SS8219G SSC | Alldatasheet
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Technical content
www.SiliconStandard.com 1 of 10 SS8219G 12/06/2005 Rev.3.01 Ultra320 Multi-mode LVD/SE SCSI Terminator PRODUCT SUMMARY Auto-selectable single-ended or LVD termination Meets SCSI-1, SCSI-2, SCSI-3 SPI Ultra (Fast-20), Ultra 2 (SPI-2 LVD), Ultra160 (SPI-3 LVD) and Ultra320 (SPI-4 LVD) standards Supports active negation Channel capacitance of 3pF Operation from 2.9V to 5.5V Thermal protection Hot-swap compatible Tolerance of 5% on termination resistance Available in 28 pin TSSOP or 36 pin SSOP
APPLICATIONS
High performance data storage systems in servers, workstations, high-end and industrial PCs, and RAID disk arrays.
DESCRIPTION
The SS8219G multi-mode LVD/SE SCSI terminator provides a smooth transition between modes of the SCSI Parallel Interface. It automatically senses the bus via DIFFSENS and switches the termination to either single-ended (SE) or low voltage differential (LVD) SCSI, based on which type of devices are connected to the bus. If the SS8219G detects an HVD SCSI device, it switches to a high impedance state. A 16-bit wide SCSI bus requires three SS8219G for termination. This multi-mode terminator contains all the functions to terminate, auto detect and switch modes for SCSI Parallel Interface (SPI) bus architectures. For SE termination, one regulator and nine precision 110Ω resistors are used. For LVD termination, the SS8219G integrates 18 regulated supplies with nine precision resistor strings. PIN CONFIGURATION R1- R1+ R2- NC/ HS GND R3+ R3- R4+ R4- R5+ R5- DISCNCT GND TPWR R9- R9+ R8+ R8- R7- R6- R6+ DIFFB DIFFSENSE M/S VREF R2+ TPWR R7+ R1- R1+ R2- NC/ HS GND R3+ R3- R4+ R4- R5+ R5- DISCNCT GND TPWR R9- R9+ R8+ R8- R7- R6- R6+ DIFFB DIFFSENSE M/S 28 pin TSSOP VREF R2+ TPWR R7+ NC/ HS GND 34NC NC R1+ R1- R2- HS/GND HS/GND R3+ R3- R4+ R4- R5+ R5- DISCNCT GND TPWR HVD LVD SE R9- R9+ R8- R8+ HS/GND HS/GND HS/GND R7- R7+ R6- R6+ DIFFB DIFFSENSE M/S VREF R2+ HS/GND 36 pin SSOP Pb-free, RoHS compliant. SPI mode auto-detection/switching. Pin/pin compatible with popular industry standard parts DS2118/9 and UCC5672
FEATURES
www.SiliconStandard.com 2 of 10 12/06/2005 Rev.3.01 SS8219G
ORDERING INFORMATION
TR = tape and reel; TB = tubes For example: SS8219GD TR GD = RoHS-compliant TSSOP-28 => SS8219 in RoHS-compliant TSSOP-28 GS = RoHS-compliant SSOP-36 supplied on tape and reel
APPLICATION INFORMATION
The SS8219G is used in multi-mode active-termination applications where single ended (SE) and low voltage differential (LVD) devices might coexist. The LVD termin- ation section consists of 18 source/sink amplifiers (VTOP, VBOT), biasing circuitry and nine precision resistor strings (RTOP, RMID, RBOT). The SE termination section consists of a 2.85V source/sink regulator with nine precision 110W resistors. The DIFFSENSE section consists of a 1.3V, 5mA driver and a sensing circuit (Fig.1). DIFFSENS is used to identify which types of SCSI devices are present on the bus. If the voltage on DIFFSENS is between 0V and 0.5V the bus is single- ended; if it is between 0.7V and 1.9V, the bus is LVD; and if it is greater than 2.4V, the bus is HVD. The SS8219G DIFFB pin monitors the DIFFSENS line to determine the proper operating mode of the device. HVD Isolation Mode: The SS8219G identifies that there is an HVD (high voltage differential) device on the SCSI bus and isolates the termination pins from the bus. When DISCNCT is pulled high, or during thermal shutdown, the termination pins are isolated from the SCSI bus and VREF is grounded. The DIFFSENSE driver is shut down during either of these two events. To ensure proper operation, the TPWR pin should be connected to the SCSI bus TERMPWR