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© Semiconductor Components Industries, LLC, 2015 September, 2015 − Rev. 1

1 Publication Order Number:

Micro−Packaged Diodes for ESD Protection The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium. Specification Features

  • Low Capacitance 12 pF
  • Low Clamping V oltage
  • Small Body Outline Dimensions: 0.60 mm x 0.30 mm
  • Low Body Height: 0.3 mm
  • Stand−off Voltage: 5.0 V
  • Low Leakage
  • Response Time is < 1 ns
  • IEC61000−4−2 Level 4 ESD Protection
  • IEC61000−4−4 Level 4 EFT Protection
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 3 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±15 ±15 kV Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient °PD° R/C0113JA 250 400 mW °C/W Junction and Storage Temperature Range TJ, Tstg −40 to +125 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Peak Pulse Current, 8 x 20 /C0109s double exponential waveform (Figure 5) Ipp 2.0 A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping †

ORDERING INFORMATION

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. www.onsemi.com SSESD11B5.0ST5G DSN2 (Pb−Free) 5000 / Tape & Reel DSN2 CASE 152AS MARKING DIAGRAM A = Specific Device Code A

Bi−Directional TVS IPP IPP V I IR IT IT IRVRWMVC VBR VRWM VCVBR SSESD11B www.onsemi.com

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current *See Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Device Device Marking VRWM (V) IR (/C0109A) @ VRWM VBR (V) @ IT (Note 2) IT C (pF) VC (V) @

1 A VC

(Note 3) Per IEC61000−4−2 (Note 4) See Below Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. V BR is measured with a pulse test current IT at an ambient temperature of 25°C. 3. Surge current waveforms per Figure 5. 4. For test procedure see Figures 3 and 4 and Application Note AND8307/D. Figure 1. ESD Clamping Voltage Screenshot Figure 2. ESD Clamping Voltage Screenshot

www.onsemi.com PACKAGE DIMENSIONS CASE 152AA ISSUE A MOUNTING FOOTPRINT* DIMENSIONS: MILLIMETERS 0.75 0.28 0.300.28 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. XXXX YYY JAN XXXX Y09 YEAR CODE DEVICE CODE FEB MAR SEP DEC JUN OCTNOV INDICATES AUG 2009 (EXAMPLE) CATHODE BAND MONTH CODING See Application Note AND8398/D for more mounting details NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B E D BOTTOM VIEW b e

0.05 B AC

2X 0.06 C TOP VIEW 2X 0.06 C A 0.05 C 0.05 C C SEATING PLANE SIDE VIEW DIM MIN MAX MILLIMETERS A 0.24 0.30 A1 0.00 0.01 b 0.20 0.22 D 0.30 BSC E 0.60 BSC e 0.40 BSC L 0.10 0.12 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 SSESD11B/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative