SSF1116A SILIKRON | Alldatasheet

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©Silikron Semiconductor Corporation 2010.12.1 Version: 1.1 page 1of5 SSF1116A Absolute Maximum Ratings Parameter Max. Units ID@Tc=25 ْC Continuous drain current,VGS@10V 75 A ID@Tc=100ْC Continuous drain current,VGS@10V 61 IDM Pulsed drain current ① 300 PD@TC=25ْC Power dissipation 2 72 W Linear derating factor 1.5 W/ ْC VGS Gate-to-Source voltage ±20 V EAS Single pulse avalanche energy ② 300 mJ EAR Repetitive avalanche energy TBD mJ dv/dt Peak diode recovery voltage 31 v/ns TJ TSTG Operating Junction and Storage Temperature Range –55 to +175 ْC Thermal Resistance Parameter Min. Typ. Max. Units RθJC Junction-to-case — 0.55 — ْC/W RθJA Junction-to-ambient — — 62 Electrical Characteristics @TJ=25 ْC (unless otherwise specified) Parameter Min. Typ. Max. Units Test Conditions BVDSS Drain-to-Source breakdown voltage 110 120 — V V GS=0V,ID=250μA RDS(on) Static Drain-to-Source on-resistance — 12 16 m Ω VGS=10V,ID=30A VGS(th) Gate threshold voltage 2.0 — 4.0 V V DS=VGS,ID=250μA IDSS Drain-to-Source leakage current — — 2 μA VDS=110V,VGS=0V — — 10 VDS=110V, VGS=0V,TJ=150ْC IGSS Gate-to-Source forward leakage — — 100 nA VGS=20V Gate-to-Source reverse leakage — — -100 V GS=-20V SSF1116A TOP View (D2PAK) ID =75A BV=110V Rdson=12mΩ (Typ.) Feathers: „ Advanced trench process technology „ avalanche energy, 100% test „ Fully characterized avalanche voltage and current Description: The SSF1116A is a new generation of high voltage and low current N–Channel enhancement mode trench power MOSFET. This new technology increases the device reliability and electrical parameter repeatability. SSF1116A is assembled in high reliability and qualified assembly house. Application: „ Power switching application

©Silikron Semiconductor Corporation 2010.12.1 Version: 1.1 page 2of5 SSF1116A Qg Total gate charge — 110 nC ID=30A,VGS= 1 0 V VDD=30V Qgs Gate-to-Source charge — 22 — Qgd Gate-to-Drain("Miller") charge — 39 — td(on) Turn-on delay time — 20 nS VDD= 3 0 V ID=2A ,RL=15Ω RG=2.5Ω VGS=10V tr Rise time — 16 td(off) Turn-Off delay time — 69 tf Fall time — 19 Ciss Input capacitance — 3150 pF VGS= 0 V VDS= 2 5 V f=1.0MHZ Coss Output capacitance — 350 Crss Reverse transfer capacitance — 240 Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Test Conditions IS Continuous Source Current (Body Diode) — — 75 A MOSFET symbol showing the integral reverse p-n junction diode. ISM Pulsed Source Current (Body Diode) ① — — 300 VSD Diode Forward Voltage — — 1.3 V TJ=25ْC,IS=60A,VGS=0V ③ trr Reverse Recovery Time － 54 — nS TJ=25ْC,IF=75A di/dt=100A/μs ③ Qrr Reverse Recovery Charge － 131 — μC ton Forward Turn-on Time Intrinsic turn-on time is negligible (turn-on is dominated by Ls + LD) E A S T e s t C i r c u i t : G a t e C h a r g e T e s t C i r c u i t : Notes: ① Repetitive rating; pulse width limited by max junction temperature. ② Test condition: L =0.3mH, VDD = 50V,Id=45A ③ Pulse width≤300μS, duty cycle≤1.5% ; RG = 25Ω Starting TJ = 25°C

©Silikron Semiconductor Corporation 2010.12.1 Version: 1.1 page 3of5 SSF1116A S w i t c h T i m e T e s t C i r c u i t : S w i t c h W a v e f o r m : Transfer Characteristic Capacitance On Resistance vs. Junction Temperature Breakdown Voltage vs. Junction Temperature

©Silikron Semiconductor Corporation 2010.12.1 Version: 1.1 page 4of5 SSF1116A Gate Charge Source-Drain Diode Forward Voltage Safe Operation Area Max Drain Current vs. Junction Transient Thermal Impedance Curve

©Silikron Semiconductor Corporation 2010.12.1 Version: 1.1 page 5of5 SSF1116A D2PAK MECHANICAL DATA: