ST7GEME4 STMICROELECTRONICS | Alldatasheet
Document overview
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Technical content
Datasheet sections
- 1 Introduction
- 2 Pin description
- 3 ST7GEME4 implementation
- 3.1 Functionality
- 3.2 Smartcard interface features
- 3.3 EMV versus PC/SC-ISO mode
- 4 Electrical characteristi cs
- 4.1 Absolute maximum ratings
- 4.2 Recommended operating conditions
- 4.3 Supply and reset characteristics
- 4.4 Clock and timing characteristics
- 4.4.1 General timings
- 4.4.2 Crystal resonator oscillators
- 4.5 Memory characteristics
- 4.6 Smartcard supply supervisor electrical characteristics
- 4.7 EMC characteristics
- 4.7.1 Functional EMS (ele ctromagnetic susceptibility)
- 4.7.2 Electromagnetic interference (EMI)
- 4.7.3 Absolute maximum ratings (electrical sensitivity)
- 4.8 Communication interface characteristics
- 5 Package characteristics
- 5.1 Package mechanical data
- 6 Revision history
Features
■ Clock, reset and supply management – Low voltage reset – Halt power saving mode – PLL for generating 48 MHz USB clock using a 4 MHz crystal ■ USB (Universal Serial Bus) interface – USB 2.0 compliant – CCID V1.0 – Full speed, hubless – Bus-powered, low consumption ■ Serial RS232 interface – Transmission rate: 9.6 Kbps to 115 Kbps – Format: 8-bit, no parity – Auto baud rate – CCID V1.0 on serial TTL link ■ ISO 7816-3 UART interface – 4 Mhz clock generation – Synchronous/Asynchronous protocols (T=0, T=1) – Automatic retry on parity error – Programmable baud rate from 372 to 11.625 clock pulses (D=32/F=372) – Card insertion/removal detection ■ Smartcard power supply – Selectable card V CC: 1.8 V, 3 V, and 5 V – Internal Step-up converter for 5V supplied Smartcards (with a current of up to 55mA) using only two external components. – Programmable smartcard internal voltage regulator (1.8 to 3.0 V) with current overload protection and 4 kV ESD protection (Human Body Model) for all smartcard interface I/Os ■ Development tools – Application note on PCB recommendations and component bill of materials – Full hardware/software kit for performance evaluation
Description
The ST7GEME4 is an 8-bit microcontroller dedicated to smartcard reading applications. It has been developed to be the core of smartcard readers communicating through a serial or USB link. It is pre-programmed using Gemplus software, and offers a single integrated circuit solution with very few external components. VFQFPN24 SO24(9U) Table 1. Device summary User RAM + USB data buffer (bytes) 512 + 256 Peripherals USB Full-Speed (7 Ep), TBU, Watchdog timer, ISO 7816-3 Interface Operating Supply 4.0 to 5.5 V CPU Frequency 4 or 8 MHz Operating temperature 0 to +70 °C
1 Introduction
The ST7GEME4 device is a member of the ST7 microcontroller family designed for USB applications. All devices are based on a common industry-standard 8-bit core, featuring an enhanced instruction set. The ST7GEME4 is factory-programmed ROM devices and as such are not reprogrammable. It operates at a 4 MHz external oscillator frequency. Under software control, all devices can be placed in Halt mode, reducing power consumption when the application is in idle or stand-by state. The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes. The ST7GEME4 includes an ST7 Core, up to 16 Kbytes of program memory, up to 512 bytes of user RAM and the following on-chip peripherals:
- USB full speed interface with 7 endpoints, programmable in/out configuration and embedded 3.3 V voltage regulator and transceivers (no external components are needed).
- ISO 7816-3 UART interface with programmable baud rate from 372 clock pulses up to 11.625 clock pulses
- Smartcard supply block able to provide programmable supply voltage and I/O voltage levels to the smartcards
- Low voltage reset ensuring proper power-on or power-off of the device (selectable by option)
- 8-bit timer (TBU)
Figure 1. ST7GEME4 block diagram
48 MHz
2 Pin description
Figure 2. 24-lead VFQFPN package pinout Figure 3. 24-pin SO package pinout
18 LED0
- Type: I = input, O = output, S = supply
- In/Output level: CT = CMOS 0.3VDD/0.7VDD with input trigger
- Output level: HS = 10mA high sink (on N-buffer only)
- Port and control configuration: – Input: float = floating, wpu = weak pull-up, int = interrupt, ana = analog – Output: OD = open drain, PP = push-pull
Table 2. Pin description
47 C 4 O C T X X Smartcard C4
69 C 8 O C T X X Smartcard C8
13 16 V PP S Must be held low in normal operating mode.
