MAX18000 AD | Alldatasheet

Document overview

  • PDF pages: 17

Technical content

Click here to ask an associate for production status of specific part numbers. MAX18000 500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown 19-101651; Rev 0; 2/23 © 202 3 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. General Description The MAX18000 is a nanoPower boost converter with an input voltage range of 0.5V to 5.5V (VOUT > VIN + 0.2V) and a switching current limit of 3.6A. It features an ultra- low quiescent current of 512nA which makes it ideal for battery-powered applications requiring a long standby time. The IC operates in nanoPower mode at low loads and transitions into skip and CCM modes of operation at higher load currents to ensure high efficiency over a wide current range. The output voltage can be varied between 2.5V and 5.5V using a single RSEL resistor. The IC features a True Shutdown™ mode, which disconnects V IN and VOUT when the EN pin is pulled low. It also features short -circuit protection circuitry that limits the current to 700mA when V OUT < 0.5V and automatically restarts the part when the fault is removed. The thermal-shutdown protection disables the part when the junction temperature crosses +165°C (typ). The IC is available in 1.07mm x 1.57mm, 6-bump wafer- level package (WLP). Benefits and Features

  • 0.5V to 5.5V Input Voltage (VOUT > VIN + 0.2V)
  • 1.8V Minimum Start-Up Voltage
  • 2.5V to 5.5V (In 100mV Steps) Output Voltage
  • 3.6A Cycle-by-Cycle Inductor Current Limit
  • 512nA IQ Supply Current into the Output
  • True-Shutdown Mode - 7nA Shutdown Current - Output Disconnects from Input with no Forward or Reverse Current
  • Output Short-Circuit Protection
  • Thermal-Shutdown Protection
  • 95% Peak Efficiency with 90% or Higher Efficiency for Load > 20µA
  • 1.07mm x 1.57mm, 0.5mm Pitch 6-Bump WLP
  • -40°C to +125°C Operating Temperature Range Key Applications
  • Wearable Applications
  • IoT Applications
  • Battery-Powered Applications
  • Portable Devices
  • Metering Applications Ordering Information appears at end of data sheet. Simplified Application Diagram RSEL OUT RSEL IN LX EN GND 0.5V TO 5.5V DC SOURCE VOUT 2.5V TO 5.5V MAX18000 LOW (OFF) HIGH (ON) L CIN 10V, X5R, 0603, 22µF COUT 10V, X5R, 0603, 2 x 22µF L 2.0mm x 1.5mm 6.35mm RSEL 0402 CIN 0603 COUT 0603 COUT 0603 5.1mm

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 2 Absolute Maximum Ratings Continuous Power Dissipation (TA = +70 °C (derate Note 1: LX pin has internal clamps to GND and OUT. These diodes may be forward biased during switching transitions. During these transitions, the max LX current should be within the Max RMS Current rating for safe operation. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to abs olute maximum rating conditions for extended periods may affect device reliability.

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 3 Recommended Operating Conditions PARAMETER SYMBOL TYPICAL RANGE Input Voltage Range VIN 0.5V to 5.5V Switching Current Limit IPEAK_LX 0A to 3.6A Operating Junction Temperature TJ -40°C to +125°C

Package Information

Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 81.03°C/W Junction to Case Thermal Resistance (θJC) NA S S S S S R T I T I TT I SI I S S R

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 4

Electrical Characteristics

(VIN = 3V, VOUT = 3.3V, EN = HIGH, TJ = -40°C to +125°C, unless otherwise specified, (Note 2).) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage Range VIN Input Range after start-up (Note 3) 0.5 5.5 V Input Voltage UVLO VIN_UVLO VIN Rising, When VOUT is 1V or below 1.75 1.8 1.85 V VIN Falling, When VOUT is 1V or below 1.65 1.7 1.75 Supply Current Into OUT IQ_OUT VEN = VIN, Not Switching, VOUT = 105% of Target Voltage, TJ = +25°C, RSEL = 191KΩ 512 800 nA Supply Current Into IN IQ_IN VEN = VIN, Not Switching, VOUT = 105% of Target Voltage, TJ = +25°C -100 +10 +100 nA Input Shutdown Current ISD_IN VEN = VOUT = 0V, TJ = +25°C 7 36 nA LX Maximum Duty Cycle DC_NPWR TJ = +25°C (Note 4) 85 % POWER SWITCHES High-Side RDSON RDS_H 60 90 mΩ Low-Side RDSON RDS_L 30 60 mΩ OUTPUT VOLTAGE Output Voltage Range VOUT (Note 3, Note 8) 2.5 5.5 V Output Accuracy VOUT_ACC Measured when the part exits nanoPower Mode and is in Skip Mode (Note 5) -1 +1 % DC Load Regulation ACCLOAD Load from 20mA to IOUT at 80% of Peak Inductor Current -1 % DC Line Regulation ACCLINE Duty Cycle varied from 25% to Maximum -1 % LX SWITCHING WAVEFORMS Switching Frequency FSW VIN = 3.3V, VOUT - VIN > 0.25V, PWM mode, TJ = 25°C 2 MHz LX TON TON_3.3V VIN = 3.3V, VOUT = 5V 136 170 204 ns TON_1.8V VIN = 1.8V, VOUT = 5V 256 320 384 LX Minimum TON TONMIN VIN = 3V, VOUT = 3.3V 50 60 70 ns LX Minimum TOFF TOFFMIN VIN = 3V, VOUT = 3.3V 50 60 70 ns LIGHT LOAD CONDITION Zero-Crossing Threshold IZX_LX (Note 6) 75 150 225 mA nanoPower regulation Hysteresis VNPWR_HYS VIN = 3V, VOUT = 3.3V (Note 9) 66 83 132 mV STARTUP Soft-Start Time tSS_LINEAR Target VIN = VOUT = 3.6V, Linear Mode, COUTEFF = 22μ , TJ = 25°C In linear phase 350 µs Soft-Start Rate dV/dt VIN = 3.6V, VOUT from 3.3V to 5V, COUTEFF = 22μ , TJ = 25°C In boost phase 3 V/ms ENABLE, RSEL, ACTIVE DISCHARGE Required Select Resistor Accuracy ACCRSEL Use the resistor from RSEL Selection Table. ±1 %

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 5 (VIN = 3V, VOUT = 3.3V, EN = HIGH, TJ = -40°C to +125°C, unless otherwise specified, (Note 2).) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Select Resistor Detection Time tRSEL CRSEL < 2pF, (Note 7) 600 1320 µs Active Discharge Resistance RDIS Between OUT and GND, when EN = low 100 Ω Enable Input Leakage ILEAK_EN TJ = 25°C, VEN = 5.5V 1.5 100 nA Enable Voltage Threshold VIH VEN rising, LX begins switching 0.8 1.2 V VIL VEN falling, LX stops switching 0.4 PROTECTION Inductor Peak Current Limit IPEAK_LX VOUT = 3.3V (Note 6) 3 3.6 4 A Short Circuit Current Limit ISC VIN = VEN = 2.5V, VOUT < 0.5V, VOUT Hysteresis = 100mV 400 700 1000 mA Short Circuit Detection Time tSC VIN – VOUT = 0.7V 100 ns Thermal Shutdown Threshold TSHUT_R TJ Rising 165 ˚C TSHUT_F TJ Falling 150 Note 2: Limits over the specified operating temperature and supply voltage range are guaranteed by design and characterization, and production is tested at room temperature only. Note 3: VIN should be at least 200mV lower than VOUT, so that part operates in boost mode. Note 4: Guaranteed by measuring LX frequency and duty cycle. Maximum duty cycle is a function of input voltage since LX on time varies with VIN. Note 5: This does not account for ripple, load regulation, and line regulation. Note 6: This is a static measurement. The actual peak current limit and zero-crossing threshold depend on VIN and L due to propagation delays. Note 7: This is the time required to determine the RSEL value. This time adds to the startup time. Note 8: nanoPower is disabled when OUT regulation is set above 5V. Note 9: The 83mV (typical) was measured at 3.3VIN, 3.3VOUT. The regulation hysteresis is typically set to 2.5% of the output voltage for other VOUT levels. The hysteresis measurement does not account for ripple.

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 6 Typical Operating Characteristics (VIN = 3.6V, VOUT = 5V, L = 470nH (DFE201612E-R47M for VOUT = 5V) and 330nH (DFE201612E-R33M for VOUT = 3.3V), COUT = 2 x 22µF (C1608X5R1A226M080AC), TA = +25°C unless otherwise noted. Measurement is limited by switching the current limit. Actual maximum output current depends on system thermal performance.)

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 7 (VIN = 3.6V, VOUT = 5V, L = 470nH (DFE201612E-R47M for VOUT = 5V) and 330nH (DFE201612E-R33M for VOUT = 3.3V), COUT = 2 x 22µF (C1608X5R1A226M080AC), TA = +25°C unless otherwise noted. Measurement is limited by switching the current limit. Actual maximum output current depends on system thermal performance.)

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 8 (VIN = 3.6V, VOUT = 5V, L = 470nH (DFE201612E-R47M for VOUT = 5V) and 330nH (DFE201612E-R33M for VOUT = 3.3V), COUT = 2 x 22µF (C1608X5R1A226M080AC), TA = +25°C unless otherwise noted. Measurement is limited by switching the current limit. Actual maximum output current depends on system thermal performance.)

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 9 Pin Configuration LX IN EN RSELGNDOUT A B 1 2 3 TOP VIEW (BUMP SIDE DOWN) MAX18000

6 WLP

(1.07mm x 1.57mm x 0.5mm) Pin Descriptions PIN NAME FUNCTION Type A1 LX Switching Node. Connect the inductor (See the Inductor Selection section for more information) from LX to IN. Power A2 IN Input in. Connect a 22μ X7R ceramic capacitor from IN to ground. Depending on the specific application requirements, more capacitance may be needed. Power A3 EN Enable Input Pin. Force this pin to higher than 1.2V to enable the boost converter. Force this pin below 0.4V to disable the part and enter True Shutdown Mode. Digital B1 OUT Output Pin. Connect a 2 x 22μ X7R ceramic capacitor from OUT to GND. Power B2 PGND Power Ground. Connect to System GND Ground B3 RSEL Output Voltage Select Pin. Connect a resistor from RSEL to GND based on the desired output voltage. See Table 1 for more information. RSEL floats in shutdown. Care must be taken that the total capacitance on this pin should be less than 2pF. Analog

Figure 1. MAX18000 Simplified Block Diagram

GND. For the part to operate in boost mode, it is essential to keep the VIN level at least 200mV below the VOUT level. (CCM). In nanoPower mode, the part deactivates the error amplifier and other internal blocks to lower IQ. the system and the device itself.

  • Lower cost and smaller size, since only one resistor is needed versus the two resistor strings ne eded in typical feedback connections.
  • No power loss through feedback resistors during operation, leading to higher efficiency.
  • Allows customers to stock just one part in their inventory system and use it in multiple projects with different output voltages just by changing a single standard 1% resistor.

Table 1. RSEL Selection Table

*nanoPower mode disabled for VOUT > 5V. **Use a standard 1% resistor at RSEL pin. PMOS slew phase typically takes about 350µs. Figure 2. Soft-Start Behavior discontinuous conduction mode (DCM), the on-time is adjusted depending on the input voltage and target output voltage.

current at which the temperature rises appreciably) based on the expected load current. Table 2. Inductor and Output Capacitance Values vs. Output Voltage *The effective capacitance for all voltage levels can be achieved using 2 x 22µF, X5R, 0603 capacitors. Table 3. Inductor Recommendations

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 15 Input Capacitor Selection or most applications, bypass the I pin with a 10 22μ nominal ceramic input capacitors (C IN) that maintain 5μ or higher effective capacitance at its working voltage. Effective CIN is the actual capacitance value seen from the converter input during operation. Larger values improve decoupling for the converter but increase the inrush current from the voltage supply when connected. CIN reduces the current peaks drawn from the input power source and reduces switching noise in the system. The ESR/ESL of C IN and its series C trace should be very low (i.e., < 15mΩ + < 2nH) for frequencies up to the converter's switching frequency. Pay special attention to the capacitor's voltage rating, initial tolerance, variation with temperature, and DC bias characteristic when selecting the CIN. Ceramic capacitors with X7R dielectrics are highly recommended due to their small size, low ESR, and small temperature coefficients. All ceramic capacitors derate with DC bias voltage (effective capacitance goes down as DC bias goes up). Generally, smaller case -size capacitors derate more heavily compared to larger case sizes (0603 case size performs better than 0402). Consider the effective capacitance value carefully by consulting the manufacturer's data sheet. Refer to Tutorial 5527 for more information. Output Capacitor Selection Sufficient output capacitance (C OUT) is required for the stable operation of the conv erter. For minimum effective output capacitances for different output voltage targets are shown in Table 2. Effective C OUT is the actual capacitance value seen by the converter output during operation. Larger values (above the required effective minimum) improve load transient performance but increase input surge currents during soft -start and output voltage changes. The output filter capacitor must have a low enough ESR for frequencies up to the converter's switching frequency to meet output ripple and load transient requirements. The output capacitance must be high enough to absorb the inductor energy while transitioning from full-load to no-load conditions. or most applications, 2 x 22μ capacitors (10 DC) are recommended for COUT. Pay special attention to the capacitor's voltage rating, initial tolerance, variation with temperature, and DC bias characteristic when selecting COUT. Ceramic capacitors with X7R dielectrics are highly recommended due to their small size, low ESR, and small temperature coefficients. All ceramic capacitors derate with DC bias voltage (effective capacitance goes down as DC bias goes up). Generally, smaller case -size capacitors derate more heavily compared to larger case sizes (0603 case size performs better than 0402). Consider the effective capacitance value carefully by consulting the manufacturer's data sheet. Refer to Tutorial 5527 for more information. Other Required Component Selection The resistor between the R SEL pins and GND should have a tolerance of ±1% for the internal ADC to read the value accurately. PCB Layout Guideline Careful circuit board layout is critical to achieve low switching power loss and clean, stable operation. Use the following guidelines when designing the PCB:

  • Place the input capacitors (CIN) and output capacitors (COUT) immediately next to the IN pin and OUT pin of the IC, respectively. Since the IC operates at a high switching frequency with fast LX edges, this placement is critical for minimizing parasitic inductance within the input and output current loops, which can cause high voltage spikes and damage the internal switching MOSFETs.
  • Place the inductor next to the LX bumps (as close as possible) and make the traces between the LX bumps and the inductor short and wide to minimize PCB trace impedance. Excessive PCB impedance reduces conv erter efficiency. When routing LX traces on a separate layer, make sure to include enough vias to minimize trace impedance. Routing LX traces on multiple layers is recommended to further reduce trace impedance. Furthermore, do not make LX traces take up an excessive amount of area. The voltage on this node switches very quickly, and an additional area creates more radiated emissions.
  • Connect the inner GND bumps to the low -impedance ground plane on the PCB with vias placed next to the bumps. Do not create GND islands, as they risk interrupting the hot loops.
  • Keep the power traces and load connections short and wide. This is essential for high converter efficiency.
  • Do not neglect ceramic capacitor DC voltage derating. Choose capacitor values and case sizes c arefully. See the Output Capacitor Selection section and refer to Tutorial 5527 for more information.

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000 www.analog.com Analog Devices | 16 GND OUT EN 0402 0603 LEGEND VIAS 0805 COUT COUT RSEL CIN L LX IN Figure 5. PCB Layout Recommendation for WLP Package

Ordering Information

PART NUMBER TEMPERATURE RANGE PACKAGE FEATURES MAX18000AWT+T -40°C to +125°C 6-Bump WLP, 1.05mm x 1.55mm 3.6A IPEAK, nanoPower PFM mode, True Shutdown/Active Discharge +Denotes lead(Pb)-free/RoHS packaging. T = Tape and reel

500mV to 5.5V Input nanoPower Boost Converter with Short-Circuit Protection and True Shutdown MAX18000

Revision History

0 2/23 Release for Market Intro — Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. w w w . a n a l o g . c o m Analog Devices | 17