MURD620CT_V01 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
- Ultrafast 35 Nanosecond Recovery Time
- Low Forward V oltage Drop
- Low Leakage
- ESD Rating: ♦ Human Body Model = 3B (> 8 kV) ♦ Machine Model = C (> 400 V)
- NRVUD, SRVUD and SNRVUD Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECïQ101 Qualified and PPAP Capable
- These Devices are PbïFree, Halogen Free/BFR Free and are RoHS Compliant Mechanical Characteristics:
- Case: Epoxy, Molded
- Weight: 0.4 Gram (Approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ULTRAFAST RECTIFIER
6.0 AMPERES
200 VOLTS
www.onsemi.com DPAK CASE 369C MARKING DIAGRAMS Device Package Shipping
ORDERING INFORMATION
(PbïFree) 2,500 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D. MURD620CTG DPAK (PbïFree)
75 Units / Rail
A = Assembly Location* Y = Year WW = Work Week U620T = Device Code (MURD/NRVUD/ SNRVUD620CT) US620T = Device Code (SRVUD620CT) G = Pb ïFree Package AYWW U 620TG NRVUD620CTG DPAK (PbïFree) (PbïFree) 2,500 / Tape & Reel AYWW U S620TG SRVUD620CTT4G DPAK (PbïFree) 2,500 / Tape & Reel SNRVUD620CTT4G DPAK (PbïFree) 2,500 / Tape & Reel NRVUD620CTGï VF01 DPAK (PbïFree) 2,500 / Tape & Reel * The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank.
MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT www.onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (TC = 140°C) Per Diode Per Device IF(AV) 3.0 6.0 A Peak Repetitive Forward Current (Square Wave, Duty = 0.5, TC = 145°C) Per Diode IF 6.0 A NonïRepetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM A Operating Junction and Storage Temperature Range TJ, Tstg ï65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS (Per Diode) Characteristic Symbol Value Unit Thermal Resistance, JunctionïtoïCase R/C0113JC 9 °C/W Thermal Resistance, JunctionïtoïAmbient (Note 1) R/C0113JA 80 °C/W 1. Rating applies when surface mounted on the minimu m pad sizes recommended. ELECTRICAL CHARACTERISTICS (Per Diode) Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage Drop (Note 2) (iF = 3 Amps, TC = 25°C) (iF = 3 Amps, TC = 125°C) (iF = 6 Amps, TC = 25°C) (iF = 6 Amps, TC = 125°C) vF 0.96 1.2 1.13 V Maximum Instantaneous Reverse Current (Note 2) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR 250 /C0109A Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps//C0109s, VR = 30 V, TJ = 25°C) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C) trr ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 /C0109s, Duty Cycle ≤ 2.0%.
Figure 6. Typical Capacitance (Per Leg)
DPAK (SINGLE GAUGE) CASE 369C ISSUE F DATE 21 JUL 2015 SCALE 1:1 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2 STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 1 2 STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE STYLE 9: PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE STYLE 10: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE b D E M0.005 (0.13) C A c C Z DIM MIN MAX MIN MAX MILLIMETERS INCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L4 ïïï 0.040 ïïï 1.01 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 Z 0.155 ïïï 3.93 ïïï NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. 1 2 3 XXXXXX = Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb ïFree Package AYWW XXX XXXXXG XXXXXXG ALYWW Discrete IC 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 /C0466mm inches/C0467SCALE 3:1 GENERIC MARKING DIAGRAM* *For additional information on our PbïFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC HDETAIL A SEATING PLANE A B C L H L2 GAUGE PLANE DETAIL A ROTATED 90 CW/C0053 e BOTTOM VIEW Z BOTTOM VIEW SIDE VIEW TOP VIEW ALTERNATE CONSTRUCTIONS NOTE 7 Z *This information is generic. Please refer to device data sheet for actual part marking. PbïFree indicator, G or microdot /C0071, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON10527DDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped CONTROLLED COPY in red. PAGE 1 OF 1DPAK (SINGLE GAUGE) onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. Semiconductor Components Industries, LLC, 2018 www.onsemi.com
onsemi, , and other names, marks, and brands are registe red and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemis product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentïMarking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided asïis and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800ï282ï9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative