SSPR60N03_15 SECOS | Alldatasheet
Document overview
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Technical content
60A , 30V , R DS(ON) 6 m ΩΩ ΩΩ N-Channel Enhancement Mode Power MOSFET 20-May-2014 Rev.A Page 1 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
The SSPR60N03 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SPR-8PP package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters.
FEATURES
/circle6 Lower Gate Charge /circle6 Simple Drive Requirement /circle6 Fast Switching Characteristic MARKING
PACKAGE INFORMATION
(T A=25° C unless otherwise specified) Parameter Symbol Rating Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 V TC =25° C 60 Continuous Drain Current 1@V GS =10V TC =100° C ID A Pulsed Drain Current 2 IDM 180 A Single Pulse Avalanche Energy 3 EAS 252 mJ Avalanche Current IAS 48 A Power Dissipation 4 T C =25° C P D 37 W Operating Junction & Storage Temperature T J, T STG -55~150 ° C Thermal Resistance Rating Thermal Resistance Junction-Ambient 1(Max). R θJA 75 ° C / W Thermal Resistance Junction-Case 1(Max). R θJC 3.38 ° C / W 60N03 /box4/box4/box4 /box4/box4/box4 /box4/box4/box4 /box4/box4/box4 /box4/box4 /box4/box4 /box4/box4 /box4/box4 = Date code SPR-8PP A 3.25 3.40 G 1.35 1.55 B 3.05 3.25 H 0.24 0.35 C 3.2 0 3.40 I 1.13 REF. D 3.00 3.20 J 0.30 0.50 E 0.65 BSC. K 0.10 0.20 F 2.40 2.60 L 0.70 0.90 G S S S D D D D
60A , 30V , R DS(ON) 6 m ΩΩ ΩΩ N-Channel Enhancement Mode Power MOSFET 20-May-2014 Rev.A Page 2 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
ELECTRICAL CHARACTERISTICS
(T J = 25° C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Teat Conditions Static Drain-Source Breakdown Voltage BV DSS 30 - - V V GS =0, I D = 250uA Gate-Threshold Voltage V GS(th) 1 - 2.5 V V DS =V GS , I D =250uA Gate-Source Leakage Current I GSS - - ±100 nA V GS = ±20V - - 1 V DS =24V, V GS =0, TJ=25° C Drain-Source Leakage Current I DSS - - 5 uA VDS =24V, V GS =0, TJ=55° C - - 6 V GS =10V, I D =30A Static Drain-Source On-Resistance 2 R DS(ON) - - 8 m Ω VGS =4.5V, I D =15A Gate Resistance R g - 1.6 2.8 Ω f =1.0MHz Total Gate Charge(10V) Q g - 20 - Gate-Source Charge Q gs - 7.6 - Gate-Drain Change Q gd - 7.2 - nC ID =15A VDS =15V VGS =4.5V Turn-on Delay Time 2 T d(on) - 7.8 - Rise Time Tr - 15 - Turn-off Delay Time T d(off) - 37.3 - Fall Time Tf - 10.6 - nS VDD =15V ID =15A VGS =10V R G =3.3 Ω Input Capacitance C iss - 2295 - Output Capacitance C oss - 267 - Reverse Transfer Capacitance C rss - 210 - pF VGS =0 VDS =15V f =1.0MHz Guaranteed Avalanche Characteristics Single Pulse Avalanche Energy 3 EAS 63 - - mJ V D =25V, L=0.1mH, IAS =24A Source-Drain Diode Diode Forward Voltage 2 V SD - - 1 V I S=1A, V GS =0, TJ=25° C Continuous Source Current 1,4 I S - - 60 A Pulsed Source Current 2,4 I SM - - 180 A VD =V G =0, Force Current Reverse Recovery Time T rr - 14 - nS Reverse Recovery Charge Q rr - 5 - nC IF=30A, dl/dt=100A/ µS, TJ=25° C Note: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper , ≦10sec , 125 ℃/W at steady state 2. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3. The EAS data shows Max. rating . The test condition is V DD =25V,V GS =10V,L=0.1mH,I AS =48A 4. The power dissipation is limited by 150° C junction temperature 5. The Min. value is 100% EAS tested guarantee. 6. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
60A , 30V , R DS(ON) 6 m ΩΩ ΩΩ N-Channel Enhancement Mode Power MOSFET 20-May-2014 Rev.A Page 3 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. CHARACTERISTIC CURVES
60A , 30V , R DS(ON) 6 m ΩΩ ΩΩ N-Channel Enhancement Mode Power MOSFET 20-May-2014 Rev.A Page 4 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. CHARACTERISTIC CURVES