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Technical content

  1. General description The SSL2108X is a range of high-voltage Integrated Circuits (ICs), intended to drive LED lamps in general lighting applications. The main benefits of the product family are:
  • Small Printed-Circuit Board (PCB) footprint, and compact solution
  • High efficiency (up to 95 %)
  • Ease of integration
  • Low electronic Bill Of Material (BOM) The product family is made of ICs with a range of internal HV switches for easy power scaling. The ICs work as boundary conduction mode conver ters, typically in buck configuration. The IC range has been designed to start up directly from the HV supply by an internal high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling from the drain, or any other auxiliary supply. This functionality provides full flexibility in the application design. The IC consumes 1.3 mA of supply current with an internal clamp limiting the supply voltage. The ICs provide accurate output current control with LED current accuracy within 5%. The ICs can be operated using Pulse-Width Modulation (PWM) dimming and has many protection features including easy LED temperature feedback. 2. Features and benefits  LED driver IC family driving strings of LEDs from a rectified mains supply  High -efficiency switch mode buck driver product family:  Drivers with integrated 300 V (SSL21081 and SSL21082) or 600 V (SSL21083 and SSL2 1084) power switches  Con troller with power-efficient boundary conduction mode of operation with:  No reverse recovery loss es in freewheel diode  Zero Current Switching (Z CS) for turn-on of switch  Zero volt age or valley switching for turn-on of switch  Min imal required inductance value and size  Direct PWM dimming possible  Fa st transient response through cycle-by-cycle current control:  Negligible A C mains ripple at LED current and minimal total capacitor value SSL21081T/2T/3T/4T GreenChip drivers for LED lighting Rev. 2 — 6 December 2011 Preliminary data sheet

0 V and 230 V (AC). The output signal can be modulated using a PWM signal.

  1. The Hotaru switch is a well know n wall switch with built-in light

Table 1. Quick reference data

5.1 Ordering options

Remark: All voltages unless otherwise specified are in V (AC). higher output power is required. Table 1. Quick reference data …continued Table 2. Ordering information Table 3. Ordering options

600 V; 5  SO8 no

600 V; 5  SO12 yes

Preliminary data sheet Rev. 2 — 6 December 2011 4 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting 6. Block diagram 7. Pinning information

7.1 Pinning

Fig 1. Block diagram SSL2108X 001aan694 JFETHV VCC NTC GND DVDT DRAIN TONMAX SOURCE 1.5 V SUPPLY: INTERNAL REGULATOR AND BANDGAP dV/dT SUPPLY VALLEY DETECTION TOFFMAX LOGIC TONMAX BLANK LOGIC CONTROL AND PROTECTION NTC FUNCTION THERMAL SHUTDOWN POR 0.5 V < >0.25 V 1 (1) 5 (9) 8 (12) (8) 2 (3) 3 (4) 4 (5) 6, 7 (2, 6, 7, 10, 11) Fig 2. Pin configuration for SSL2108X (SO8) Fig 3. Pin configuration for SSL2108X O12) SSL2108X HV DRAIN SOURCE GND VCC GND NTC DVDT 001aan702 SSL2108X HV DRAIN GND GND SOURCE GND VCC DVDT NTC TONMAX GND GND 001aan703 6 7

Preliminary data sheet Rev. 2 — 6 December 2011 5 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting

7.2 Pin description

  1. Functional description

8.1 Converter operation

The converter in the SSL2108X is a Boundary Conduction Mode (BCM), peak current controlled system. For the basic application diagram see Figure 4, for the waveforms see Figure 5. This converter type operates at the boundary between continuous and inductor current IL is zero. Table 4. Pin description

Description

HV 1 1 high-voltage supply pin SOURCE 2 3 low-side internal switch VCC 3 4 supply voltage NTC 4 5 LED temperature protection input GND 6, 7 2,6,7,10,11 ground DVDT 5 9 AC supply pin TONMAX - 8 brownout protection timer input DRAIN 8 12 high-side internal switch Fig 4. Basic application diag ram SSL2108X (SO8 variant) 001aan693 Rinrush NTC 6, 7 GND SOURCE NTC R sense L DVDT DRAIN Vsec LEDs HV VCC SSL2108X

Preliminary data sheet Rev. 2 — 6 December 2011 6 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting

8.2 Conversion frequency

The conversion frequency must be limited to below 200 kHz. Therefore, select an inductance value so that the conversion frequency is always within limits, given the supply voltage, LED voltage and component spread.