Figure 4. Smartcard interface reference application - 24-pin SO package
- Mandatory values for the external components:
Table 2. Pin description (continued)
ST7GEME4 implementation ST7GEME4
3 ST7GEME4 implementation
The ST7GEME4 has been developed to offer a complete ready-to-use firmware solution which allows fast development and rapid time-to-market of smartcard reader applications. It offers a single IC solution and simplifies the integration of smartcard interfaces into electronic devices such as computers, POS terminals, mobile phones, PDAs, home routers, and set-top boxes. Pre-programmed with communication software from our partner GEMPLUS, the ST7GEME4 is a complete firmware solution controlling the communication between ISO 7816 1-2-3-4 cards and a host system. An evaluation kit and reference design with a complete bill of materials and PCB recommendations are available. The ST7GEME4 complies with EMVCo/EMV2000 standards. Software support and engineering expertise in system integration and PCB design are available as additional services.
3.1 Functionality
The core functionality of ST7GEME4 resides in its pre-programmed software embedded in ROM memory. GemCore TM technology manages the communication protocol to/from the host computer and the external card. Basic features and compliance are described in the features section and in Table 3 on page 11. A dedicated analog block provides smartcard power supplies 1.8 V, 3 V, and 5 V necessary to interface with different card voltages available on the market. Voltages are selected by software. External LEDs can also be directly connected to dedicated I/Os. A dedicated UART interface provides an ISO 7816 communication port for connection with the smartcard connector. A full-speed USB interface port allows external connection to a host computer. An optional RS232 connection is also available on dedicated I/Os.
3.2 Smartcard interface features
The ST7GEME4 firmware includes the following features:
- Compatibility with asynchronous cards
- Compatibility with T=0 and T=1 protocols
- Compatibility with EMV and PC/SC modes.
- Compatibility with ISO 7816-3 and 4 and ability to supply the cards with 5V, 3V or 1.8V (class A, B or C cards, respectively)
- Resume/wake-up mode upon smartcard insertion/removal Further details on smartcard management can be found in "Gemcore USB Pro reference manual" from Gemplus. The reader is able to communicate with smartcards up to the maximum baud rate allowed, namely 344 086 bps (TA1=16) for a clock frequency of 4 MHz. Because the size of the smartcard buffer is 261 bytes, care must be taken not to exceed this size during APDU exchanges when the protocol in use is T=1.
3.3 EMV versus PC/SC-ISO mode
- An EMV mode, based on the EMV4.1 specifications
- A PC/SC-ISO mode which allows to manage of a smartcard according to the PC/SC and ISO 7816-3 standards The default mode is PC/SC, however, the reader can switch between EMV and PC/SC-ISO modes. GemCore2000 is a utility in charge of managing the switching between the two modes. When the utility is activated, the reader attempts EMV mode management whenever a smartcard is inserted. If reading is succe ssful, PC/SC mode will not be available. Caution: The activation of the GemCore2000 utility must be done before any card command. Any activation of the GemCore2000 utility is not recommended unless the reader is reset. The EMV mode fails if:
- The smartcard has not sent an EMV-compliant answer to reset (ATR)
- Negotiation of the buffer size with a T=1 card has failed Using PC/SC-ISO mode with GemCore2000 The reader switches to PC/SC mode after the application or the driver has sent the appropriate dedicated command to the reader (with a proprietary Escape command). In this case, the reader remains in PC/SC mode as long as the card remains in the reader. Whenever the EMV mode fails, the smartcard is powered off. After the host application has sent the PC/SC switch (proprietary) Escape command, the application must send a new Card Power On command. When the reader deals with an EMV card, the data exchanged between the reader and the host consists of short APDU messages. When the card is not EMV-compliant and the reader is set to PC/SC-ISO mode, the reader exchanges TPDU messages with the host. Restriction: character level and the extended APDU are not implemented in ST7GEME4 solution.
Table 3. Technical features
Table 3. Technical features (continued)
4 Electrical characteristics
4.1 Absolute maximum ratings
higher than the specified maximum rated voltages. 10kΩ pull-up or pull-down resistor. Table 4. Absolute maximum ratings
4.2 Recommended operating conditions
Operating conditions are given for TA = 0 to +70 °C unless otherwise specified. Table 5. Thermal characteristics Table 6. General operating conditions Table 7. Current injection on I/O port and control pins (1)
- When several inputs are submitted to a current inject ion, the maximum injected current is the sum of the
positive (resp. negative) currents (instantaneous values).
- Positive injection. The I INJ+ is done through protection diodes insulated from the substrate of the die.
- For SmartCard I/Os, VCRDVCC has to be considered.
- The negative injected current, I INJ-, passes through protection diodes which are NOT INSULATED from the
a maximum impedance close to 50kΩ.
- Location of the negative current injection: Pure digital pins can tolerate 1.6mA. In addition, the best choice
is to inject the current as far as possible from the analog input pins.
Table 8. Current consumption (1)
- All I/O pins are in input mode with a static value at V DD or VSS; clock input (OSCIN) driven by external
- CPU running with memory access , all I/O pins in input mode with a static value at VDD or VSS; clock input
(OSCIN) driven by external square wave. Table 9. I/O port pins characteristics
- Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
- Guaranteed by design, not tested in production.
