical data
- 6 Revision history
Features
■ RDS(on)*Qg industry’s benchmark ■ Conduction losses reduced ■ Switching losses reduced ■ Low profile, very low parasitic inductance
Description
This product utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This is suitable for high current OR-ing application.
Applications
■ Switching application – Specifically designed and optimized for high efficiency DC/DC converters – OR-ing Figure 1. Internal schematic diagram Table 1. Device summary
1 Electrical ratings
Table 2. Absolute maximum ratings
- This value is silicon limited
- Pulse width limited by safe operating area
- This value is rated according Rthj-case
Table 3. Thermal data Table 4. Avalanche characteristics
- Starting Tj = 25°C, I D = IAV, VDD = 20V
2 Electrical characteristics
Table 5. On/off states Table 6. Dynamic
Table 7. Switching times Table 8. Source drain diode
- Pulsed: pulse duration = 300µs, duty cycle 1.5%
2.1 Electrical characteri stics (curves)
Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Static drain-source on resistance Figure 7. Normalized BV DSS vs temperature
3 Test circuit
Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test Figure 17. Unclamped inductive wavefo rm Figure 18. Switching time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
A 4.40 4.60 0.17 3 0.181 b 0.61 0. 88 0.024 0.0 34 b1 1.14 1.70 0.044 0.066 c0 . 4 9 0.70 0.01 9 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0. 393 0.409 e 2.40 2.70 0.0 94 0.106 e1 4. 95 5.15 0.1 94 0.202 F1 . 2 3 1.32 0.04 8 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.0 94 0.107 L1 3 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L302 8.90 1.1 37 ∅P 3.75 3.85 0.147 0.151 Q2 . 6 5 2 . 95 0.104 0.116
D²PAK mechanical data Dim mm inch Min Typ Max Min Typ Max A 4.4 4.6 0.17 3 0.181 A1 2.4 9 2.69 0.098 0.106 A2 0.0 3 0.23 0.001 0.00 9 B 0.7 0. 93 0.027 0.0 36 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.02 3 C2 1.2 3 1.36 0.04 8 0.053 D 8.95 9.350 . 352 0. 368 D1 8 0.315 E 10 10.4 0. 393 0.409 E1 8.5 0. 334 G4 . 88 5.28 0.1920 . 2 0 8 L1 5 1 5 . 85 0.5 90 0.625 L2 1.27 1.4 0.50 0.55 L3 1.4 1.75 0.055 0.6 8 M2 . 4 3.2 0.0 940 . 1 2 6 R 0.4 0.015 V2 0° 4°
Packaging mechanical data STB300NH02L - STP300NH02L
5 Packaging mechanical data
- on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA
6 Revision history
Table 9. Document revision history