8.3 Valley detection

A new cycle is started when the primary switch is switched on (see Figure 5). Following time t1, when the peak current is detected on the SOURCE pin, the switch is turned off and the secondary stroke starts (3). When the secondary stroke is complete and the coil current at t3 equals zero, the drain voltage starts to oscillate around the VIN  VOUT level. The amplitude equals VOUT. A special feature, called valley detection is an integrated part of the SSL2108X circuitry. Dedicated built-in circuitry connected to the DRAIN pin, senses when the voltage on the drain of the switch has reached its lowest value. The next cycle is then started and as a result the capacitive switching losses are reduced. A valley is detected and accepted if both the frequency of the oscillations and the voltage swing are within the range specified (fring and ∆Vvrec(min)) for detection. If a valid valley is not detected, the secondary stroke is continued until the maximum off-time (toff(high)) is reached, then the next cycle is started.

8.4 Protections

The IC has the following protections:

  • UnderVoltage LockOut (UVLO)
  • Leading-Edge Blanking (LEB)
  • OverCurrent Protection (OCP) Fig 5. Buck waveforms and valley detection 001aan699 demagnetization VIN valley internal MOSFET switch VGATE VD IL VOUT magnetization t1t0 t00t2 t3 T

Preliminary data sheet Rev. 2 — 6 December 2011 7 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting

  • Internal OverTemperature Protection (OTP)
  • Brownout protection
  • Short-Winding Protection (SWP)
  • Output Short Protection (OSP)
  • LED overtemperature control and protection The SWP and the OSP are latched protections. Th ese protections cause the IC to halt until a reset (a result of power cycling) is executed. When Vcc drops lower than Vcc(rst), the IC resets the latch protection mode. The internal OTP and LED over temperature protections are safe-restart protections. The IC halts, causing VCC to fall lower than VCC(stop), and instigates start-up. Switching starts only when no fault condition exists.

8.4.1 UnderVoltage LockOut (UVLO)

When the voltage on the VCC pin drops lower than Vcc(stop), the IC stops switching. An attempt is then made to restart by supplying VCC from the HV pin voltage.

8.4.2 Leading-Edge Blanking (LEB)

To prevent false detection of the short-winding or overcurrent, a blanking time following switch-on is implemented. When the internal MOSFET switch turns on there can be a short current spike due to capacitive discharge of voltage over the drain and source. During the LEB time (tleb), the spike is disregarded.

8.4.3 OverCurrent Protection (OCP)

The SSL2108X contains a highly accurate peak current detector. It triggers when the voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is activated following LEB time tleb. As the LED current is half the peak current (by design), it automatically provides protection for maximum LED current during operation. There is a propagation delay between overcurrent detection and the actual closure of the switch td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level set by the resistor in series to the SOURCE pin.

8.4.4 OverTemperature Protection (OTP)

When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the converter stops operating. The OTP safe-restart protection and the IC restarts again with switching resuming when the IC temperature drops lower than Tth(rel)otp.

8.4.5 Brownout protection

Brownout protection is designed to limit the lamp power when the input voltage drops close to the output voltage level. Since the input power has to remain constant, the input current would otherwise increase to a level that is too large for the input circuitry. For the SSL2108X, there is a maximum limit on the on-time of the switch t on(high). The rate of current rise in the coil during the on-phase is proportional to the difference between input voltage and output voltage. Therefore, the peak current cannot be reached before t on(high) and as a result the average output current to the LEDs is reduced. Using the SO12 package, the ton(high) can be lowered by connecting a capacitor to the TONMAX pin. The external capacitor is charged during the primary stroke with ITONMAX. If VTONMAX level is reached before the ton(high) time, the switch is turned off and the

Preliminary data sheet Rev. 2 — 6 December 2011 8 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting secondary stroke starts. When no capacitor is connected to the pin, VTONMAX is reached quickly, shorter than the minimum limit of one microsecond. In this case, or in case the TONMAX pin is grounded, the internal time constant, ton(high) determines the maximum on-time.

