SSTV16859

SN74SSTV16859 TI | Alldatasheet

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/C0083/C0078/C0055/C0052/C0083/C0083/C0084/C0086/C0049/C0054/C0056/C0053/C0057 /C0049/C0051/C0262/C0066/C0073/C0084 /C0084/C0079 /C0050/C0054/C0262/C0066/C0073/C0084 /C0082/C0069/C0071/C0073/C0083/C0084/C0069/C0082/C0069/C0068 /C0066/C0085/C0070/C0070/C0069/C0082 /C0087/C0073/C0084/C0072 /C0083/C0083/C0084/C0076/C0095/C0050 /C0073/C0078/C0080/C0085/C0084/C0083 /C0065/C0078/C0068 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCES297D − FEBRUARY 2000 − REVISED AUGUST 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Member of the Texas Instruments Widebus  Family /C00681-to-2 Outputs to Support Stacked DDR DIMMs /C0068Supports SSTL_2 Data Inputs /C0068Outputs Meet SSTL_2 Class II Specifications /C0068Differential Clock (CLK and CLK) Inputs /C0068Supports LVCMOS Switching Levels on the RESET Input /C0068RESET Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low /C0068Pinout Optimizes DIMM PCB Layout /C0068Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II /C0068ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) description/ordering information This 13-bit to 26-bit registered buffer is designed for 2.3-V to 2.7-V V CC operation. All inputs are SSTL_2, except the LVCMOS reset (RESET ) input. All outputs are SSTL_2, Class II compatible. The SN74SSTV16859 operates from a differential clock (CLK and CLK). Data are registered at the crossing of CLK going high and CLK going low.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING QFN − RGQ (Tin−Pb Finish) Tape and reel SN74SSTV16859RGQR SS859 0°C to 70°C QFN − RGQ (Matte−Tin Finish) Tape and reel SN74SSTV16859RGQ8 SS859 TSSOP − DGG Tape and reel SN74SSTV16859DGGR SSTV16859 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright  2004, Texas Instruments Incorporated Widebus is a trademark of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DGG PACKAGE (TOP VIEW) Q13A Q12A Q11A Q10A Q9A VDDQ GND Q8A Q7A Q6A Q5A Q4A Q3A Q2A GND Q1A Q13B V DDQ Q12B Q11B Q10B Q9B Q8B Q7B Q6B GND V DDQ Q5B Q4B Q3B Q2B Q1B V DDQ GND D13 D12 V CC VDDQ GND D11 D10 GND RESET GND CLK CLK VDDQ VCC VREF GND GND V DDQ VCC GND V DDQ /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046

/C0083/C0078/C0055/C0052/C0083/C0083/C0084/C0086/C0049/C0054/C0056/C0053/C0057 /C0049/C0051/C0262/C0066/C0073/C0084 /C0084/C0079 /C0050/C0054/C0262/C0066/C0073/C0084 /C0082/C0069/C0071/C0073/C0083/C0084/C0069/C0082/C0069/C0068 /C0066/C0085/C0070/C0070/C0069/C0082 /C0087/C0073/C0084/C0072 /C0083/C0083/C0084/C0076/C0095/C0050 /C0073/C0078/C0080/C0085/C0084/C0083 /C0065/C0078/C0068 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCES297D − FEBRUARY 2000 − REVISED AUGUST 2004

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued) The device supports low-power standby operation. When RESET is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF ) inputs are allowed. In addition, when RESET is low, all registers are reset, and all outputs are forced low. The LVCMOS RESET input always must be held at a valid logic high or low level. To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up. RGQ PACKAGE (TOP VIEW) Q7A Q6A Q5A Q4A Q3A Q2A Q1A Q13B V DDQ Q12B Q11B Q10B Q9B Q8B D10 RESET GND CLK CLK V DDQ VCC VREF Q4B Q7B Q6B Q11A Q3B Q1B VDDQ Q2B D13 Q5B D11 D12 GND Q13A Q12A Q10A Q9A Q8A VDDQ VDDQ VCC VDDQ VCC VDDQ VDDQ GND † † The center die pad must be connected to GND. FUNCTION TABLE INPUTS OUTPUT RESET CLK CLK D OUTPUT Q H ↑ ↓ H H H ↑↓ LL H L or H L or H X Q 0 L X or floating X or floating X or floating L

/C0083/C0078/C0055/C0052/C0083/C0083/C0084/C0086/C0049/C0054/C0056/C0053/C0057 /C0049/C0051/C0262/C0066/C0073/C0084 /C0084/C0079 /C0050/C0054/C0262/C0066/C0073/C0084 /C0082/C0069/C0071/C0073/C0083/C0084/C0069/C0082/C0069/C0068 /C0066/C0085/C0070/C0070/C0069/C0082 /C0087/C0073/C0084/C0072 /C0083/C0083/C0084/C0076/C0095/C0050 /C0073/C0078/C0080/C0085/C0084/C0083 /C0065/C0078/C0068 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCES297D − FEBRUARY 2000 − REVISED AUGUST 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 logic diagram (positive logic) R To 12 Other Channels RESET Q1A 49CLK 48CLK 45VREF 35D1

32 Q1B

Pin numbers shown are for the DGG package. One of 13 channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 3.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-5.

/C0083/C0078/C0055/C0052/C0083/C0083/C0084/C0086/C0049/C0054/C0056/C0053/C0057 /C0049/C0051/C0262/C0066/C0073/C0084 /C0084/C0079 /C0050/C0054/C0262/C0066/C0073/C0084 /C0082/C0069/C0071/C0073/C0083/C0084/C0069/C0082/C0069/C0068 /C0066/C0085/C0070/C0070/C0069/C0082 /C0087/C0073/C0084/C0072 /C0083/C0083/C0084/C0076/C0095/C0050 /C0073/C0078/C0080/C0085/C0084/C0083 /C0065/C0078/C0068 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCES297D − FEBRUARY 2000 − REVISED AUGUST 2004

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions (see Note 5) MIN NOM MAX UNIT VCC Supply voltage VDDQ 2.7 V VDDQ Output supply voltage 2.3 2.7 V VREF Reference voltage (VREF = VDDQ /2) 1.15 1.25 1.35 V VTT Termination voltage VREF − 40 mV VREF VREF + 40 mV V VI Input voltage 0 VCC V VIH AC high-level input voltage Data inputs VREF + 310 mV V VIL AC low-level input voltage Data inputs VRE F− 310 mV V VIH DC high-level input voltage Data inputs VREF + 150 mV V VIL DC low-level input voltage Data inputs VREF − 150 mV V VIH High-level input voltage RESET 1.7 V VIL Low-level input voltage RESET 0.7 V VICR Common-mode input voltage range CLK, CLK 0.97 1.53 V VI(PP) Peak-to-peak input voltage CLK, CLK 360 mV IOH High-level output current −20 mAIOL Low-level output current 20 mA TA Operating free-air temperature 0 70 /C0095C NOTE 5: The RESET input of the device must be held at valid logic voltage levels (not floating) to ensure proper device operation. The differential inputs must not be floating unless RESET is low. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC † MIN TYP ‡ MAX UNIT VIK II = −18 mA 2.3 V −1.2 V VOH IOH = −100 µA 2.3 V to 2.7 VVDDQ − 0.2 VVOH IOH = −16 mA 2.3 V 1.95 V VOL IOL = 100 µA 2.3 V to 2.7 V 0.2 VVOL IOL = 16 mA 2.3 V 0.35 V II All inputs VI = VCC or GND 2.7 V ±5 µA ICC Static standby RESET = GND IO = 0 2.7 V 10 µA ICC Static operating RESET = VCC , VI = VIH(AC) or VIL(AC) IO = 0 2.7 V 40 mA Dynamic operating − clock only RESET = VCC , VI = VIH(AC) or VIL(AC), CLK and CLK switching 50% duty cycle 30 µA/ MHz ICCD Dynamic operating − per each data input RESET = VCC , VI = VIH(AC) or VIL(AC), CLK and CLK switching 50% duty cycle, One data input switching at one-half clock frequency, 50% duty cycle IO = 0 2.5 V µA/ clock MHz/ D input rOH Output high IOH = −20 mA 2.3 V to 2.7 V 7 20 Ω rOL Output low IOL = 20 mA 2.3 V to 2.7 V 7 20 Ω rO(∆) rOH − rOL  IO = 20 mA, TA = 25°C, One output 2.5 V 6 Ω Data inputs VI = VREF ± 310 mV 2.5 3 3.5 C i§ CLK, CLK VICR = 1.25 V, VI(PP) = 360mV 2.5 V 2.5 3 3.5 pFC i RESET VI = VCC or GND 2.5 V pF † For this test condition, VDDQ always is equal to VCC . ‡ All typical values are at VCC = 2.5 V, TA = 25°C. § Measured with 50-MHz input frequency for the QFN package and 10-MHz input frequency for the TSSOP package

