SS8027GT55TB

SS8027G SSC | Alldatasheet

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Technical content

www.SiliconStandard.com 1 of 10 SS8027G 5/26/2005 Rev.2.2 3.3V 1A Low Dropout Regulator

FEATURES

Dropout voltage typically 0. 8V @ I O = 1A Output current in excess of 1A Output voltage accuracy ±2% Quiescent current, typically 600µA Internal short circuit current limit Internal over temperature protection

APPLICATIONS

DESCRIPTION

The SS8027G positive 3.3V voltage regulator features the ability to source 1A of output current with a dro p- out voltage of typically 0.8V over the entire operating temperature range. A low quiescent current is pr o- vi ded over the entire output current range. The typical quiescent current is 0.6mA. Furthermore, quiescent current is reduced when the regulator is in the dropout mode (VIN < 3.3V). Familiar regulat or features such as over-temperature and over-current protection circuits are provided to prevent the device from being damaged by a bnormal operating conditions.

ORDERING INFORMATION

PACKAGE TYPE PIN OPTION PACKING GT3 : TO 220 Pb-free 1 2 3 TR : Tape & Reel GT4 : TO 252 Pb-free 1 : VOUT GND V IN TB : Tube GT5 : TO 263 Pb-free 2 : VOUT V IN GND GT6 : SOT 223 Pb-free 3 : GND V OUT V IN 4 : GND V IN V OUT 5 : V IN GND V OUT 6 : V IN V OUT GND TYPICAL APPLICATION PIN CONFIGURATION 0.47µF IQ VIN VOUT IO COUT 10µF 1 32 Top View 1 2 3 Top View 1 2 3 Top ViewSS8027G 0.47µF IQ VIN VOUT IO COUT 10µF 1 32 Top View 1 2 3 Top View 1 2 3 Top View 1 3 TO-220 Top ViewTop View 1 2 3 SOT-223 Top View 1 2 3 TO-252 and TO-263 Top View Pb-free, RoHS compliant.

www.SiliconStandard.com 2 of 10 5/26/2005 Rev.2.2 SS8027G Absolute Maximum Ratings (Note 1) Power Dissipation Internally Limited . (N ote 2) Lead Temperature, Time for Wave Soldering TO 220, TO 263 Pac Continuous Power Dissipation (TA = +25°C) SOT 223(1) TO 252(1) TO 263(1) TO 220(1) Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1)

Electrical Characteristics

VIN =5V, I O = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX UNITS Output Voltage 50mA < IO <1A 3.234 3.3 3.366 V Line Regulation 4V < VIN < 7V, IO = 10mA 20 30 mV Load Regulation 50mA < IO < 1A 30 50 mV Output Impedance 200mA DC and 100mA AC, fo = 120Hz 100 mΩ Quiescent Current VIN = 5V 0.6 mA Ripple Rejection fi = 120Hz, 1VP-P, Io = 100mA 42 dB IO = 1A 0.8 V Dropout Voltage IO = 100mA 200 mV Short Circuit Current 1.6 1.9 A Over Temperature 125 °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con- ditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θ JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θ JA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the SS8027G in the SOT-223 package, θJA is 156°C/W; in the TO-252 pac kage, θ JA is 125°C/W; in the TO-263 package, θ JA is 75 °C/W, and in the TO-220 package, θ JA is 60°C/W (no heat sink). [See Recom mended Minimum Footprint] If the TO-220 package is used with a heat sink, θ JA is the sum of the package the rmal resistance junction-to-case (θ JC) of 3°C/W and the thermal resistance a dded by the heat sink and the rmal interface.The thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the pac kage. The safe op- eration area of SOT-223, TO-252, TO-263 or TO-220 packages can be seen in “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty-cycle pulse techniques are used during test to maintain the junction temperature as close to ambient temperature as possible. Note4: The output capacitor should be a tantalum or aluminum type.

www.SiliconStandard.com 3 of 10 5/26/2005 Rev.2.2 SS8027G Definitions Dropout Voltage The input/output voltage differential at which the regu- lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cu r- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques, so that ave rage chip temperature is not significantly af- fected. Load Regulation The change in output voltage for a change in load cu r- rent at constant chip temperature. The measur ement is made under conditions of low dissipation or by u s- ing pulse techniques, so that average chip tempera- ture is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.

