ST4SIM-200M STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 26
Technical content
Datasheet sections
- 1 Description
- 2 Cellular connectivity solutions overview
- 4 Additional embedded secure element (eSE)
- 5 Card OS technical features
- 5.1 Supported standards and networks
- 5.2 Algorithms and cryptography
- 5.3 Over the air (OTA) functionality
- 5.4 Memory management
- 6 Electrical characteristics
- 6.1 Absolute maximum ratings
- 6.2 Recommended power supply filtering
- 6.3 AC and DC characteristics
- 7 Package information
- 7.1 VFDFPN8 package information
- 7.1.1 Wettable flank for manufacture of inspectable solder joint
- 7.1.2 Pinout information
- 7.1.3 Tape and reel packing
- 7.2.1 D16 micromodule pinout information
- 7.3 WLCSP11 package information
- 8 Acronyms and abbreviations
Features
- Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
- Bootstrap connectivity profile provided by a trusted partner
- Up to 7 connectivity profiles (depending on memory size)
- Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
- Network access applications supported: SIM / USIM / ISIM / CSIM
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP & HTTPS (including DNS)
- Multi-interfaces able to combine eSIM + eSE Hardware
- Product available on ST33G1M2M
- ST33 product based on a 32-bit Arm ® SecurCore® SC300™ RISC core
- Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
- Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
- Serial peripheral interface (SPI), depending on packages
- Industrial qualification (JEDEC JESD47)
- Operating temperature: -40°C to +105°C
- Common Criteria EAL5+ ECOPACK-compliant packages
- 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
- VFDFPN8 5 × 6 mm, wettable flank (MFF2)
- WLCSP11 Security
- Symmetric cryptography DES / 3DES / AES
- Asymmetric cryptography RSA (up to 2048 bits)
- HTTPS remote management TLS v1.0, v1.1 and v1.2
- Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
- Authentication algorithm: MILENAGE, TUAK, CAVE Software standard compliance
- GSMA SGP.02 v3.2
- SIMalliance interoperable profile v2.1
- Java ® Card v3.0.4 Classic
- GlobalPlatform ® card specification v2.2, including GP amendments A, B, C, D and E
- ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
- Power saving features (PSM and eDRX) defined by ETSI release 13 Product status link ST4SIM-200M eSIM GSMA system-on-chip solution for secure M2M industrial applications ST4SIM-200M Data brief DB4082 - Rev 5 - January 2021 For further information contact your local STMicroelectronics sales office.
- GlobalPlatform ®-certified "Muse eUICC-i2 v1" compliant with GSMA SGP.02 v3.2
Applications
- Cellular Connected Nodes
- LTE: Cat M1 and NBIoT
- Surveillance
- IoT for smart home and city such as gas metering
- IoT for smart industry such as tracking ST4SIM-200M DB4082 - Rev 5 page 2/26
1 Description
The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices. It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2. The device can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on). The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element). The device provides a secure and interoperable Java® Card environment compliant with Java® Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications. The device integrates a dynamic memory management with Java® Card garbage collection mechanism optimizing the usage of the memory. The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core. Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. Note: Java is a registered trademark of Oracle and/or its affiliates. ST4SIM-200M
Description
2 Cellular connectivity solutions overview
SIM card connector and the plastic SIM card. This is the traditional SIM concept inherited from the mobile phone. Figure 1. SIM solution overview device. It reduces the board footprint and there is no need for a SIM connector. Figure 2. eSIM solution overview The eSIM GSMA solution extends this traditional SIM / eSIM solution.
The ST4SIM-200M can host up to 7 profiles. Each profile has sufficient memory size available in the device or can have a specific memory size coded using the cumulative granted memory defined by GlobalPlatform amendment This profile is described by the SIMalliance interoperable profile package specification. The ST4SIM-200M fully supports SIMalliance interoperable profile package v2.1. No proprietary features are introduced and profiles are coded according to ASN.1 / DER coding. The ST4SIM-200M is an interoperable solution. The device already integrates most of main operators (MNO / MVNO) and it is possible to integrate any operator profile or personalized profile compliant with the SIMalliance specification. ST4SIM-200M eSIM GSMA solution DB4082 - Rev 5 page 6/26
4 Additional embedded secure element (eSE)
This eSE section is used to provide secure storage, cryptographic services, and so on via Java® Card applets. Figure 5. ST4SIM-200M architecture eSIM & eSE overview The embedded secure element is optional and configurable. Contact the local STMicroelectronics sales office for more details on the pin configuration.