8.4.6 Short-Winding Protection (SWP)

SWP activates if there is a steep rising current through the MOSFET and thus through the external resistor connected to the SOURCE pin. This current can occur when there is a short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor between the input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if Vcc drops lower than VCC(rst) the IC resets the latched protection mode.

8.4.7 Output Short Protection (OSP)

During the second stroke (switch-of time), if a valley is not detected within the off-time limit (toff(high)), then typically the output voltage is less than the minimum limit allowed in the application. This condition can occur either during starting up or due to a short. A timer is started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real short-circuit exists and not start-up. The IC enters latched protection. If Vcc drops lower than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP timer is paused during the off-cycle of the PWM signal.

8.5 VCC supply

The SSL2108X can be supplied using three methods:

  • Under normal operation, the voltage swing on the DVDT pin is rectified within the IC providing current towards the VCC pin
  • At start-up, there is an internal current source connected to the HV pin. The current source provides internal power until either the dV/dt supply or an external current on the VCC pin provides the supply
  • An external voltage source can be connected to the VCC pin The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The hysteresis between the start and stop levels allows the IC to be supplied by a buffer capacitor until the dV/dt supply is settled. The SSL2108X has an internal Vcc clamp, which is an internal active Zener (or shunt regulator). This internal active Zener limits the voltage on the supply VCC pin to the maximum value of V cc. If the maximum current of the dV/dt supply minus the current consumption of the IC (determined by the load on the gate drivers), is lower than the maximum value of IDD no external Zener diode is needed in the dV/dt supply circuit.

8.6 DVDT supply

The DVDT pin is connected to an internal single-sided rectification stage. When an alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered without any other external power connection. This solution provides an effective method

Preliminary data sheet Rev. 2 — 6 December 2011 9 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting to prevent the additional high-power losses, which would result if a regulator were used for continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are not needed.

8.7 VCC regulator

During supply dips, the input voltage can drop too low to supply the required IC current through the DVDT pin. Under these conditions, if the VCC voltage drops lower than V CC(swon)reg level, another regulator with a current capability of up to IHVhigh(oper) is started. The job of the regulator is to fill in the required supply current, which the DVDT supply does not deliver, thus preventing the IC going into UVLO. When the VCC voltage is higher than VCC(swon)reg level, the regulator is turned off.

8.8 NTC functionalit y and PWM dimming

The NTC pin can be used as a control method for LED thermal protection. Alternatively, the pin can be used as an input to disable/enable light output using a digital signal (PWM dimming). The pin has an internal current source that generates the current of Ioffset(NTC). An NTC resistor to monitor the LED temperature can be directly connected to the NTC pin. Depending on the resistance value and the corresponding voltage on the NTC pin, the converter reacts as shown in Figure 6. When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter delivers nominal output current. When the voltage is lower than this leve l, the peak current is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now half the peak current of n ominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a timer starts to run to distinguish between the following situations:

  • If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED overtemperature is detected. The IC stops swit ching and attempts to restart from the HV pin voltage. Restart takes place when the voltage on NTC pin is higher than V th(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not result in a lower NTC temperature and LED OTP is activated. Fig 6. NTC control curve 001aan700 2 3 4 5 Ip Peak Current Ip / 2 Vth(ocp)SOURCE = 500 mV Vth(ocp)SOURCE = 250 mV VNTC Vth(NTC)highVth(NTC)low Vact(tmr) Vdeact(tmr)

Preliminary data sheet Rev. 2 — 6 December 2011 10 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting

  • If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is assumed that the pin is pulled down externally . The restart function is not triggered. Instead, the output current is reduced to zero. PWM dimming can be implemented this way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC.

8.8.1 Soft-start function

The NTC pin can be used to make a soft start function. During switch-on, the level on the NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time constant can be defined. The time constant causes the level on the NTC pin to increase slowly. When passing level V th(low)NTC Figure 6 (3), the convertor starts with half of the maximum current. The output current slowly increases to maximum when Vth(high)NTC Figure 6 (4) is reached.