line. As with all analog circuitry, the TERMPWR lines should be by- passed locally. A 2.2µF capacitor and a 0.01µF high frequency capacitor are recommended between TPWR and ground and placed as close as possible to the SS8219G. The IC should be placed as close as possible to the SCSI connector to minimize both signal and power trace length, thereby reducing the input capacitance and reflections which can degrade the bus signals. The DIFFSENSE pin can drive the SCSI DIFFSENS line (when M/S is pulled high) to determine the SCSI bus operating mode. The SS8219G switches to the appropriate termination mode for the bus based on the value of the DIFFSENS voltage. These modes are: LVD mode: LVD termination is provided by a precision resistor string with two amplifiers. This configuration yields a 105Ω differential and 150Ω common mode impedance. A fail safe bias of 112mV is maintained when no drivers are connected to the SCSI bus. SE mode: When the external driver for a given signal line turns off, the active terminator will pull that signal line to 2.85 volts (quiescent state). When used with an active-negation driver, the power amp can sink 22mA per line while keeping the voltage reference in regulation. The terminating resistors maintain their 110 Ω value. To maintain the specified regulation, a 4.7µF capacitor is required between the VREF pin and ground of each SS8219G. A high frequency capacitor (0.1µF ceramic recommended) can also be placed on the VREF pin in applications that use fast rise/fall time drivers. A typical SCSI bus configuration is shown in Figure 2. An internal pull-down resistor assures that the SS8219G will still terminate the bus if the DISCNCT pin is left floating. DIFFSENS noise filtering The SS8219G incorporates an internal digital filter to remove the noise signal on the DIFFSENS control line, thereby eliminating erroneous switching between modes. An external filter may also be used in addition to this internal digital filter. DIFFSENS - refers to the SCSI bus signal. DIFFSENSE - refers to the SS8219G pin name and internal circuitry related to differential sensing. DIFFB - refers to the SS8219G pin name and internal circuitry related to monitoring the DIFFSENS line. Please note for the following sections :
www.SiliconStandard.com 3 of 10 12/06/2005 Rev.3.01 SS8219G BLOCK DIAGRAM (Figure 1) DI FFB DI FFSENSE SE LVD HV D THERMA L SHUTDOW N CI RCUI TRY DI SCNCT CO NTROL LOGIC VR E F DI FFSENSE CI RCUI TRY RE FERENCE GENERATION VR E F R1- R9- VT OP 1 RTO P1 RMID1 RBO T1 R1+ R1- R9- R9+ R1- R9- SE GND DRIV ER VBOT 1 R1+ R9+ 36pin SSOP only ( ) X 9 X 9 RTO P9 RMID9 RBO T9 M/S DI FFB DI FFSENSE SE LVD HV D THERMA L SHUTDOW N CI RCUI TRY DI SCNCT CO NTROL LOGIC VR E F DI FFSENSE CI RCUI TRY RE FERENCE GENERATION VR E F 110 W 110 W R1- R9- VT OP 1 RTO P1 RMID1 RBO T1 R1+ R1- R9- R9+ R1- R9- SE GND DRIV ER VBOT 1 R1+ R9+ 36pin SSOP only ( ) X 9 X 9 RTO P9 RMID9 RBO T9 M/S
www.SiliconStandard.com 4 of 10 12/06/2005 Rev.3.01 SS8219G SCSI BUS CONFIGURATION (Figure 2) TPWR M/S DISCNCT DIFFSENSE CONTROL LINES (9) DIFFSENS TPWR TERMPWR 20K VREF DIFFB 0.1µF DIFFSENSE DIFFB VREF TERMPWR TPWR M/S DISCNCT DIFFB VREF TPWR DIFFB VREF TPWR DATA LINES (9) VREF DIFFB TPWR VREF DIFFB DATA LINES (9) 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF M/S DISCNCT M/S DISCNCT M/S DISCNCT M/S DISCNCT 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 0.1µF 20K TPWR M/S DISCNCT DIFFSENSE CONTROL LINES (9) DIFFSENS TPWR TERMPWR 20K VREF DIFFB 0.1µF DIFFSENSE DIFFB VREF TERMPWR TPWR M/S DISCNCT DIFFB VREF TPWR DIFFB VREF TPWR DATA LINES (9) VREF DIFFB TPWR VREF DIFFB DATA LINES (9) 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF M/S DISCNCT M/S DISCNCT M/S DISCNCT M/S DISCNCT 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 0.1µF 20K SS8219G SS8219G SS8219G SS8219G TPWR M/S DISCNCT DIFFSENSE CONTROL LINES (9) DIFFSENS TPWR TERMPWR 20K VREF DIFFB 0.1µF DIFFSENSE DIFFB VREF TERMPWR TPWR M/S DISCNCT DIFFB VREF TPWR DIFFB VREF TPWR DATA LINES (9) VREF DIFFB TPWR VREF DIFFB DATA LINES (9) SS8219GSS8219G 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF 2.2µF M/S DISCNCT M/S DISCNCT M/S DISCNCT M/S DISCNCT 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 0.1µF 20K
