SS52 WINNERJOIN | Alldatasheet
Document overview
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Technical content
Features
Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228
- Suffix "-H" indicates Halogen-free parts, ex. FΜ520-H. SS 52 SS53 SS54 -55 to +125 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I=5.0AF VF (V) SS 55 SS56 60 0.70 0.55 -55 to +1500.85 SS 58 SS510 100 100 5.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V O (C) Operating temperature T,J 0.272(6.9) 0.189(4.8) 0.165(4.2) 0.098(2.5) 0.075(1.9) Dimensions in inches and (millimeters) SMC SS 515 SS 520 150 105 150 200 140 200 0.92 0.90 PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Diode junction capacitance Storage temperature See Fig.1 8.3ms single half sine-wave (JEDEC methode) f=1MHz and applied 4V DC reverse voltage Symbol MIN. TYP. MAX. UNIT IO IFSM IR CJ TSTG A A mA O C pF 5.0 150 0.5 +175-65 O V = V T = 25CR RRM J O V = V T = 100CR RRM J 380 Maximum ratings and Electrical Characteristics (AT T=25A o C unless otherwise noted) Thermal resistance RθJA O C/W32Junction to ambient RθJC O C/W16Junction to case 66-66 Http:// www.wej.cn E-mail:wej@yongerjia.com WEJ ELECTRONIC CO./7'
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) 1.0 2.0 3.0 4.0 5.0 6.0 SS52~SS54 SS55~SS520 LEAD TEMPERATURE,(°C) 0 20 40 60 80 100 120 140 160 180 200 FIG.4-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(V) JUNCTION CAPACITANCE,(pF) 1000 1200 1400 800 600 400 200 .01 .05 .1 .5 1 5 10 50 100 FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 100 150 250 200 NUMBER OF CYCLES AT 60Hz 1 10 5 50 100 T=25 CJ 8.3ms Single Half Sine Wave JEDEC method PEAK FORWARD SURGE CURRENT,(A) FIG.5 - TYPICAL REVERSE CHARACTERISTICS REVERSE LEAKAGE CURRENT, (mA) 0.001 0.01 0.1 1.0 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) 20 40 60 80 100 20V~40V 50V~200V TJ=25°C TJ=100°C INSTANTANEOUS FORWARD CURRENT,(A) 0.1 1.0 .01 3.0 80V ~ 100V FIG.2-TYPICAL FORWARD 50V ~ 60V FORWARD VOLTAGE,(V) CHARACTERISTICS 20V ~ 40V Pulse Width 300us 1% Duty Cycle T=25 CJ 150V~200V 66-66 Http:// www.wej.cn E-mail:wej@yongerjia.com WEJ ELECTRONIC CO./7'
Pin Simplified outline Symbol Marking Type number Marking code SS52 SS52 SS53 SS53 SS54 SS54 SS55 SS55 SS56 SS56 SS58 SS58 SS510 S510 SS515 S515 SS520 S520 Suggeste d solder pad layout 1 2 Dimensions in inches and (millimeters) A C B B 0.063 (1.60) A 0.189 (4.80) C 0.158 (4.00) PACKAGE SMC 66-66 Http:// www.wej.cn E-mail:wej@yongerjia.com WEJ ELECTRONIC CO./7'
E B d F W PA D D1D2 C T Item Tolerance SMC Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 5.10 7.20 2.50 66-66 Http:// www.wej.cn E-mail:wej@yongerjia.com WEJ ELECTRONIC CO./7'
SMC 3,000 8.0 6,000 337*337*37 330 350*330*360 48,000 17.2 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) 13" Profile Feature Soldering Condition Average ramp-up rate(T L to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150C o -Temperature Max(Tsmax) 200C -Time(min to max)(t s) 60~120sec Tsmax to T L o -Ramp-upRate <3C/sec Time maintained above: o -Temperature(T L) 217C -Time(t L) 60~260sec o o Peak Temperature(T P) 255C-0/+5C o Time within 5C of actual Peak Temperature(t P) o Ramp-down Rate <6C/sec o Time 25C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25C to Peak Time TL TP Ramp-down Temperature 66-66 Http:// www.wej.cn E-mail:wej@yongerjia.com WEJ ELECTRONIC CO./7'