www.SiliconStandard.com 4 of 10 5/26/2005 Rev.2.2 SS8027G Typical Performance Characteristics (VIN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.) 200 400 600 800 1000 1200 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Dropout Voltage (mV) 3.260 3.280 3.300 3.320 3.340 3.360 3.380 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Output Voltage (V) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ground Current (mA) Line Transient Load Transient Ch1: Vout (offset=3.30V) Ch2: Vin (offset=5.0V) Iout=100mA Ch1: Vout (offset=3.30V) Ch2: Iout (780mA/div) Output Voltage vs. Load Current Dropout Voltage vs. Load Current Ground Current vs. Load Current

www.SiliconStandard.com 5 of 10 5/26/2005 Rev.2.2 SS8027G Typical Performance Characteristics (continued) 100 200 300 400 500 600 700 800 900 1000 1100 1200 Input-Output Voltage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J 1oz Copper on SOT 223 Package Mounted on recommended mimimum footprint (R£cJA=156°C/W) Maximum recommended output current TA =25°C,Still Air Note: VIN(max) <= 6.5V 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Power Dissipation (W) Still Air 1oz Copper on SOT 223 Package Mounted on recommend mimimum footprint (R£cJA=156°C/W) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Power Dissipation (W) Still Air 1oz Copper on TO 252 Package Mounted on recommend mimimum footprint (R£cJA=125°C/W) 100 200 300 400 500 600 700 800 900 1000 1100 1200 Input-Output Voltaage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J 1oz Copper on TO 263 Package Mounted on recommended mimimum footprint (R£cJA=75°C/W) Maximum recommended output current TA=25°C,Still Air 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA ( ¢J) Power Dissipation (W) Still Air 1oz Copper on TO 263 Package Mounted on recommend mimimum footprint (R£cJA=75°C/W) 100 200 300 400 500 600 700 800 900 1000 1100 1200 Input-Output Voltaage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J Maximum recommended output current TA=25°C,Still Air 1oz Copper on TO 252 Package Mounted on recommended mimimum footprint (R£cJA=125°C/W) Note: VIN(max) <= 6.5V Safe Operating Area of SOT 223 Maximum Power Dissipation of SOT 223 Safe Operating Area of TO 252 Maximum Power Dissipation of TO 252 Maximum Power Dissipation of TO 263Safe Operating Area of TO 263 Note: VIN(max) <= 6.5V

www.SiliconStandard.com 6 of 10 5/26/2005 Rev.2.2 SS8027G Typical Performance Characteristics (continued) 100 200 300 400 500 600 700 800 900 1000 1100 1200 Input-Output Voltaage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J Maximum recommended output current TA=25°C,Still Air No Heat Sink Mounted on TO 220 recommended mimimum footprint, without heat sink (R£cJA=60°C/W) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Power Dissipation (W) Maximum Power Dissipation of TO 220 No Heat Sink Still Air 1oz Copper on TO 220 Package Mounted on recommend mimimum footprint (R£cJA=60°C/W) Safe Operating Area of TO 220 Note: VIN(max) <= 6.5V Recommended Minimum Footprint

www.SiliconStandard.com 7 of 10 5/26/2005 Rev.2.2 SS8027G

Package Information

TO-220 (GT3) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336 0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565 E RE1 E1 D d I L e b b1e1 A F C

www.SiliconStandard.com 8 of 10 5/26/2005 Rev.2.2 SS8027G TO-252 (GT4) Package MILLIMETERS INCHES SYMBOL MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 0.215 e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4° F A E D b e Ce1 H θ F A E D b e Ce1 H θ

www.SiliconStandard.com 9 of 10 5/26/2005 Rev.2.2 SS8027G SOT-223 (GT6) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC 0.090 BSC e1 4.60 BSC 0.181 BSC H 6.70 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC a 0º 10º 0º 10º Package Orientation A B 13°(4X) e E D H C α 13 °(4X) L Feed Direction Feed Direction TO-252 and TO-263 Package Orientation

www.SiliconStandard.com 10 of 10 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expre ss or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 5/26/2005 Rev.2.2 SS8027G TO-263 (GT5) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.70 10.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAX e D H b E A C L