www.SiliconStandard.com 5 of 10 12/10/2005 Rev.3.01 SS8219G RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN TYP MAX UNITS Vtpwr(SE) 4.0 5 5.5 Termpower Voltage Vtpwr(LVD) 2.9 5 5.5 V Logic 0 Vil -0.3 +0.8 V Logic 1 Vih 2.0 V tpwr+0.3 V Operating Temperature T amb 0 70 °C ELECTRICAL CHARACTERISTICS (from TA = 0°C to 70°C, unless otherwise spedified) PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS LVD Terminator Section Differential Mode Termination Resistance Rdm 100 105 110 W Common Mode Termination Resistance Rcm 110 150 190 W Differential Mode Bias Vdm All lines Open 100 112 125 mV Common Mode Bias Vcm 1.125 1.25 1.375 V Single Ended Terminator Section Output Capacitance Cout Note 3 pF SE Termination Resistance Rse Vline = 0-3.0 volts 104.5 110 115.5 W SE Voltage Reference Vref 2.79 2.85 2.93 Volts SE output Current Iose Vline = 0.2 volts 25.4 mA Regulator Section Line Regulation LIREG 1.0 2.5 % Load Regulation LOREG 1.3 3.5 % Current Limit ILIM 350 mA Sink Current ISINK 200 mA DC Section SE mode (No Load) 4 Termpower Current Itpmr LVD mode (No Load) 20 mA Input Leakage High Iih -1.0 µA Input Leakage Low Iil 1.0 µA Output Current High Ioh V out = 2.4 volts; SE/LVD/HVD Pins only -1.0 mA Output Current Low Iol V out=0.4 volts; SE/LVD/HVD Pins only 4.0 mA DIFFSENS Section DIFFSENS SE Operating Range Vseor -0.3 0.5 V DIFFSENS LVD Operating Range V lvdor 0.7 1.9 V DIFFSENS HVD Operating Range V hvdor 2.4 Vtpwr+0.3 V DIFFSENSE Driver Output Voltage V dso M/S=1; I ds = 0-5mA 1.2 1.4 V DIFFSENSE Driver Source Current I dsh M/S = 1; V dso=0V 5 15 mA DIFFSENSE Driver Sink Current Idsl M/S=1; V dso=2.75V 20 200 µA Note: guaranteed by Design.
www.SiliconStandard.com 6 of 10 12/10/2005 Rev.3.01 SS8219G Common Mode Bias Vcm vs. Temperature 1.125 1.175 1.225 1.275 1.325 1.375 -20 0 20 40 60 80 100 Temperature(ºC) Vcm(V) Vtpwr=2.8V Vtpwr=5.8V Common Mode Bias Vcm vs. Vtpwr 1.125 1.175 1.225 1.275 1.325 1.375 2.5 3.5 4.5 5.5 Vtpwr Vcm(V) T=80ºC T=-10ºC Common Mode Termination Resistance Rcm vs. Vtpwr at Temperature=24ºC 110 120 130 140 150 160 170 180 190 2.5 3.5 4.5 5.5 Vtpwr Rcm(Ohm) Common Mode Termination Resistance Rcm vs. Temperature at Vtpwr=5V 110 120 130 140 150 160 170 180 190 -20 0 20 40 60 80 100 Temperature(ºC) Rcm(Ohm) Differential Mode Termination Resistance Rdm vs. Vtpwr 100 101 102 103 104 105 106 107 108 109 110 2.5 3.5 4.5 5.5 Vtpwr Rdm(Ohm) T=80ºC T=-10ºC Differential Mode Termination Resistance Rdm vs. Temperature 100 102 104 106 108 110 -20 0 20 40 60 80 100 Temperature(ºC) Rdm(Ohm) Vtpwr=2.8V Vtpwr=5.8V Differential Mode Bias Vdm vs. Temperature@Vtpwr=5V 0.1 0.105 0.11 0.115 0.12 0.125 -20 0 20 40 60 80 100 Temperature(ºC) Vdm(V) Differential Mode Bias Vdm vs. Vtpwr 0.1 0.105 0.11 0.115 0.12 0.125 2.5 3.5 4.5 5.5 Vtpwr Vdm(V) T=-10ºC T=80ºC
www.SiliconStandard.com 7 of 10 12/10/2005 Rev.3.01 SS8219G SE Termination Resistance Rse vs. Vtpwr at T=24ºC; Vline=0V 105 107 109 111 113 115 3.5 4.5 5.5 Vtpwr Rse(Ohm) SE Termination Resistance Rse vs. Vtpwr at Vline=0V 105 106 107 108 109 110 111 112 113 114 115 -20 0 20 40 60 80 100 Temperature(ºC) Rse(Ohm) SE Termination Resistance Rse vs. Vtpwr at Vtpwr=5V; T=24ºC 105 107 109 111 113 115 0123 Vline Rse(Ohm) Vref vs. Ivref at Vtpwr=5V 2.79 2.81 2.83 2.85 2.87 2.89 2.91 2.93 -250 -150 -50 50 150 250 350 Ivref(mA) Vref T=80ºC T=-10ºC Vref vs. Temperature at Ivref=0mA 2.79 2.81 2.83 2.85 2.87 2.89 2.91 2.93 -20 0 20 40 60 80 100 Temperature(ºC) Vref Vtpwr=5.8V Vtpwr=3.8V Vref vs. Vtpwr at T=24ºC 2.79 2.81 2.83 2.85 2.87 2.89 2.91 2.93 3.5 4.5 5.5 Vtpwr Vref Ivref=360mA Ivref=-200mA Ivref=0mA Vtpwr=3.8V Vtpwr=5.8V
www.SiliconStandard.com 8 of 10 12/10/2005 Rev.3.01 SS8219G PIN DESCRIPTION (for 28pin TSSOP) PIN SYMBOL DESCRIPTION 1 VREF Reference Voltage. 2.85-volt reference in SE mode and 1.25V in LVD mode; must be connected to a 4.7µF capacitor. 2-5,7-12, Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. 6,22 NC/ HS GND No Connect/Heat Sink Ground. Should be grounded for heat sinking purpose 13 DISCNCT Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. 14 GND Ground. Terminator ground pin. Connected to ground. 15 M/S Master/slave. Used to select which terminator is the controlling device. M/S pin high enables the DIFFSENSE driver. 16 DIFFSENSE Output to drive the SCSI bus DIFFSENS line.
17 DIFFB
An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB pin should be connected by a 0.1µF capacitor to GND and by a 20kW resistor to the SCSI bus DIFFSENS line. 27,28 TPWR Terminator Power. Connect to the SCSI TERMPWR line and de-couple with a 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed. PIN DESCRIPTION (for 36pin SSOP) PIN SYMBOL DESCRIPTION 1 VREF* Reference Voltage. 2.85-volt reference; must be connected to a 4.7µF capacitor. 2,3 NC No Connect. Do not connect these pins. 4-7,11-16, 22-25, 29-32 Rx+ Rx- Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. 8, 9,10,26, 27,28 HS/GND Heat Sink Ground. Connect to large area PC board traces to increase power dissipation capability. 17 DISCNCT Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. 18 GND Ground. Terminator ground pin. Connected to ground. 19 M/S Master/slave. Used to select which terminator is the controlling device. M/S pin high enables the DIFFSENSE driver. 20 DIFFSENSE Output to drive the SCSI bus DIFFSENS line.
21 DIFFB
An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB pin should be connected by a 0.1µF capacitor to GND and 20kW resistor to the SCSI bus DIFFSENS line. 33 SE Single ended mode indicator. It is HIGH when terminator is operating in SE mode. 34 LVD Low Voltage Differential mode indicator. It is HIGH when terminator is operating in LVD mode. 35 HVD High Voltage Differential mode indicator. It is HIGH when terminator is operating in HVD mode 36 TPWR Terminator Power. Connect to SCSI bus TERMPWR line and decouple with 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed.
www.SiliconStandard.com 9 of 10 Rev.2.02 12/06/2003 SS8219G PHYSICAL DIMENSIONS (36pin SSOP - order package option S) b 0.300 0.450 0.012 0.018 c 0.127 0.254 0.005 0.010 e 0.800 BASIC 0.032 BASIC E 10.033 10.668 0.395 0.420 h 0.381 0.635 0.015 0.025 L 0.508 1.016 0.020 0.040 Θ 0º 8º 0º 8º Taping Specification h x 45° C L Θ E1 E SEATING PLANE 0.004 C D be A Feed Direction Typical SSOP, TSSOP Package Orientation Feed Direction Typical SSOP, TSSOP Package Orientation
www.SiliconStandard.com 10 of 10 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expre ss or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 12/10/2005 Rev.3.01 SS8219G PHYSICAL DIMENSIONS (28pin TSSOP - order package option D) Note: 1. Package body dimensions exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1mm unless otherwise specified 3. Coplanarity : 0.1mm 4. Controlling dimensions are in millimeters. Converted inch dimensions are not necessarily accurate. 5. Follows JEDEC MO-153 DIMENSION IN MM DIMENSION IN INCH E1 E D b A C L Θ e