SSF2300 GOOD-ARK | Alldatasheet

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Technical content

www.goodark.com Page 1 of 6 Rev.2.1 SSF 2300 20V N Channel MOSFET PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size Tape Width Quantity

2300 SSF2300 SOT-23 Ø180mm 8 mm 3000 units

ABSOLUTE MAXIMUM RATINGS (T A =25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage V DS 20 V Gate-Source Voltage V GS ±8 V I D (25℃) 2.4 A I D (70℃) 1.7 A Drain Current-Continuous@ Current-Pulsed (Note 1) I DM A Maximum Power Dissipation P D 0.9 W Operating Junction and Storage Temperature Range T J STG -55 To 150 ℃ THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient (Note 2) R θJA 140 /W ℃ ELECTRICAL CHARACTERISTICS (T A =25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit OFF CHARACTERISTICS Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250μA 20 V Zero Gate Voltage Drain Current I DSS V DS =20V,V GS =0V 1 μA Gate-Body Leakage Current I GSS V GS =±8V,V DS =0V ±100 nA ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V GS(th) V DS GS D =250μA 0.65 0.95 1.2 V GENERAL FEATURES

  • V DS = 20V,I D = 2.4A R DS (ON) < 110mΩ @ V GS =2.5V R DS (ON) < 55mΩ @ V GS =4.5V
  • High Power and current handing capability
  • Lead free product
  • Surface Mount Package

DESCRIPTION

The SSF2300 uses advanced trench technology to provide excellent R DS(ON) , low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. A PPLICATION S

  • Battery protection
  • Load switch
  • Power management Schematic D iagram Marking and P in Assignment SOT T op V iew D G S

www.goodark.com Page 2 of 6 Rev.2.1 SSF 2300 20V N Channel MOSFET V GS =2.5V, I D =3.1A 68 110 mΩ Drain-Source On-State Resistance R DS(ON) V GS =4.5V, I D =3.6A 42 55 mΩ Forward Transconductance g FS V DS =5V,I D =3.6A 8 S DYNAMIC CHARACTERISTICS (Note4) Input Capacitance C lss 300 PF Output Capacitance C oss 120 PF Reverse Transfer Capacitance C rss V DS =10V,V GS =0V, F=1.0MHz 80 PF SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time t d(on) 7 15 nS Turn-on Rise Time t r 55 80 nS Turn-Off Delay Time t d(off) 16 60 nS Turn-Off Fall Time t f V DD =10V, R L = 2.8 Ω V GS =4.5V,R GEN =6Ω, I D =3.6A, 10 25 nS Total Gate Charge Q g 4.0 10 nC Gate-Source Charge Q gs 0.65 nC Gate-Drain Charge Q gd V DS =10V,I D =3.6A,V GS =4.5V 1.5 nC DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3) V SD V GS =0V,I S =0.94A 0.76 1.2 V Diode Forward Current (Note 2) I S 0.94 A NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on 1in FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing.

www.goodark.com Page 6 of 6 Rev.2.1 SSF 2300 20V N Channel MOSFET SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT: mm) Dimensions in Millimeters Symbol MIN. MAX. A 0.900 1.150 A1 0.000 0.100 A2 0.900 1.050 b 0.300 0.500 c 0.080 0.150 D 2.800 3.000 E 1.200 1.400 E1 2.250 2.550 e 0.950TYP e1 1.800 2.000 L 0.550REF L1 0.300 0.500 θ 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact 。