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Bruckewell Technology Corp., Ltd. High Current Density Surface Mount Schottky Rectifier SS15P50 FEATURES Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Conform to JEDEC TO-277A Molding compound meets UL 94 V-0 flammability Maximum Ratings (Tc=25°C unless otherwise noted) Parameter Symbol SS15P50 Unit Maximum repetitive peak reverse voltage VRRM 50 V Working peak reverse voltage VRWM 35 V Maximum DC blocking voltage VDC 50 V Maximum average forward rectified current Total device IF(AV) 15 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 300 A Non-repetitive avalanche energy at 25 °C IAS = 2 A per diode EAS 20 m'J Operating junction temperature range TJ -55 to +150 °C Storage temperature range TSTG -55 to +150 °C Note: (1) Mounted on 30 mm x 30 mm Al P.C.B. with 50 mm x 25 mm x 100 mm fin heat sink (2) Free air, mounted on recommended copper pad area
Bruckewell Technology Corp., Ltd. Electrical characteristics (Tc=25°C unless otherwise noted) Parameter Symbol Value Unit Typical Max Instantaneous forward voltage at IF=15A, Tj=25°C 0.53 0.56 at IF=15A, Tj=125°C VF 0.50 V Maximum reverse current Tj=25°C 300 u'A at working peak reverse voltage Tj=125°C IR 50 m'A Thermal characteristics (Tc=25°C unless otherwise noted) Parameter Symbol Value Unit RθJA 60 Typical thermal resistance Rthjc 3 °C/W Notes: (1) Pulse test: 300 µs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms
Bruckewell Technology Corp., Ltd. Characteristics Curve