/C0083/C0078/C0055/C0052/C0083/C0083/C0084/C0086/C0049/C0054/C0056/C0053/C0057 /C0049/C0051/C0262/C0066/C0073/C0084 /C0084/C0079 /C0050/C0054/C0262/C0066/C0073/C0084 /C0082/C0069/C0071/C0073/C0083/C0084/C0069/C0082/C0069/C0068 /C0066/C0085/C0070/C0070/C0069/C0082 /C0087/C0073/C0084/C0072 /C0083/C0083/C0084/C0076/C0095/C0050 /C0073/C0078/C0080/C0085/C0084/C0083 /C0065/C0078/C0068 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCES297D − FEBRUARY 2000 − REVISED AUGUST 2004 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 2.5 V ± 0.2 V† UNIT MIN MAX UNIT fclock Clock frequency 200 MHz tw Pulse duration, CLK, CLK high or low 2.5 ns tact Differential inputs active time (see Note 6) 22 ns tinact Differential inputs inactive time (see Note 7) 22 ns tsu Setup time, fast slew rate (see Notes 8 and 10) Data before CLK↑, CLK↓ 0.75 nstsu Setup time, slow slew rate (see Notes 9 and 10)Data before CLK↑, CLK↓ 0.9 ns th Hold time, fast slew rate (see Notes 8 and 10) Data after CLK↑, CLK↓ 0.75 nsth Hold time, slow slew rate (see Notes 9 and 10) Data after CLK↑, CLK↓ 0.9 ns † For this test condition, VDDQ always is equal to VCC . NOTES: 6. V REF must be held at a valid input level, and data inputs must be held low for a minimum time of tact max, after RESET is taken high. 7. VREF , data, and clock inputs must be held at valid voltage levels (not floating) for a minimum time of tinact max, after RESET is taken low. 8. For data signal input slew rate ≥ 1 V/ns 9. For data signal input slew rate ≥ 0.5 V/ns and < 1 V/ns 10. CLK, CLK signals input slew rates are ≥ 1 V/ns. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 2.5 V ± 0.2 V† UNITPARAMETER (INPUT) (OUTPUT) MIN MAX UNIT fmax 200 MHz tpd CLK and CLK Q 1.1 2.8 ns tPHL RESET Q 5 ns † For this test condition, VDDQ always is equal to VCC .

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. ICC tested with clock and data inputs held at VCC or GND, and IO = 0 mA. input slew rate = 1 V/ns ±20% (unless otherwise noted). D. The outputs are measured one at a time, with one transition per measurement. F. V IH = VREF + 310 mV (ac voltage levels) for differential inputs. VIH = VCC for LVCMOS input. G. V IL = VREF − 310 mV (ac voltage levels) for differential inputs. VIL = GND for LVCMOS input. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 74SSTV16859DGGRG4 ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74SSTV16859RGQ8G3 ACTIVE QFN RGQ 56 2000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR SN74SSTV16859DGGR ACTIVE TSSOP DGG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74SSTV16859RGQ8 ACTIVE QFN RGQ 56 2000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR SN74SSTV16859RGQR ACTIVE QFN RGQ 56 2000 TBD CU SNPB Level-3-235C-168 HR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Addendum-Page 1

/C0077/C0069/C0067/C0072/C0065/C0078/C0073/C0067/C0065/C0076 /C0068/C0065/C0084/C0065 MPQF113C − DECEMBER 2001 − REVISED AUGUST 2002 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 RGQ (S−PQFP−N56) PLASTIC QUAD FLATPACK 4203438/D 08/2002Bottom View 56X 0,23 7,85 8,15 D 0,08 C 7,65 7,85 0,50 A +0,07 −0,05 0,05 0,10 M C M CB 0,30 Seating Plane 0,00 0,05 C 7,85 8,15 A B 5,35 5,05 4,35 4,65 42 29 0,80 1,00 Pin 1 Identifier Exposed Thermal Die Pad Pin 1 Identifier 0,50 6,50 56X Sq 0,20 Nominal Lead Frame NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. QFN (Quad Flatpack No-Lead) Package configuration. D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad may be electrically connected to ground. E. Package registration with JEDEC MO-220 variation VLLD-2.

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 4040078/F 12/97

48 PINS SHOWN

0,25 0,15 NOM Gage Plane 6,00 6,20 8,30 7,90 0,75 0,50 Seating Plane 0,27 0,17 A 1,20 MAX M0,08 0,10 0,50 0°–8° 14,10 13,90 48DIM A MAX A MIN PINS ** 12,40 12,60 17,10 16,90 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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