SS8026T45TR

SS8026 SSC | Alldatasheet

Document overview

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• PDF pages: 12

Technical content

Features

Output current in excess of 1A Output voltage accuracy +2.5%/-2% Quiescent current typically 480µA Internal short-circuit current-limit Internal over-temperature protection

Applications

The SS8026 positive 1.8V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.48mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. SS8026XXXXX Packing Type Pin Option Package Type PACKAGE TYPE PIN OPTION PACKING T2 : SOT-89 1 2 3 TR : Tape & Reel T3 : TO 220 1 : V OUT GND V IN TB : Tubes T4 : TO 252 2 : V OUT V IN GND T5 : TO-263 3 : GND V OUT V IN T6 : SOT-223 4 : GND V IN V OUT 5 : VIN GND V OUT 6 : VIN V OUT GND Typical Application Pin Configuration [Note 4] : Type of COUT SS8026 1µ F IQ VIN VOUT IO COUT 10µF Top View 1 32 Top View 1 2 3 Top View 1 2 3 Top View 1 32 Top View 1 3 TO-220 Top View 1 2 3 Top ViewTop View 1 2 3 SOT-223 and SOT-89 Top View 1 2 3 TO-252 and TO-263 Top View 1 2 3

Ordering Information

www.SiliconStandard.com 2 of 12 Rev.2.02 12/06/2003 SS8026 Absolute Maximum Ratings (Note 1) Lead Temperature, Time for Wave Soldering Continuous Power Dissipation (TA = +25°C) SOT 89 (1) SOT 223(1) TO 252(1) Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1)

Electrical Characteristics

VIN =3.3V, I O = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX UNITS Output Voltage 10mA < IO < 1A 1.764 1.800 1.845 V Line Regulation 3V < VIN < 6.5V, IO = 10mA 3 30 mV Load Regulation 10mA < IO < 1A 30 50 mV Output Impedance 200mA DC and 100mA AC, fo = 120Hz 80 mΩ Quiescent Current VIN = 3.3V 480 µA Ripple Rejection fi = 120Hz,V ripple =1V P-P, Io = 100mA 53 dB IO = 0A 880 IO = 100mA 895 IO = 500mA 950 Dropout Voltage IO = 1A 1160 mV VIN = 3V(SOT 223) Minimum footprint (0.0625 square inch) 660 mA VIN = 3.3V(SOT 223) Mounted on 0.53 square inch pcb area 1 A Output Current Continuous Test, TA = 25°C, TJ 150°C, VOUT within ±2% VIN = 3.3V(SOT 89) Mounted on 0.16 square inch pcb area 0.5 A Short Circuit Current 1.6 A Over Temperature 150 °C Note 1: Absolute Maximum Ratings are limits beyond whic h damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guara n- teed specifications and test conditions see the Electrical Characteristics. Note 2: The maximu m power dissipation is a function of the maximum junction temperature, T Jmax , total thermal re- sistance, θ JA, and ambient temperature T A. The maximum allowable power dissipation at any ambient te m- perature is Tjmax-TA / θJA. If this dissipation is exceeded, tthe die temperature will rise above 150°C and the IC will go into thermal shutdown. For the SS8026 in SOT 89 package, θ JA is 250°C/W. For the SS8026 in SOT 223 package, θ JA is 156°C/W; in TO 252 package, θ JA is 125°C/W. (See recommend minimum footprint). The s afe operation in SOT 89, SOT 223, TO 252 package, can be seen in “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperatures as close to ambient as poss ible. Note4: The output capacitor should be a tantalum or aluminum type.

www.SiliconStandard.com 3 of 12 Rev.2.02 12/06/2003 SS8026 Definitions Dropout Voltage The input/output voltage differential at which the regu- lator output no longer maintains regulation against fu r- ther reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load cu r- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input volt- age. The measurement is made under condi tions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load cu r- rent at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation under which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.

