SSF2841 GOOD-ARK | Alldatasheet
Document overview
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- PDF pages: 4
Technical content
www.goodark.com Page 1 of 4 Rev.1.0 PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size Tape Width Quantity SSF2841 SSF2841 TSSOP-8 － － － ABSOLUTE MAXIMUM RATINGS (T A =25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage V DS -20 V Gate-Source Voltage V GS ±12 V I D -5 A Drain Current-Continuous@ Current-Pulsed (Note 1) I DM -20 A Maximum Power Dissipation P D 3.2 W Operating Junction and Storage Temperature Range T J STG -55 To 150 ℃ THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) R θJA 83 /W ℃ GENERAL FEATURES
- V DS = -20V,I D = -5A R DS(ON) <72mΩ @ V GS =-2.5V R DS(ON) < 50mΩ @ V GS =-4.5V
- High Power and current handing capability
- Lead free product
- Surface Mount Package
DESCRIPTION
The SSF2841 uses advanced trench technology to provide excellent R DS(ON) , low gate charge and operation with gate voltages as low as -0.7V. This device is suitable for use as a load switch or in PWM applications. A PPLICATIONS
- PWM applications
- Load switch
- Power management Schematic D iagram TSSOP T op V i e w 1234 8 76 5 8205A SSF2841 P in Assignment
www.goodark.com Page 2 of 4 Rev.1.0 ELECTRICAL CHARACTERISTICS (T A =25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BV DSS V GS =0V I D =-250μA -20 V Zero Gate Voltage Drain Current I DSS V DS =-20V,V GS =0V -1 μA Gate-Body Leakage Current I GSS V GS =±12V,V DS =0V ±100 nA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V GS(th) V DS GS D =-250μA -0.4 -1 V V GS =-4.5V, I D =-5A 41 50 Drain-Source On-State Resistance R DS(ON) V GS =-2.5V, I D =-3A 67 72 mΩ Forward Transconductance g FS V DS =-10V,I D =-5A 9 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C lss 610 PF Output Capacitance C oss 130 PF Reverse Transfer Capacitance C rss V DS =-10V,V GS =0V, F=1.0MHz 100 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t d(on) 27 nS Turn-on Rise Time t r 60 nS Turn-Off Delay Time t d(off) 30 nS Turn-Off Fall Time t f V DD =-10V,I D =-5A V GS =-4.5V,R GEN =1Ω 10 nS Total Gate Charge Q g 9.6 nC Gate-Source Charge Q gs 1.5 nC Gate-Drain Charge Q gd V DS =-10V,I D =-5A,V GS =-4.5V 2.4 nC DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V SD V GS =0V,I S =-1.7A -1.2 V NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testin
www.goodark.com Page 4 of 4 Rev.1.0 TSSOP-8 PACKAGE INFORMATION Dimensions in Millimeters (UNIT: mm) NOTES： 1. All dimensions are in millimeters. 2. Dimensions are inclusive of plating 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.