ST3M01 STMICROELECTRONICS | Alldatasheet
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■ ONLY TWO CELL NEED AS INPUT ■ THREE REGULATED OUTPUT 1) HIGH EFFICENCY PFM DC/DC CONVERTER 3.3V AT 200mA (87% EFFICENCY) 2) VERY LOW NOISE AND VERY LOW DROP V REG (3V AT 20mA) 3) VERY LOW NOISE AAND VERY LOW DROP V REG (1.9V AT 20mA) ■ LOGIC CONTROLLED ELECTRONIC SHUTDOWN ■ LOW BATTERY DETECTOR ■ VIRTUAL GND PIN ■ TEMPERATURA RANGE: -40 TO 85°C ST3M01 TRIPLE VOLTAGE REGULATOR SHDN DC/DC Linear A Linear B IN_Linear OUT DC/DC OUT LA OUT LB 150 µF 1 µF 15 µH DC/DC RefRef Vref Lx Virtual GND 100 nF GND_SW GND_Signal IN_SW Vin 150 µF 1 µF 1 KΩ LBO On-Mode Off-Mode SCHEMATIC DIAGRAM SO-14
Symbol Parameter Value Unit VIN DC Input Voltage (Both IN_Linear and IN_SW) -0.3 to 7 V VSHDN Shutdown Input Voltage -0.3 to V IN+0.3 V VLX Switch Voltage -0.3 to 7 V VLBO Low Battery Output Voltage -0.3 to 7 V Vvirtual_GNDVirtual GND Output Voltage -0.3 to 7 V ILBO Low Battery Output Maximum Current 30 mA Ivirtual_GND Virtual GND Output Maximum Current 30 mA Tstg Storage Temperature Range -65 to +150 °C Top Operating Junction Temperature Range -40 to +85 °C Symbol Parameter Value Unit R thj-amb Thermal Resistance Junction-ambient (*) 160 °C/W Type Package Comment ST3M01D SO-14 50 parts per tube / 20 tube per box ST3M01DTR SO-14 (Tape & Reel) 2500 parts per reel
CONNECTION DIAGRAM (top view) PIN DESCRIPTION Pin N° Symbol Name and Function 1 GND SW Switching Ground. Must be low impedance; solder directly to GND plane 2 GND SW Switching Ground. Must be low impedance; solder directly to GND plane 3 Virtual GND Virtual GND. Open Drain N-Cnannel MOSFET: must be high impedance when the Low Battery condition is detected. 4 LBO Low Battery Output. Open Drain N-Cnannel MOSFET: sinks current when the input voltage drops below 2V typically. REF Reference Voltage Output. Bypass with 0.1 µF to improve the linears VREF thermal noise performance. 6 IN Linear Linear Input. Must be connected togheter with IN SW to the input supply. 7O U T L B Linear B Output port. 1.9V typically. 8 SHDN Shutdown Input. Disables the SMPS and LA output, but the LB, the referencevoltage and the low batery comparator remain active. 9 GND Signal Signal GND. Must be connected togheter with the Switching Ground. 10 OUT L A Linear A Output port. 3V typically. 11 OUT DC/DC DC/DC Output Port: 3.3V typically. 12 IN SW SMPS Input. Must be connected togheter with IN_Linear to the input supply. 13 LX 1.5A N-Channel Power MOSFET Drain. 14 LX 1.5A N-Channel Power MOSFET Drain.
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, please refer to the typical operating circut of the pag 1 for the external components values and connections. Unless otherwise noted VSHDN =HIGH) Note 1: For VIN < 1.9V the VO(LB) is out of regulation because of under dropout condition Note 2: VO(DC/DC) = 3.5V force for an external DC source to avoid switching noise Symbol Parameter Test Conditions Min. Typ. Max. Unit VI Operating Input Voltage 1.9 3.3 V VO(DC/DC) DC/DC Converter Output Voltage (Test Circuit A) 2.24<VIN<3.3V; 0<I O(DC/DC) <200mA; 0<IO(LA)<20mA; 0<I O(LB)<20mA; -40 < TJ < 85 °C 3.2 3.3 3.415 V ν DC/DC Converter Efficency VIN=2.4V; I O(DC/DC) =100mA; IO(LA)=0mA; IO(LB)=0mA; T J = 25°C 87 % VO(LA) Linear A Output Voltage (Test Circuit A) 2.24<VIN<3.3V; 0<I O(DC/DC) <200mA; 0<IO(LA)<20mA; 0<I O(LB)<20mA; -40 < TJ < 85°C 2.93 3 3.09 V VO(LB) Linear