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Technical content

Features

  • ESD, IEC6100 0-4-2, ±20kV contact, ±30kV air
  • EFT , IEC61000-4-4, 40A (5/50ns)
  • Lightning, IEC6100 0-4-5, 10A (8/20μs)
  • Low capacitance of 2pF (TYP) per I/O
  • Low leakage current of 0.5μA (MAX) at 5V
  • Small SOT23-6 (JEDEC MO-178) packaging
  • LCD/PDP TVs
  • Monitors
  • Notebooks
  • 10/100/1000 Ethernet
  • Firewire
  • Set Top Boxes
  • Flat Panel Displays
  • Portable Medical Pinout I/O 1 GND I/O 2 I/O 4 VCC I/O 3 Functional Block Diagram 1 2 3 6 5 4 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Examples VBUS VBUS VBUS VBUS D + D + D - D - GND GND CT RT RT RT RT CT CT CT USB Port USB Port USB Controller VBUS SRV05-4HTG USB Dual Port Protection VCC Ethernet PHY TX + TX - RX + RX - VCC GND SRV05-4HTG TX + TX - RX + RX - Unused Unused Unused RJ45 Unused To Twisted-Pair Network 75 75 75 75 10/100 Ethernet Differential Protection VCC 10/100/1000 Ethernet PHY TX + TX - RX + RX - VCC GND TX + TX - RX + RX - Unused Unused Unused RJ45 Unused To Twisted-Pair Network 75 75 75 75 10/100/1000 Ethernet Protection SRV05-4HTG SRV05 Series 6V 10A Diode Array

©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: February 15, 2012 SRV05 Series Low Capacitance ESD Protection - SRV05 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1Non-repetitive pulse per waveform on page 3 Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs)1 10 A PPK Peak Pulse Power (tp=8/20μs) 150 W TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 6.0 V Reverse Voltage Drop VR IR = 1mA 8.0 V Reverse Leakage Current ILEAK VR=5V 0.1 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, I/O to GND2 8.8 10.0 V IPP=5A, tp=8/20µs, I/O to GND2 11. 5 13.0 V IPP=8A, tp=8/20µs, I/O to GND2 13.2 15.0 V Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.7 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 2.4 3.0 pF Reverse Bias=1 .65V 2.0 pF Diode Capacitance1 CI/O-I/O Reverse Bias=0V 1. 2 pF Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. Clamping Voltage vs. IPP 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1 2 3 4 5 6 7 8 9 10 Peak Pulse Current-IPP (A) Clamp Voltage (VC ) Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.

3©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: February 15, 2012 SRV05 SRV05 Series Low Capacitance ESD Protection - SRV05 Series Pulse WaveformCapacitance vs. Reverse Bias 0.0 0.5 1.0 1.5 2.0 2.5 3.0 DC Bias (V) Capacitance (pF) VCC=Float VCC =5V VCC =3.3V 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone T L to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters

Ordering Information

Part Number Package Marking Min. Order Qty. SRV05-4HTG SOT23-6 L*4 3000 Part Numbering System Part Marking System SRV05 4 H T G Series Number of Channels Package H: SOT23-6 T= Tape & Reel G= Green L*4 L * 4 Product Series L = SRV05 Number of Channels Assembly Site (Varies) L = S (Varies)

©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: February 15, 2012 SRV05 Series Low Capacitance ESD Protection - SRV05 Series Embossed Carrier T ape & Reel Specification — SOT23-6 8mm TAPE AND REEL GENERAL INFORMA TION 1. 3000 PIECES PER REEL. 2. ORDER IN MUL TIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 2.0mm 4.0mm CL 1.75mm1.5mm DIA. HOLE 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm ACCESS HOLE COVER TAPE USER DIRECTION OF FEED PIN 1 SOT-23 (8mm POCKET PITCH) Pins 6 JEDEC MO-178 Millimeters Inches Notes Min Max Min Max A 0.900 1 .450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1 .300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1 .500 1 .750 0.06 0.069 3 e 0.95 Ref 0.037 4 ref - e1 1 .9 Ref 0.07 48 Ref - L 0.100 0.600 0.004 0.023 4,5 N 6 6 6 a 0º 10º 0º 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - O P R M Recommended Solder Pad Layout Notes: 1 . Dimensioning and tolerances per ANSI 14.5M-1 982. 2. Package conf orms to EIAJ SC-7 4 (1992). 3. Dimensions D and E1 are exclusiv e of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L ” is the length of flat f oot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7 . Controling dimension: MILLIMETER. Conv erted inch dimensions are not necessarily exact.