4.3 Supply and reset characteristics
4.4 Clock and timing characteristics
4.4.1 General timings
Table 12 characteristics are measured at T = 0 to +70 oC unless otherwise specified. Table 10. LED pins characteristics Table 11. Low voltage detector and supervisor characteristics (LVDS)
- Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
Table 12. General timings
- Data based on typical application software.
- Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles
needed to finish the current instruction execution.
- ∆tINST is the number of tCPU to finish the current instruction execution.
Figure 5. Typical application with an external clock source Table 13. External clock source
- Data based on design simulation and/or technology characteristics, not tested in production.
4.4.2 Crystal resonator oscillators
Table 14. Crystal resonator oscillator characteristics
- The oscillator selection can be optimized in terms of s upply current using an high quality resonator with small RS value.
Refer to crystal resonator manufacturer for more details. Table 15. Typical crystal resonator characteristics
- Resonator characterist ics given by the crystal resonator manufacturer.
- t SU(OSC) is the typical oscillator start-up time measured between VDD=2.8 V and the fetch of the first instruction (with a quick
VDD ramp-up from 0 to 5 V (<50 µs). Table 16. Recommended values for 4 MHz crystal resonator
- R SMAX is the equivalent serial resistor of the crystal (see crystal specification).
Figure 6. Typical application with a crystal resonator
4.5 Memory characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
4.6 Smartcard supply supervisor electrical characteristics
Table 17. RAM and hardware registers
- Minimum V DD supply voltage without losing data stored in RAM (in Halt mode or under Reset) or in
hardware registers (only in Halt mode). Not tested in production. Table 18. Smartcard supply supervisor characteristics
5 V regulator output (for IEC 7816-3 Class A Cards)
3 V regulator output (for IEC 7816-3 Class B Cards)
Table 18. Smartcard supply supervisor characteristics (continued)
4.7 EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
4.7.1 Functional EMS (elect romagnetic susceptibility)
- ESD: electrostatic discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard.
- FTB: a burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in the table below based on the EMS levels and classes defined in application note AN1709. Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. TOHL Output high to low fall time(1) Cl = 30 pF - 0.8 µs TOLH Output low to high rise time(1) Cl = 30 pF - 0.8 µs ISGND Short-circuit to ground(1) 15 mA Smartcard RST C4 and C8 Pin VOL Output low Level Voltage I = -0.5 mA - - 0.4 (3) V VOH Output high level voltage I = 20 µAV CRDVCC-0.5(3) -V CRDVCC (3) V TOHL Output high to low fall time(1) Cl = 30 pF - 0.8 µs TOLH Output low to high rise time(1) Cl = 30 pF - 0.8 µs ISGND Short-circuit to ground(1) 15 mA 1. Guaranteed by design. 2. V DD = 4.75 V, Card consumption = 55mA, CRDCLK frequency = 4MHz, LED with a 3mA current, USB in reception mode and CPU in WFI mode. 3. Data based on characterization results, not tested in production.
- Corrupted program counter
- Unexpected reset
- Critical Data corruption (control registers...) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
4.7.2 Electromagnetic interference (EMI)
norm SAE J 1752/3 which specifies the board and the loading of each pin. Table 19. EMS characteristics Table 20. EMI characteristics
- Data based on characterization results, not tested in production.
0.1 MHz to
30 MHz 19 18
30 MHz to
130 MHz 32 27
130 MHz to
4.7.3 Absolute maximum rati ngs (electrical sensitivity)
product is stressed in order to determine its performance in terms of electrical sensitivity. For more details, refer to the application note AN1181. Body Model is simulated. This test conforms to the JESD22-A114A standard.
- LU: 3 complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the application note AN1181.
- DLU: Electrostatic discharges (one positive then one negative test) are applied to each pin of 3 samples when the micro is running to assess the latch-up performance in dynamic mode. Power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the micro and the component is put in reset mode. This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details, refer to the application note AN1181.
Table 21. Absolute maximum ratings
- Data based on characterization results, not tested in production.
Table 22. Electrical sensitivities
- Class description: A Class is an STMi croelectronics internal specification. All its limits are higher than the
Class strictly covers all the JEDEC criteria (international standard).
4.8 Communication interface characteristics
Figure 7. USB data signal rise and fall time Table 23. USB DC electrical characteristics (1)
- RL is the load connected on the USB drivers. Al l the voltages are measured from the local ground
Table 24. USB full speed electrical characteristics
- Measured from 10% to 90% of the data signal. For mo re detailed informations, please refer to Chapter 7
(Electrical) of the USB specification (version 1.1).
5 Package characteristics
5.1 Package mechanical data
Figure 8. 24-lead very thin fine pitch quad fl at no-lead 5x5 mm 0.65 mm pitch, package outline Table 25. 24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data
- Values in inches are converted from mm and rounded to 3 decimal digits.
Figure 9. 24-pin plastic small outline package- 300-mil width, package outline Table 26. 24-pin plastic small outline package- 300-mil width, mechanical data
6 Revision history
Table 27. Document revision history 10-May-2007 1 Root part number c hanged from ST7GEM to ST7GEME4. Introduction and Table 3: Technical features. updated to remove A2 and A3 dimensions.