SSFD3005 GOOD-ARK | Alldatasheet
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Technical content
www.goodark.com Page 1 of 4 Rev.1.0 SSF D3005 30V P-Channel MOSFET PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size Tape Width Quantity SSFD3005 SSFD3005 TO-252E-2-M - - - ABSOLUTE MAXIMUM RATINGS (T A =25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage V DS -30 V Gate-Source Voltage V GS ±25 V I D (25 -85 A I D (70 -68 A Drain Current-Continuous@ Current-Pulsed (Note 1) I DM -200 A Maximum Power Dissipation P D 100 W Operating Junction and Storage Temperature Range T J STG -55 To 150 ℃ THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) R θJA 41 ℃/W ELECTRICAL CHARACTERISTICS (T A =25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BV DSS V GS =0V I D =-250μA -30 V GENERAL FEATURES
- V DS =- 30V,I D =-85A R DS(ON) < 7.5mΩ @ V GS =-10V R DS(ON) < 6mΩ @ V GS =-20V
- High Power and current handing capability
- Lead free product
- Surface Mount Package
DESCRIPTION
The SSFD3005 uses advanced trench technology to provide excellent R DS(ON) and low gate charge .This device is suitable for use as a load switch or in PWM applications.
APPLICATIONS
- PWM applications
- Load switch
- Power management Schematic D iagram Marking and P in Assignment TO 252E M T op V iew D G S
www.goodark.com Page 2 of 4 Rev.1.0 SSF D3005 30V P-Channel MOSFET Zero Gate Voltage Drain Current I DSS V DS =-24V,V GS =0V -1 μA Gate-Body Leakage Current I GSS V GS =±25V,V DS =0V ±100 nA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V GS(th) V DS GS D =-250μA -1.5 -2.5 -3.5 V V GS =-10V, I D =-20A 6.3 7.5 mΩ Drain-Source On-State Resistance R DS(ON) V GS =-20V, I D =-20A 5.1 6 mΩ Forward Transconductance g FS V DS =-5V,I D =-20A 20 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C lss 4300 PF Output Capacitance C oss 1000 PF Reverse Transfer Capacitance C rss V DS =-15V,V GS =0V, F=1.0MHz 750 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t d(on) 20 nS Turn-on Rise Time t r 30 nS Turn-Off Delay Time t d(off) 50 nS Turn-Off Fall Time t f V DS =-15V,V GS =-10V,R GEN =3Ω I D =1A 35 nS Total Gate Charge Q g 95 nC Gate-Source Charge Q gs 20 nC Gate-Drain Charge Q gd V DS =-15V,I D =-20A,V GS =-10V 30 nC Body Diode Reverse Recovery Time T rr 40 nS Body Diode Reverse Recovery Charge Q rr I F =-20A, dI/dt=100A/µs 30 nC DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V SD V GS =0V,I S =-1A -0.72 -1 V NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on 1in FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing.
www.goodark.com Page 4 of 4 Rev.1.0 SSF D3005 30V P-Channel MOSFET TO-252E-2-M PACKAGE INFORMATION NOTES 1. Dimensions are inclusive of plating 2. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils. 3. Dimension L is measured in gauge plane. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Dimensions in Millimeters UNIT:mm