ST70-27F SHINDENGEN | Alldatasheet
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Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd RATINGS SHINDENGEN OUTLINE DIMENSIONS (Unit : mm) Case : STO-220 STO-220Trankiller ST70-27F
- Absolute Maximum Ratings Item Symbol Conditions Ratings Unit Storage Temperature Tstg -40 ～150 ℃ Junction Temperature Tj 150 ℃ Peak Surge Reverse Power PRSM 10/1000μs, Non-repetitive 7000 W Peak Surge Reverse Current IRSM 10/1000μs, Non-repetitive 180 A Maximum Reverse Voltage VRM 23 V
- Electrical Characteristics (Tl=25℃) Item Symbol Conditions Ratings Unit Breakdown Voltage VBR IR = 1mA 24.3～29.7 V Clamping Voltage VCL IPP = 180A MAX 40 V Off-State Current IR VR = VRM MAX 5 μA
0.001 0.01 0.1 100 1000 26 28 30 32 34 36 38 ST70-27F TYP 10 × 1000µs Clamping Voltage VCL [V] Peak Current IP [A]
IR = 1mA Junction Temperature Tj [ °C] Breakdown Voltage VBR [V]
0.01 0.1 100 0 50 100 150 ST70-27F TYP VR = 23V Junction Temperature Tj [ °C] Reverse Current I R [µA]
Peak Surge Reverse Current 100 1000 0.1 1 10 ST70-27F IRSM tP IRSM/2 Pulse Width tP [ms] Peak Surge Reverse Current I RSM [A] Current Waveform Non-repetitive Tj=25°C
VR = 23V Frequency f [kHz] Junction Capacitance Cj [pF]
0.1 1 10 ST70-27F TYP f = 100kHz Applied Voltage VR [V] Junction Capacitance Cj [pF]
0 20 40 60 80 100 120 140 160 ST70-27F Derating Curve Glass-epoxy substrate Soldering land 11 × 11mm 45 × 45 × 1.6mm Lead Temperature Tl [ °C] Forward Power Dissipation P F [A]
0 20 40 60 80 100 120 140 160 ST70-27F Derating Curve Sine Wave R-load Free in air Glass-epoxy substrate Soldering land 11 × 11mm 45 × 45 × 1.6mm Ambient Temperature Ta [ °C] Forward Power Dissipation P F [A]
Transient Thermal Impedance 0.01 0.1 100 ST70-27F 10-4 10-3 10-2 10-1 100 101 102 103 0.05 0.50.2 20 5052 200 500 2000 5000 θja θjlGlass-epoxy substrate Soldering land 11 × 11mm 45 × 45 × 1.6mm Time t [s] Transient Thermal Resistance θja θjl [°C/W]
ST70-27F Forward Power Dissipation SIN DC Tj = 150°C Average Rectified Forward Current I O [A] Forward Power Dissipation P F [W]