SS1060BG SKTECHNOLGY | Alldatasheet

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Technical content

Surface Mount Schottky Barrier Rectifier Reverse Voltage - 60 to 100V Forward Current - 10A

FEATURES

  • Metal silicon junction, majority carrier conduction
  • For surface mounted applications
  • Low power loss, high efficiency
  • High forward surge current capability
  • For use in low voltage, high frequency inverter, free wheeling, and polarity protection applications Absolute Maximum Ratings and Electrical characteristics Ratings at ambient temperature unless otherwise specified.Single phase, half wave, 60Hz resistive or inductive load, for capacitive load, derate by 20 % 25 °C 1, 2,Cathode Anode Maximum DC Blocking Voltage Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Maximum Average Forward Rectified Current V V V -55 ~ +150 A A V mA Units Peak Forward Surge Current,8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) Max Instantaneous Forward Voltage @10 A Maximum DC Reverse Current at Rated DC Reverse Voltage Operating Junction Temperature Range T = 25°Ca T =100°Ca VRRM VRMS VDC IF(AV) IFSM VF IR Tj Symbols TstgStorage Temperature Range 0.75 0.90 -55 ~ +150 °C 100 100 0.5 20(1)Typical Thermal Resistance RθJA °C/W 150 SS1060BG SS10100BG MECHANICAL DATA Case: SMB Terminals: Solderable per MIL-STD-750, Method 2026 pprox. Weight: 0.1g / 0.0034oz
  • A SS1060BG THRU SS10100BG 1 of 3 REV.08 Package :SMB

Fig.2 Typical Reverse Characteristics Instaneous Current ( mA)Reverse 20 40 60 800 T =25J °C Percent of Rated Peak Reverse Voltage（%） 100 100 1000 T =100J °C Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) Fig.1 Forward Current Derating Curve 2.0 4.0 6.0 8.0 10.0 12.0 0.0 25 50 75 100 125 Average Forward Current (A) 0.01 100 100 Fig.4- Typical Transient Thermal Impedance Transient Thermal Impedance（ /W）°C t, Pulse Duration（sec） 0.1 1 10 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) 0.1 0 0.5 1.0 1.5 2.0 SS1060BG SS10100BG 125 180 Case Temperature (°C) 150 150 100 175 SS1060BG THRU SS10100BG 2 of 3 REV.08

Plastic surface mounted package; 2 leads SMB PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMB E A D b L A C E1 V AM UNIT mm max min A CE D E1 L 0.8 1.5 b 1.9 2.2 mil max min 0.20 0.05 96 185 155 220 84 160 130 200 632 877.9 2.0 SMB mechanical data The recommended mounting pad size Unit ：mm (mil) 2.2 (86) 2.8 (110) 2.4 (94) 2.4 (94) SS1060BG THRU SS10100BG 3 of 3 REV.08