SS22F SEMIPOWER | Alldatasheet

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Technical content

Features

  • Metal silicon junction, majority carrier conduction
  • For surface mounted applications
  • Low power loss, high efficiency
  • High forward surge current capability
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications MECHANICAL DATA
  • Case: SMAF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • 27mg / 0.00095ozApprox. Weight: Top View Marking Code: SS22 — SS220 0.5 T = 25°Ca T =100°Ca IR 0.3 1 2 80Typical Thermal Resistance °C/WRθJA Page 1 of 3 SS22F THRU SS220F （1） （2） Measured at 1 MHz and applied reverse voltage of 4 V D.C （2） （1） Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. 2016 Rev 1.0

Fig.4 Typical Junction Capacitance 0.1 Junction Capacitance ( pF) Reverse Voltage (V) 100 200 500 1001 SS22F/SS24F SS26F-SS220F T =25J °C 0.1 0 0.4 1.4 Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) 1.0 SS22F/SS24F SS26F/SS28F SS210F/SS212F SS215F/SS220F Fig.1 Forward Current Derating Curve 0.5 1.0 1.5 2.0 2.5 3.0 0.0 25 50 75 100 125 150 Average Forward Current (A) Single phase half-wave 60 Hz resistive or inductive load 10 1001 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) SS22F-SS28F SS210F-SS220F Fig.2 Typical Reverse Characteristics Instaneous Current ( μA)Reverse 20 40 60 800 T =25J °C T =100J °C Percent of Rated Peak Reverse Voltage（%） 100 100 101 102 103 104 T =75J °C SS22F/SS24F SS26F-SS220F Page 2 of 3 0.01 100 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance（ /W）°C t, Pulse Duration（sec） 0.1 1 10 Case Temperature (°C) SS22F THRU SS220F Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. 2016 Rev 1.0

Plastic surface mounted package; 2 leads SMAF A C ∠ALL ROUND V AM e UNIT mm max min mil max min 7.9 4.7 146 130 106 193 173 A C D E HE ∠ 1.6 1.3 e Bottom View HE g Top View 1.2 0.8 g g ∠ALL ROUND E D A E pad pad The recommended mounting pad size 2.2 (86) 1.6 (63) 1.8 (71) 1.6 (63) Unit ：mm (mil) SS22F THRU SS220F Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. 2016 Rev 1.0