SS510LBG SKTECHNOLGY | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Metal silicon junction, majority carrier conduction
- For surface mounted applications
- Low power loss, high efficiency
- High forward surge current capability
- For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
- A MECHANICAL DATA Case: SMB Terminals: Solderable per MIL-STD-750, Method 2026 pprox. Weight: 0.055g / 0.002oz PINNING PIN
DESCRIPTION
Simplified outline SMB and symbol Top View Marking Code: SL510B SS510LBG 1 of 3 REV.08
Fig.2 Typical Reverse Characteristics Instaneous Current ( μA)Reverse 20 40 60 800 T =25J °C T =100J °C Percent of Rated Peak Reverse Voltage（%） 100 100 101 102 103 104 T =75J °C Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Reverse Voltage (V) Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) Fig.1 Forward Current Derating Curve 1.0 2.0 3.0 4.0 5.0 6.0 0.0 25 50 75 100 125 Average Forward Current (A) 0.01 100 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance（ /W）°C t, Pulse Duration（sec） 0.1 1 1010 100 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) 0.1 0 0.5 1.0 1.5 2.0 0.1 10 100 500 1001 1000 T =25J °C 100 160 Case Temperature (°C) 150 120 140 2 of 3 REV.08 SS510LBG
The recommended mounting pad size Unit：mm(mil) 3.0(118)1.8(71) 2.54(100) 1.8(71) PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMB PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMB E A D b L A C E1 V AM UNIT mm max min A CE D E1 L 0.8 1.5 b 1.9 2.2 mil max min 0.20 0.05 96 185 155 220 84 160 130 200 632 877.9 2.0 SMB mechanical data 3 of 3 REV.08 SS510LBG