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Document overview

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Technical content

Features

  • Soft Ultrafast Recovery (35 ns typ)
  • Highly Stable Oxide Passivated Junction
  • Matched Dual Die Construction − May Be Paralleled for High Current Output
  • Short Heat Sink Tab Manufactured − Not Sheared
  • Epoxy Meets UL 94 V−0 @ 0.125 in.
  • NRVSRD and SSRD8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant* Mechanical Characteristics
  • Case: Epoxy, Molded
  • Weight: 0.4 Grams (Approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
  • ESD Ratings: ♦ Machine Model = C ♦ Human Body Model = 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOFT ULTRAFAST RECTIFIER

6.0 AMPERES, 200 VOLTS

2, 4 DPAK CASE 369C MARKING DIAGRAM A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package AYWW S 620TG Device Package Shipping †

ORDERING INFORMATION

(Pb−Free) 2,500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. MSRD620CTG DPAK (Pb−Free)

75 Units/Rail

www.onsemi.com NRVSRD620VCTT4G DPAK (Pb−Free) 2,500 / Tape & Reel SSRD8620CTT4G DPAK (Pb−Free) 2,500 / Tape & Reel

MSRD620CT, NRVSRD620VCT, SSRD8620CT Series www.onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (At Rated VR, TC = 137°C) Per Leg Per Package IO 3.0 6.0 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 138°C) Per Leg IFRM 6.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Per Package IFSM A Storage / Operating Case Temperature Tstg, Tc −55 to +175 °C Operating Junction Temperature TJ −55 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance − Junction−to−Case Per Leg R/C0113JC 9.0 °C/W Thermal Resistance − Junction−to−Ambient Per Leg R/C0113JA °C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2) Per Leg VF TJ = 25°C TJ = 150°C V (IF = 3.0 A) (IF = 6.0 A) 1.15 1.35 1.05 1.30 Maximum Instantaneous Reverse Current (See Figure 4) Per Leg IR TJ = 25°C TJ = 150°C /C0109A (VR = 200 V) (VR = 100 V) 5.0 2.0 200 100 Maximum Reverse Recovery Time (Note 2) Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A//C0109s) (VR = 30 V, IF = 3.0 A, di/dt = 50 A//C0109s) trr ns Maximum Peak Reverse Recovery Current Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A//C0109s) (VR = 30 V, IF = 3.0 A, di/dt = 50 A//C0109s) IRM 2.0 3.0 A 1. Pulse Test: Pulse Width ≤ 250 /C0109s, Duty Cycle ≤ 2%. 2. t rr measured projecting from 25% of IRM to ground.

Figure 1. Typical Forward Voltage, Per Leg Figure 2. Maximum Forward Voltage, Per Leg Figure 3. Typical Reverse Current, Per Leg Figure 4. Maximum Reverse Current, Per Leg Figure 5. Current Derating, Case (Per Leg) Figure 6. Current Derating, Ambient (Per Leg)

4.5 RATED VOLTAGE APPLIED

Figure 9. Transient Thermal Response (R/C0113JC)

MSRD620CT, NRVSRD620VCT, SSRD8620CT Series www.onsemi.com PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE F 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 /C0466mm inches/C0467SCALE 3:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* b D E M0.005 (0.13) C A c C Z DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY . 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. 12 3 H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC HDETAIL A SEATING PLANE A B C L H L2 GAUGE PLANE DETAIL A ROTATED 90 CW/C0053 e BOTTOM VIEW Z BOTTOM VIEW SIDE VIEW TOP VIEW ALTERNATE CONSTRUCTIONS NOTE 7 Z ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MSRD620CT/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative