SSF6908 GOOD-ARK | Alldatasheet

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Technical content

www.goodark.com Page 1 of 7 Rev.1.0 Main Product Characteristics V DSS 68V R DS (on) 6.8mohm(typ.) I D 84A Features and Benefits

Description

Parameter Max. Units I D @ TC = 25°C Continuous Drain Current, V GS @ 10V 84 I D @ TC = 100°C Continuous Drain Current, V GS @ 10V 75 I DM Pulsed Drain Current 336 A Power Dissipation 181 W P D @TC = 25°C Linear Derating Factor 1.2 W/°C V DS Drain-Source Voltage 68 V V GS Gate-to-Source Voltage ± 20 V E AS Single Pulse Avalanche Energy @ L=0.3mH 135 mJ I AS Avalanche Current @ L=0.3mH 30 A T J T STG Operating Junction and Storage Temperature Range -55 to + 175 °C TO-220 Marking and Pin Assignment Schematic Diagram  Advanced trench MOSFET process technology  Special designed for PWM, load switching and general purpose applications  Ultra low on-resistance with low gate charge  Fast switching and reverse body recovery  175 ℃ operating temperature  Lead free product It utilizes the latest trench processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications.

www.goodark.com Page 2 of 7 Rev.1.0 Thermal Resistance Symbol Characteristics Typ. Max. Units R θJC Junction-to-case — 0.83 ℃/W Junction-to-ambient (t ≤ 10s) — 62 ℃/W R θJA Junction-to-Ambient (PCB mounted, steady-state) — 40 ℃/W

Electrical Characteristics

A =25℃ unless otherwise specified Symbol Parameter Min. Typ. Max. Units Conditions V (BR)DSS Drain-to-Source breakdown voltage 68 — — V V GS = 0V, I D = 250μA — 6.8 8 V GS =10V,I D = 30A R DS(on) Static Drain-to-Source on-resistance — 12.7 — mΩ T J = 125℃ 2 — 4 V DS = V GS , I D = 250μA V GS(th) Gate threshold voltage — 2.5 — V T J = 125℃ — — 1 V DS = 68V,V GS = 0V I DSS Drain-to-Source leakage current — — 50 μA T J = 125°C 100 V GS =20V I GSS Gate-to-Source forward leakage -100 nA V GS = -20V Q g Total gate charge — 93.8 Q gs Gate-to-Source charge — 28.5 Q gd Gate-to-Drain("Miller") charge — 26.9 nC I D = 30A, V DS =30V, V GS = 10V t d(on) Turn-on delay time — 20.4 t r Rise time — 94.2 t d(off) Turn-Off delay time — 47.3 t f Fall time — 86.5 ns V GS =10V, V DS =60V, R L =1.0Ω, R GEN =2.55Ω， I D = 60A C iss Input capacitance — 6193 C oss Output capacitance — 308 C rss Reverse transfer capacitance — 253 pF V GS = 0V, V DS = 25V, ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol Parameter Min. Typ. Max. Units Conditions I S Continuous Source Current (Body Diode) — — 84 A I SM Pulsed Source Current (Body Diode) — — 336 A MOSFET symbol showing the integral reverse p-n junction diode. V SD Diode Forward Voltage — 0.82 1.3 V I S =10A, V GS =0V t rr Reverse Recovery Time — 43.1 — nS Q rr Reverse Recovery Charge — 86.5 — nC T J = 25°C, I F =68A, di/dt = 100A/μs

www.goodark.com Page 3 of 7 Rev.1.0 Test Circuits and Waveforms Switch Waveforms: Notes: Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. ②Repetitive rating; pulse width limited by max junction temperature. ③The power dissipation PD is based on max junction temperature, using junction-to-case thermal resistance. ④The value of R θJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C ⑤These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T J(MAX) =175°C.

www.goodark.com Page 6 of 7 Rev.1.0 Mechanical Data Min Nom Max Min Nom Max ФP1 1.500 0.059 e ϴ1 - 7 - - 7 ϴ2 - 7 - - 7 ϴ3 - 3 - 5 ϴ4 - 3 - 1 Symbol Dimension In Millimeters Dimension In Inches 2.54BSC 0.1BSC TO220 PACKAGE OUTLINE DIMENSION_GN E D ФP A ϴ ce b ϴ ϴ L ϴ ФP1

www.goodark.com Page 7 of 7 Rev.1.0 Ordering and Marking Information Device Marking: SSF6908 Package (Available) TO220 Operating Temperature Range C : -55 to 175 ºC Devices per Unit Package Type Units/T ube Tubes/Inner Box Units/Inner Box Inner Boxes/Carton Box Units/Carton Box TO220 50 20 1000 6 6000 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) T J =125℃ to 175℃ @ 80% of Max V DSS CES R 168 hours 500 hours 1000 hours 3 lots x 77 devices High Temperature Gate Bias(HTGB) T J =150℃ or 175℃ @ 100% of Max V GSS 168 hours 500 hours 1000 hours 3 lots x 77 devices