SSF2300A GOOD-ARK | Alldatasheet
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Suzhou Goodark Electronics Co., Ltd Page 1 of 6 Rev. 2.0 SSF A 20V N-Channel MOSFET PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size Tape Width Quantity 2300A SSF2300A SOT-23 Ø180mm 8 mm 3000 units ABSOLUTE MAXIMUM RATINGS (T A =25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage V DS 20 V Gate-Source Voltage V GS ±10 V I D 4.5 A Drain Current-Continuous@ Current-Pulsed (Note 1) I DM 16 A Maximum Power Dissipation P D 1.2 W Operating Junction and Storage Temperature Range T J STG -55 To 150 ℃ THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) R θJA 140 /W ℃ ELECTRICAL CHARACTERISTICS (T A =25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250μA 20 V GENERAL FEATURES
- V DS = 20V,I D = 4.5A R DS(ON) < 50mΩ @ V GS =2.5V R DS(ON) < 40mΩ @ V GS =4.5V
- High Power and current handing capability
- Lead free product
- Surface Mount Package
DESCRIPTION
The SSF2300A uses advanced trench technology to provide excellent R DS(ON) , low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. APPLICATION S
- Battery protection
- Load switch
- Power management Schematic D iagram Marking and P in Assignment SOT T op V iew D G S
Suzhou Goodark Electronics Co., Ltd Page 2 of 6 Rev. 2.0 SSF A 20V N-Channel MOSFET Zero Gate Voltage Drain Current I DSS V DS =20V,V GS =0V 1 μA Gate-Body Leakage Current I GSS V GS =±10V,V DS =0V ±100 nA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V GS(th) V DS GS D =250μA 0.5 0.7 1.5 V V GS =2.5V, I D =4A 35 50 mΩ Drain-Source On-State Resistance R DS(ON) V GS =4.5V, I D =4.5A 28 40 mΩ Forward Transconductance g FS V DS =10V,I D =4.5A 8 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C lss 500 PF Output Capacitance C oss 250 PF Reverse Transfer Capacitance C rss V DS =10V,V GS =0V, F=1.0MHz 90 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t d(on) 7 nS Turn-on Rise Time t r 55 nS Turn-Off Delay Time t d(off) 16 nS Turn-Off Fall Time t f V DD =10V, R L = 2.8 Ω V GS =4.5V,R GEN =6Ω, I D =3.6A, 10 nS Total Gate Charge Q g 10 nC Gate-Source Charge Q gs 2.3 nC Gate-Drain Charge Q gd V DS =10V,I D =4.2A,V GS =4.5V 2.9 nC DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V SD V GS =0V,I S =1.3A 1.2 V NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing.
Suzhou Goodark Electronics Co., Ltd Page 5 of 6 Rev. 2.0 SSF A 20V N-Channel MOSFET Figure 13 Safe Operation Area I D - Drain Current (A) Vds Drain-Source Voltage (V) r(t),Normalized Effective Transient Thermal Impedance Figure Normalized Maximum Transient Thermal Impedance Square Wave Pluse Duration(sec)
Suzhou Goodark Electronics Co., Ltd Page 6 of 6 Rev. 2.0 SSF A 20V N-Channel MOSFET SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT: mm) Dimensions in Millimeters Symbol MIN. MAX. A 0.900 1.150 A1 0.000 0.100 A2 0.900 1.050 b 0.300 0.500 c 0.080 0.150 D 2.800 3.000 E 1.200 1.400 E1 2.250 2.550 e 0.950TYP e1 1.800 2.000 L 0.550REF L1 0.300 0.500 θ 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.