5 Card OS technical features
5.1 Supported standards and networks
The ST4SIM-200M solution complies with the standard networks (2G / 3G / 4G LTE) and low power networks (CAT-M / NB-IoT). From a technical point of view, the ST4SIM-200M solution integrates all advanced NAAs for eSIM solution:
- USIM applications providing access to universal mobile telecommunications system (UMTS) networks,
- IP multimedia services identity module (ISIM) to access IP multimedia subsystem (IMS) networks,
- CDMA subscriber identity module (CSIM) including CAVE algorithm. To grant mobile network operators (MNO) the best solution for UICC-centric services either owned by the MNO or by third parties, the ST4SIM-200M complies with GlobalPlatform® Card Specifications v2.2 (depending on UICC configuration) and related amendments.
5.2 Algorithms and cryptography
The ST4SIM-200M supports the following standard authentication algorithms:
- CAVE
- MILENAGE
- TUAK The MILENAGE algorithm enables authorized access to UMTS/LTE networks with an easy and flexible parameter customization, according to specific MNO requirements. The TUAK authentication algorithm is supported with both 128-bit key length and 256-bit key length. In addition to these algorithms, the ST4SIM-200M also supports the "3GPP test algorithm" for test profiles. In order to increase security performance, the ST4SIM-200M also incorporates a ratification counter that limits the number of authentication attempts to prevent brute-force attacks designed to break algorithms. In addition, all algorithms support dedicated DPA/SPA attack countermeasures. Besides standard symmetric cryptography and hashing algorithms (DES, Triple DES, AES, MD5, and so on), the ST4SIM-200M provides a cryptographic co-processor with asymmetric cryptography capabilities. For applications requiring the strongest level of cryptography, the ST4SIM-200M supports:
- RSA with a key length of up to 2048 bits
- elliptic curve cryptography (ECC) with a key length of up to 521 bits. In addition, the ST4SIM-200M fully supports the PKCS#15 standard and offers a rule-based access control mechanism such as digital signature/certificates for data/applications requiring a strong level of cryptography. The security algorithm implementation adheres to the chip security guidelines of the ST33G1M2M to guarantee the best security level (for more information, contact the local STMicroelectronics sales office).
5.3 Over the air (OTA) functionality
The ST4SIM-200M supports over the air protocol for remote application management (RAM) and remote file management (RFM) compliant with ETSI standard (ETSI TS 102 225 and ETSI TS 102 226 specifications Release 12). The RAM application is also fully supported by GlobalPlatform v2.2 and the related amendment B (which enables remote applet management and remote file management over HTTP/TLS). TLS v1.0, 1.1 and 1.2 are available in the ST4SIM-200M. In addition, the ST4SIM-200M integrates a DNS mechanism allowing the card to request the HTTPS server address from a DNS server. The ST4SIM-200M is able to remotely control the execution of APDU commands over the air, to administrate the card content. It also allows proactive commands to interact with the host device. The ST4SIM-200M supports the secured packet structure and the remote APDU structure for (U)SIM toolkit applications, conforming 3GPP TS 31.115 and TS 31.116 specifications. The CAT-TP protocol defined by ETSI release 7 is supported. ST4SIM-200M Card OS technical features DB4082 - Rev 5 page 8/26
As it is compliant with the ETSI, 3GPP and 3GPP2, the ST4SIM-200M can easily be integrated into any OTA platform compliant with relevant standards. STMicroelectronics cards are field-proven to be interoperable with the mainstream OTA platforms commonly chosen by mobile network operators.
5.4 Memory management
The OTA mechanism includes the support of 3G UICC administrative commands as specified by ETSI TS 102 222. These commands are integrated by a powerful dynamic memory management that allows complete smart memory defragmentation. Dynamic memory management provides:
- Common space for files, packages, applets and objects
- Memory recovery on deletion operations
- Total free memory available in the select MF response. The OTA mechanism is designed to allow a very fast and silent memory recovery, absolutely safe for the end user data. The ST4SIM-200M is capable of enhancing intrinsic Flash memory cells for files requiring intense update and high reliability. Memory quota mechanism based on the GlobalPlatform Amendment C (CGM) is supported. The mechanism can be disabled at card configuration. Volatile memory management is based on an STMicroelectronics patented mechanism that optimizes the available resources for the enabled profile while guaranteeing resources for the downloading profile and the disabled profiles. ST4SIM-200M Memory management DB4082 - Rev 5 page 9/26
6 Electrical characteristics
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. Users should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.
