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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Ideal for automated placement
- Low power losses
- High forward surge capability
- Meets MSL level1, per J-STD-020, LF maximum peak of 260 °C Typical Applications For use in lighting, fast switching rectification of power suppliers, inverters, converters, and freewheeling diodes for consumer, and telecommunication. Mechanical Data
- Package:TO-277 Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant, Halogen free
- Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102 Surface Mount Schoky Recfier Reverse Voltage 100V , Forward Current 5A PIN1 PIN2 PIN3 C ASE SEMICONDUCTOR TECH NIC AL DATA SS5U100PA 2020. 03. 24 1/3Revision No : 0
■Thermal Characteristics (Ta=25℃ Unless otherwise specified) PARAMETER SYMBOL UNIT SS5U100PA Thermal Resistance Junction to Case RθJ-C ℃/W 8 ■ Characteristics (Typical) 50 100 150 1.0 2.0 3.0 4.0 5.0 Average Forward Output Current (A) Case Temperature ( FIG.1: Io-Tc Curve 2 10 20 100 100 150 8.3ms Sing e Half Since-Wave JEDEC Method Peak Forward Surge Current (A) Number of Cycles FIG.2: Forward Surge Current Capability 200 250 300 Instantaneous Forward Current (A) FIG 3: Forw ard Voltage Instantaneous Forw ard Voltage (V) 0.2 0.5 1.0 5.0 Ta=25℃ 0 20 40 60 80 100 0.0001 0.001 0.01 0.1 1 0 Tj=125 ℃ Tj=25℃ FIG.4: Typical Reverse C haracteristics Percent of Rat ed Peak Re verse Voltage (%) Instantaneous Reverse Current (mA) 2020. 03. 24 2/3Revision No : 0 SS5U100PA
■ Outline Dimensions TO-277 Dim Min(mm) Max(mm) A 3.9 4.1 B 1.7 1.9 C 6.4 6.6 D 5.3 5.5 E 0.8 1.0 F 1.8 1.9 G 0.35 0.45 H 1.10 1.20 I 4.1 4.5 J 1.5 1.9 ■ Suggested pad layout TO-277 Dim Min(mm) A 3.36 B 4.86 C 0.85 P 1.84 Q1 1.4 Q2 1.4 B A P C C D G E F HA B I J Bottom 2020. 03. 24 3/3Revision No : 0 SS5U100PA