SS22_14 TSC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
- Low power loss, high efficiency - Ideal for automated placement - Guardring for overvoltage protection - High surge current capability - Halogen-free according to IEC 61249-2-21 definition Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test V RRM 20 30 40 50 60 90 100 150 V VRMS 14 21 28 35 42 63 70 105 V VDC 20 30 40 50 60 90 100 150 V IF(AV) A dV/dt V/ μs TJ OC TSTG OC Document Number: D1307005 Version: H13 DO-214AA (SMB)Case: DO-214AA (SMB)
FEATURES
Polarity: Indicated by cathode band SS22 thru SS215 Surface Mount Schottky Barrier Rectifier Taiwan Semiconductor MECHANICAL DATA - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Moisture sensitivity level: level 1, per J-STD-020 Maximum average forward rectified current MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) SS SS SS PARAMETER SYMBOL SS 210 Note 1: Pulse test with PW=300μs, 1% duty cycle Operating junction temperature range Storage temperature range mA Voltage rate of change (Rated VR) Maximum reverse current @ rated VR TJ=25 ℃ TJ=100℃ TJ=125 ℃ 10 5 - 55 to +150 0.4 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage 0.5 0.4 0.70 0.65 IR Weight: 0.093 g (approximately) OC/W 10000 0.85 0.70 V A 0.1 0.95 0.80 - 55 to +125 - 55 to +150 Maximum DC blocking voltage Typical thermal resistance RθJL RθJA Maximum instantaneous forward voltage (Note 1) IF= 2 A @ 25℃ IF= 2 A @ 100℃ VF
PART NO. PART NO. SS26 SS26 SS26 (TA=25℃ unless otherwise noted) Document Number: D1307005 Version: H13 SS22 thru SS215 Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE GREEN COMPOUND CODE PACKAGE PACKING SS2xx (Note 1) Prefix "H" Suffix "G" SMB 850 / 7" Plastic reel R4 SMB 3,000 / 13" Paper reel M4 SMB 3,000 / 13" Plastic reel Note 1: "xx" defines voltage from 20V (SS22) to 150V (SS215) EXAMPLE AEC-Q101 qualified PREFERRED P/N AEC-Q101 QUALIFIED PACKING CODE GREEN COMPOUND CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES SS26 R5G R5 G Green compound SS26HR5 H R5 0.0 0.5 1.0 1.5 2.0 2.5 50 60 70 80 90 100 110 120 130 140 150 160 AVERAGE FORWARD a CURRENT (A) LEAD TEMPERATURE .(oC) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE SS22-SS24 SS25-SS215 RESISTIVE OR INDUCTIVE LOAD 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 2- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine Wave JEDEC Method 0.001 0.01 0.1 100 0 20 40 60 80 100 120 140 INSTANTANEOUS REVERSE A CURRENT (mA) PERCENT OF RATED PEAK REVERSE VOLYAGE(%) FIG. 4- TYPICALREVERSE CHARACTERISTICS TJ=25℃ TJ=75℃ TJ=125℃ SS22-SS24 SS25-SS215 0.1 100 INSTANTANEOUS FORWARD A CURRENT (A) FORWARD VOLTAGE. (V) FIG. 3- TYPICAL FORWARD CHARACTERISTICS SS22-SS24 SS25-SS26 SS215 SS29-SS210 PULSE WIDTH=300μs 1% DUTY CYCLE
A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: D1307005 Version: H13 Symbol Unit (mm) 2.3 B E6 . 8 2.5 C SUGGESTED PAD LAYOUT SS22 thru SS215 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) A 4.3 D1 . 8 MARKING DIAGRAM Unit (inch) 0.091 0.098 0.169 0.071 0.268 100 1000 0.1 1 10 100 JUNCTION CAPACITANCE (pF) a REVERSE VOLTAGE (V) FIG. 5- TYPICAL JUNCTION CAPACITANCE SS29-SS215 SS22-SS24 SS25-SS26 f=1.0MHz Vsig=50mVp-p
assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: D1307005 Version: H13 SS22 thru SS215 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,