6.1 Absolute maximum ratings
Table 1. Absolute maximum ratings
- Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb-free assembly), the ST ECOPACK® 7191395
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
6.2 Recommended power supply filtering
shown in the following figure. Figure 6. Recommended filtering capacitors on VCC
Electrical characteristics
Table 2. Maximum VCC rising slope
6.3 AC and DC characteristics
These characteristics are compliant with ETSI TS 102 671 release 12.
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
7.1 VFDFPN8 package information
VFDFPN8 is a "very thin fine pitch dual flat no lead package" with wettable flanks, dimensions 5 × 6 mm and 1.27 mm pitch. This package is compliant with JEDEC J-STD-020D and MSL 1 specifications. It is also compliant with MFF2 (Machine-to-machine form factor 2) ETSI specifications (M2M UICC - TS102.671). Figure 7. VFDFPN8 - outline Note: Drawing is not to scale.
Package information
Table 3. VFDFPN8 - mechanical data
- The dimensions are converted from mm and rounded to 4 decimal digits.
7.1.1 Wettable flank for manufacture of inspectable solder joint
of the solder joint between the leads and the PCB pads. Figure 8. Regular DFN (non-wettable flank) Figure 9. DFN wettable flank of the lead frame manufacturing process. solder joints by automated optical inspection.
Figure 10. Solder joint side view Figure 11. Solder joint top view This package is compliant with machine to machine form factor defined by ETSI in TS 102 671.
7.1.2 Pinout information
described in the following figure and table together with PCB integrations recommendations in Figure 13. Figure 12. VFDFPN8 pinout (top view)
8 VCC
Table 4. Pin descriptions
Figure 13. ST4SIM-200M PCB integration recommendations Note: C1 decoupling capacitors as recommended in Figure 6. Recommended filtering capacitors on VCC. R1: 20 kΩ external pull-up recommended on I/O.
7.1.3 Tape and reel packing
transparent antistatic or conductive. The STMicroelectronics Tape & Reel specifications are compliant to the EIA 481-A standard specification. Table 5. Packing on tape and reel
All elements; card and micromodule, are designed to run at a temperature of -40 °C to +105 °C. The ST4SIM-200M is available for different card plugin packages as detailed in the table below. Table 7. SIM plugin package types and dimensions Note: These formats comply to the ISO/IEC 7810 and ETSI TS 102 221 standards.
7.2.1 D16 micromodule pinout information
given in the figure below and contact description is in the following table.
Figure 18. D16 micromodule contact assignment Table 8. D16 contact descriptions
7.3 WLCSP11 package information
8 Acronyms and abbreviations
Table 9. Glossary
PIN Personal identification number PKCS Public key cryptographic standards PoC Proof of concept PUK PIN unlock key RAM Remote application management RFM Remote file management RISC Reduced instruction set computer RSA Ron Rivest, Adi Shamir and Leonard Adleman Public-key cryptosystem SCP Secure channel protocol SE Secure element SIM Subscriber identity module SM-DP Subscription manager - data preparation SM-SR Subscription manager - Secure routing SMS Simple message system TAR Toolkit application reference TLS Transport layer security UICC Universal integrated circuit card UMTS Universal mobile telecommunications systems USIM Universal subscriber identity module WLCSP Wafer level chip size package ST4SIM-200M Acronyms and abbreviations DB4082 - Rev 5 page 21/26
Revision history
Table 10. Document revision history 25-Nov-2019 1 Initial release. Modified Section 1 Description. characteristics and Section 7 Package information.
- Section 2 Cellular connectivity solutions overview
- Section 3 eSIM GSMA solution
- Section 5.1 Supported standards and networks
- Section 7.1.1 Wettable flank for manufacture of inspectable solder joint
- Section 7.1.3 Tape and reel packing
- Section 7.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)
- Section 7.3 WLCSP11 package information Updated:
- Section 7.1 VFDFPN8 package information Moved Section 7.1.2 Pinout information 19-Jan-2021 5 Updated:
- The document title
- Section 1 Description
- Table 7. SIM plugin package types and dimensions ST4SIM-200M DB4082 - Rev 5 page 22/26