B Output Voltage (Test Circuit A) 2.24<VIN<3.3V; 0<I O(DC/DC) <200mA; 0<IO(LA)<20mA; 0<I O(LB)<20mA; -40 < TJ < 85°C 1.86 1.9 1.955 V eN(LA) Linear A Thermal Output Noise Voltage (Note 2) VIN=2.4V; V O(DC/DC) =3.5V; IO(LA)=20mA; 10 < f < 80KHz; C O(LA)=1µF; CREF =0.1µF; TJ = 25°C 60 µVrms eN(LB) Linear B Thermal Output Noise Voltage (Note 2) VIN=2.4V; V O(DC/DC) =3.5V; IO(LB)=20mA; 10 < f < 80KHz; C O(LB)=1µF; CREF =0.1µF; TJ = 25°C 35 µVrms Iq(OFF) Quiescent Current OFF Mode DC/DC & LA OFF LB ON) (Test Circuit E) VIN=3.3V; No Load; V SHDN =LOW; TJ = 25°C 75 µA Iq(OFF) Quiescent Current OFF Mode (DC/DC & LA OFF LB ON) (Test Circuit F) VIN=1.9V; No Load; V SHDN =HIGH; TJ = 25°C 50 µA IS(DC/DC) DC/DC Supply Current (Test Circuit B) VIN=2.24V; No Load; T J = 25°C 100 µA Iq(LA) Linear A Quiescent Current (Test Circuit C) VIN=2.24V; V O(DC/DC) =3.5V; IO(LA)=10mA; TJ = 25°C 220 µA Iq(LB) Linear B Quiescent Current (Test Circuit C) VIN=2.24V; V O(DC/DC) =3.5V; IO(LB)=10mA; TJ = 25°C 75 µA VBATT Low Battery Detection Range VSHDN =HIGH with falling edge 1.96 2 2.04 V VBATT(HYS) Low Battery Detection Hysteresys 150 200 mV R ON(LBO) LBO R DSON VIN=1.9V; I D =5mA; T J = 25°C 10 Ω Vih Control Input Logic Low VIN>2.24V; -40 < TJ < 85°C 0.4 V Vil Control Input Logic High VIN>2.24V; -40 < TJ < 85°C 1.5 V Ton Timer On Response Time on DC/DC VIN=2.4V; C O =100µF; T J = 25°C IO(DC/DC) =200mA VSHDN =from GND to VSHDN(MAX) 0.6 9 ms R ON(V_GND) Virtual GND RDSON V IN>2.24V; ID =5mA; T J = 25°C 10 Ω
DC/DC CONVERTER BLOCK DIAGRAM LINEAR VREG BLOCK DIAGRAM
IN_Linear OUT DC/DC OUT LA OUT LB 150 µF 1 µF 15 µH DC/DC RefRef Vref Lx Virtual GND 0.1 µF GND_SW GND_Signal IN_SW Vin 150 µF 1 µF 1 KΩ LBO On-Mode Off-Mode V V V DC/DC Linear A Linear B OUT DC/DC OUT LA OUT LB 1 µF 15 µH SHDN=HIGH 150 µF DC/DC RefRef Vref Lx LBO Virtual GND 0.1 µF GND_SW GND_Signal IN_SW Vin 47 µF 1 µF 1 KΩ A (Isup)DC/DC 47 µF IN_Linear
TEST CIRCUIT C (Iq)Ia=(Iin)Ia-(Iout)Ia TEST CIRCUIT D (Iq)Ib=(Iin)Ib-(Iout)Ib (Iout)la (Iin)la DC/DC Linear A Linear B OUT DC/DC OUT LA OUT LB 1 µF 15 µH SHDN=HIGH DC/DC RefRef Vref Lx LBO Virtual GND 0.1 µF GND_SW GND_Signal IN_SW (Vin)Lin=2.24V 47 µF 1 µF 1 KΩ 47 µF IN_Linear (Vin)DC/DC Floating A (Vout)DC/DC=3.5V (Iout)lb (Iin)lb DC/DC Linear A Linear B OUT DC/DC OUT LA OUT LB 1 µF 15 µH SHDN=LOW DC/DC RefRef Vref Lx LBO Virtual GND 0.1 µF GND_SW GND_Signal IN_SW(Vin)Lin=3.3V 47 µF 1 µF 1 KΩ 47 µF IN_Linear (Vin)DC/DC Floating A 150 µF
SHDN= LOW DC/DC Linear A Linear B IN_Linear OUT DC/DC OUT LA OUT LB 150 µF 1 µF 15 µH DC/DC RefRef Vref Lx Virtual GND 0.1 µF GND_SW GND_Signal IN_SW Vin = 3.3V 150 µF 1 µF 1 KΩ LBO A Iq = off SHDN=HIGH DC/DC Linear A Linear B IN_Linear OUT DC/DC OUT LA OUT LB 150 µF 1 µF 15 µH DC/DC RefRef Vref Lx Virtual GND 0.1 µF GND_SW GND_Signal IN_SW Vin = 1.9V 150 µF 1 µF 1 KΩ LBO A Iq = off
IN_SW LX OUT_DC/DC OUT_L B Virtual_GND LBO VrefGND_SignalGND_SW SHDN IN_Linear ST3M01 OUT_L A 12 13,14 11 150 µF IN D STPS320U L 22 µH 150 µF 1 µF 1 µF B A 100 nF LBO VG 591,2 SH DC 1KOhm VR ON OFF
DIM. mm inch A1 . 7 5 0 . 0 6 8 a1 0.1 0.2 0.003 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C0 . 5 0 . 0 1 9 c1 45 (typ.) D 8.55 8.75 0.336 0.344 E 5.8 6.2 0.228 0.244 e1 . 2 7 0 . 0 5 0 e3 7.62 0.300 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M0 . 6 8 0 . 0 2 6 S8 ( m a x . ) P013G SO-14 MECHANICAL DATA
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