www.SiliconStandard.com 4 of 12 Rev.2.02 12/06/2003 SS8026 Typical Performance Characteristics (VIN= +3.3V, C IN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Line Transient 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ground Current (mA) 200 400 600 800 1000 1200 1400 1600 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Dropout Voltage (mV) 1.700 1.720 1.740 1.760 1.780 1.800 1.820 1.840 1.860 1.880 1.900 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ootput Voltage (V) Output Voltage vs. Load Current Dropout Voltage vs. Load Current Line Transient Ground Current vs. Load Current

www.SiliconStandard.com 5 of 12 Rev.2.02 12/06/2003 SS8026 Typical Performance Characteristics (continued) Load Transient Load Transient Load Transient Load Transient

www.SiliconStandard.com 6 of 12 Rev.2.02 12/06/2003 SS8026 100 200 300 400 500 600 700 800 900 1000 1100 1200 Input-Output Voltage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Power Dissipation (W) Note: VIN(max) <= 6.5V 100 200 300 400 500 600 700 800 900 1000 1100 Input-Output Voltage Differential (V) Load Current (mA) Maximum Power Dissipation of SOT 223 Safe Operating Area of SOT 223 Safe Operating Area of SOT 223 0.1 0.2 0.3 0.4 0.5 0.6 0.7 25 35 45 55 65 75 85 95 105 115 125 Ambient Temperature (°C) Power Dissipation (W) 1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R£cJA=250°C/W) 100 200 300 400 500 600 700 Input-Output Voltage Differential VIN - VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J 1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R £cJA=250°C/W) Safe Operating Area of SOT-89 [Power Dissipation Limit] 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R £cJA=156°C/W) TA=25°C,Still Air Maximum recommended output current TA=25°C,Still Air Mounted on 1 square inch, 1oz copper pcb area (R£cJA=70°C/W) Mounted on 0.53 square inch, 1oz copper pcb area (R£cJA=85°C/W) Mounted on recommend minimum footprint, 1oz copper pcb area (See Recommend minimum footprint) (R £cJA=156°C/W) Note: VIN(max) <= 6.5V Maximum Power Dissipation of SOT-89 TA=25°C,Still Air 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£cJA=156°C/W)

www.SiliconStandard.com 7 of 12 Rev.2.02 12/06/2003 SS8026 Maximum Power Dissipation of TO 252Safe Operating Area of TO 252 Note: VIN(max) <= 6.5V 200 400 600 800 1000 1200 1400 Input-Output Voltaage Differential VIN-VOUT (V) Output Current (mA) TA=25¢J TA=55¢J TA=85¢J Maximum recommended output current 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R£cJA=125°C/W) TA=25°C,Still Air 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (¢J) Power Dissipation (W) Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum footprint (R£cJA=125°C/W) Recommend Minimum Footprint

www.SiliconStandard.com 8 of 12 Rev.2.02 12/06/2003 SS8026

Package Information

SOT-89 (T2) Package DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES SYMBOLS MIN NOM MAX MIN NOM MAX D E HE e b bb1 A POLISH MATTE FINISH C POLISH

www.SiliconStandard.com 9 of 12 Rev.2.02 12/06/2003 SS8026 TO-220 (T3) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336 0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565 E RE1 E1 D d I L e b b1e1 A F C

www.SiliconStandard.com 10 of 12 Rev.2.02 12/06/2003 SS8026 TO-252 (T4) Package MILLIMETERS INCHES SYMBOL MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 0.215 e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4° F A E D b e Ce1 H θ F A E D b e Ce1 H θ

www.SiliconStandard.com 11 of 12 Rev.2.02 12/06/2003 SS8026 TO-263 (T5) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.70 10.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAX e D H b E A C L e D H b E A C L

www.SiliconStandard.com 12 of 12 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expre ss or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. Rev.2.02 12/06/2003 SS8026 SOT-223 (T6) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC 0.090 BSC e1 4.60 BSC 0.181 BSC H 6.70 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC a 0º 10º 0º 10º Package Orientation on tape A B 13 °(4 X) e E D H C α 13°(4X) L Feed Direction