8.9 Heat sink

For SSL2108X (SO12) applications, the copper of the PCB acts as the heat sink. The SSL2108X (SO12) uses thermal leads (pins 2, 6, 10 and 11) for enhanced heat transfer from die to the PCB copper heat sink. The thermal lead connection can drastically reduce thermal resistance. Equation 1 shows the relation between the maximum allowable power dissipation P and the thermal resistance from junction to ambient. (1) Where: Rth(j-a) = thermal resistance from junction to ambient Tj(max) = maximum junction temperature Tamb = ambient temperature P = power dissipation

[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k s eries resistor. pin down to 0 V over a 1 r esistor. [3] An internal clamp sets the supply voltage and current limits. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

300 V version 2 2 A

Table 6. Thermal characteristics

152 K/W

121 K/W

Table 7. Characteristics

300 V version;

Table 7. Characteristics …continued

[1] This parameter is not tested during production, by design it is guaranteed.

600 V version;

Preliminary data sheet Rev. 2 — 6 December 2011 15 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting 12. SSL2108X buck configuration Further application information can be found in the SSL2108X application note. Fig 7. Buck configuration for SSL21081/SSL21083 Fig 8. Buck configuration for SSL21082/SSL21084 001aan696 10 Ω RT1 NTCC6C5 C1 C2 IC1 fused resistor N RGNDto mains HV 81 DRAIN SOURCE RGND

72 GND

LED1...n LED+ LED- 001aan697 10 Ω RT1 NTCC6 C1 C2 IC1 fused resistor N RGNDto mains HV 121 DRAIN SOURCE RGND 103 GND 2 GND

11 GND

LED1...n LED+ LED-

Preliminary data sheet Rev. 2 — 6 December 2011 16 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting 13. Package outline Fig 9. Package outline SOT96-1 (SOT8) UNIT A max. A1 A2 A3 bp cD (1) E(2) (1)eH E LL p QZ y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 o o 0.25 0.10.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 SOT96-1 X w M θ AA1 bp D HE Lp Q detail X E Z e c L v M A (A )3 A pin 1 index y 076E03 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.016 0 2.5 5 mm scale SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 99-12-27 03-02-18

Preliminary data sheet Rev. 2 — 6 December 2011 17 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting Fig 10. Package outline SOT1196-1 (SOT12) ReferencesOutline version European projection Issue date IEC JEDEC JEITA SOT1196-1 - - - MS-012 Compliant- - - sot1196-1_po 11-02-15 11-02-16 Unit mm max nom min 1.75 0.25 0.18 0.10 0.25 0.49 0.43 0.36 0.25 0.22 0.10 8.75 8.65 8.55 2.54 1.27 1.05 0.25 0.7 0.5 0.3 A Dimensions Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. SO12: plastic small outline package; 12 leads; body width 3.9 mm SOT1196-1 A1 A2 1.45 1.35 1.25 A 3 bp cD (1) E(1) 4.0 3.9 3.8 e 1 e2 HE 6.2 6.0 5.8 LL p 1.0 0.7 0.4 Q 0.70 0.65 0.60 v 0.25 w 0.1 yZ (2) θ 012345 m m scale detail X A L Lp θ D y E c HE A X vA 12 7 Z bp e2e1 w pin 1 index

Table 8. Abbreviations

Table 9. Revision history

Preliminary data sheet Rev. 2 — 6 December 2011 20 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting 17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version onl y. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet wit h the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product dat a sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurat e and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be lia ble for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason what soever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make chang es to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, aut horized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these prod ucts are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and pr oducts using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liabil ity related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in th e Absolute Maximum Ratings System of IEC 60134) will cause permanent damag e to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors prod ucts are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agre ement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or co nstrued as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specif ication for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

Preliminary data sheet Rev. 2 — 6 December 2011 21 of 24 NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting Quick reference data — The Quick reference data is an extract of the pro duct data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly st ates that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the pro duct for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Preliminary data sheet Rev. 2 — 6 December 2011 23 of 24 continued >> NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting 20. Figures Fig 4. Basic application diagram SSL2108X  Fig 5. Buck waveforms and valley det Fig 7. Buck configuration for SSL21081/SSL21083 . . .15 Fig 8. Buck configuration for SSL21082/SSL21084 . . .15

NXP Semiconductors SSL21081T/2T/3T/4T GreenChip drivers for LED lighting © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 December 2011 Document identifier: SSL21081T_2T_3T_4T Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 21. Contents

8.4.4 OverTemperature Protection